Guiding structures

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H01L2224/75754

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75754Guiding structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer device and mass transfer method
- Patent number 11,784,159
- Issue date Oct 10, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Jan-hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism, chuck device, and bonder
- Patent number 11,462,428
- Issue date Oct 4, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip mounting apparatus and method of manufacturing display app...
- Patent number 10,109,658
- Issue date Oct 23, 2018
- Samsung Display Co., Ltd.
- Changyong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package alignment frame for local reflow
- Patent number 9,991,223
- Issue date Jun 5, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure applying unit
- Patent number 9,956,643
- Issue date May 1, 2018
- Shindengen Electric Manufacturing Co., Ltd.
- Ryo Matsubayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip attach frame
- Patent number 9,686,895
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Martin Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 9,385,104
- Issue date Jul 5, 2016
- Shinkawa Ltd.
- Daisuke Tani
- B32 - LAYERED PRODUCTS
Information Patent Grant
Packaging process tools and packaging methods for semiconductor dev...
- Patent number 9,218,999
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for forming 3DIC package
- Patent number 9,073,158
- Issue date Jul 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging process tools and packaging methods for semiconductor dev...
- Patent number 8,809,117
- Issue date Aug 19, 2014
- Taiwain Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Assembly jig for a semiconductor device and assembly method for a s...
- Patent number 8,759,158
- Issue date Jun 24, 2014
- Fuji Electric Co. Ltd.
- Hideaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die fixing method and apparatus
- Patent number 8,691,624
- Issue date Apr 8, 2014
- Infineon Technologies AG
- Alexander Ciliox
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Assembly jig for a semiconductor device and assembly method for a s...
- Patent number 8,622,276
- Issue date Jan 7, 2014
- Fuji Electric Co., Ltd.
- Hideaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming 3DIC package
- Patent number 8,609,462
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pick-and-place tool for packaging process
- Patent number 8,546,802
- Issue date Oct 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attach frame
- Patent number 8,535,956
- Issue date Sep 17, 2013
- International Business Machines Corporation
- Martin Eckert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compression bonding device
- Patent number 8,011,407
- Issue date Sep 6, 2011
- Sony Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compression bonding device and a mounting method
- Patent number 7,736,459
- Issue date Jun 15, 2010
- Sony Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mass transfer device and mass transfer method
- Publication number 20210351154
- Publication date Nov 11, 2021
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Jan-hsiang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
LED CHIP MOUNTING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APP...
- Publication number 20170278835
- Publication date Sep 28, 2017
- SAMSUNG DISPLAY CO., LTD.
- Changyong JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW
- Publication number 20170179067
- Publication date Jun 22, 2017
- Intel Corporation
- RUSSELL S. AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE APPLYING UNIT
- Publication number 20170066075
- Publication date Mar 9, 2017
- Ryo MATSUBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150087083
- Publication date Mar 26, 2015
- SHINKAWA LTD.
- Daisuke TANI
- B32 - LAYERED PRODUCTS
Information Patent Application
Packaging Process Tools and Packaging Methods for Semiconductor Dev...
- Publication number 20140331462
- Publication date Nov 13, 2014
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming 3DIC Package
- Publication number 20140091509
- Publication date Apr 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...
- Publication number 20140091131
- Publication date Apr 3, 2014
- Fuji Electric Co., Ltd.
- Hideaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACH FRAME
- Publication number 20130207250
- Publication date Aug 15, 2013
- International Business Machines Corporation
- Martin Eckert
- G01 - MEASURING TESTING
Information Patent Application
Die Fixing Method and Apparatus
- Publication number 20130137215
- Publication date May 30, 2013
- Alexander Ciliox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pick-and-Place Tool for Packaging Process
- Publication number 20130115752
- Publication date May 9, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming 3DIC Package
- Publication number 20130095608
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging Process Tools and Packaging Methods for Semiconductor Dev...
- Publication number 20130089952
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...
- Publication number 20120202322
- Publication date Aug 9, 2012
- Fuji Electric Co., Ltd.
- Hideaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20110049702
- Publication date Mar 3, 2011
- Shinko Electric Industries Co., Ltd.
- Syuji NEGORO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compression bonding device
- Publication number 20090314437
- Publication date Dec 24, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
Compression bonding device and a mounting method
- Publication number 20090032570
- Publication date Feb 5, 2009
- SONY CHEMICAL & INFORMAION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES

Guiding structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Bonding apparatus and method of fabricating display device using th...

Mass transfer device and mass transfer method

Apparatus, system, and method for handling aligned wafer pairs

Alignment mechanism, chuck device, and bonder

System for processing semiconductor devices

Method of assembly by direct bonding between two elements, each ele...

System and related techniques for handling aligned substrate pairs

Apparatus, system, and method for handling aligned wafer pairs

Semiconductor device, and alternator and power conversion device wh...

Tools and systems for processing semiconductor devices, and methods...

LED chip mounting apparatus and method of manufacturing display app...

Semiconductor package alignment frame for local reflow

Pressure applying unit

Chip attach frame

Electrode connection structure and electrode connection method

Bonding apparatus

Packaging process tools and packaging methods for semiconductor dev...

Methods for forming 3DIC package

Packaging process tools and packaging methods for semiconductor dev...

Assembly jig for a semiconductor device and assembly method for a s...

Die fixing method and apparatus

Assembly jig for a semiconductor device and assembly method for a s...

Methods for forming 3DIC package

Pick-and-place tool for packaging process

Chip attach frame

Compression bonding device

Compression bonding device and a mounting method

Patents Applicationslast 30 patents

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

Tools and Systems for Processing Semiconductor Devices, and Methods...

Mass transfer device and mass transfer method

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

Tools and Systems for Processing Semiconductor Devices, and Methods...

LED CHIP MOUNTING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APP...

SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW

PRESSURE APPLYING UNIT

BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Packaging Process Tools and Packaging Methods for Semiconductor Dev...

Methods for Forming 3DIC Package

ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...

CHIP ATTACH FRAME

Die Fixing Method and Apparatus

Pick-and-Place Tool for Packaging Process

Methods for Forming 3DIC Package

Packaging Process Tools and Packaging Methods for Semiconductor Dev...

ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

Compression bonding device

Compression bonding device and a mounting method