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H01L2224/8314

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8314Guiding structures outside the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 12,009,339
- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 11,990,447
- Issue date May 21, 2024
- Mitsubishi Electric Corporation
- Isao Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including anisotropic conductive film and method of...
- Patent number 11,864,437
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 11,458,717
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
- Patent number 11,380,648
- Issue date Jul 5, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Léa Di Cioccio
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,222,874
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 11,211,355
- Issue date Dec 28, 2021
- Mitsubishi Electric Corporation
- Isao Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having continously formed tapered prot...
- Patent number 11,164,756
- Issue date Nov 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a carrier with components, pigment for assemb...
- Patent number 11,127,890
- Issue date Sep 21, 2021
- OSRAM OLED GmbH
- Andreas Ploessl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,101,244
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,930,819
- Issue date Feb 23, 2021
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
- Publication number 20240258270
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Sunghwan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20240186298
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module having a double-sided heat dissipation structu...
- Publication number 20240096720
- Publication date Mar 21, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20230197673
- Publication date Jun 22, 2023
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...
- Publication number 20220415847
- Publication date Dec 29, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220271004
- Publication date Aug 25, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20220216172
- Publication date Jul 7, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING ANISOTROPIC CONDUCTIVE FILM AND METHOD OF...
- Publication number 20220199743
- Publication date Jun 23, 2022
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20220130807
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220059496
- Publication date Feb 24, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20220013493
- Publication date Jan 13, 2022
- Mitsubishi Electric Corporation
- Isao OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20210202435
- Publication date Jul 1, 2021
- Mitsubishi Electric Corporation
- Isao OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20200350281
- Publication date Nov 5, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200211863
- Publication date Jul 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...
- Publication number 20200091116
- Publication date Mar 19, 2020
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASICS FACE TO FACE SELF ASSEMBLY
- Publication number 20190287944
- Publication date Sep 19, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20190189597
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Device and Fluidic Manufacture Thereof
- Publication number 20190181304
- Publication date Jun 13, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING STACKED WAFER ASSEMBLY
- Publication number 20190081021
- Publication date Mar 14, 2019
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS

Guiding structures outside the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective transfer of micro devices

Electronic device and method of transferring electronic element usi...

Semiconductor device and power conversion device

Adhesive member, display device, and manufacturing method of displa...

Discontinuous patterned bonds for semiconductor devices and associa...

Bonding process with inhibited oxide formation

Display device including anisotropic conductive film and method of...

Electronic device and method of transferring electronic element usi...

Stacked semiconductor die assemblies with die support members and a...

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Light emitting device and fluidic manufacture thereof

Chip assembly

Bonding process with inhibited oxide formation

Selective micro device transfer to receiver substrate

Four D device process and structure

Process for manufacturing assembly pads on a carrier for the self-a...

Apparatus and method for processing a semiconductor device

Discontinuous patterned bonds for semiconductor devices and associa...

Semiconductor device, method for manufacturing semiconductor device...

Semiconductor device package having continously formed tapered prot...

Method for assembling a carrier with components, pigment for assemb...

Stacked semiconductor die assemblies with die support members and a...

Semiconductor device having a cooling body with a groove

Light emitting device and fluidic manufacture thereof

Bonding process with inhibited oxide formation

Electronic component device

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

Semiconductor module having a double-sided heat dissipation structu...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

DISPLAY DEVICE INCLUDING ANISOTROPIC CONDUCTIVE FILM AND METHOD OF...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

SEMICONDUCTOR DEVICE PACKAGE

3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...

ASICS FACE TO FACE SELF ASSEMBLY

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

Light Emitting Device and Fluidic Manufacture Thereof

METHOD OF MANUFACTURING STACKED WAFER ASSEMBLY