Gunn diode

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H01L2924/12033

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/12033Gunn diode

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,830,757
- Issue date Nov 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,804,396
- Issue date Oct 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,784,082
- Issue date Oct 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,735,462
- Issue date Aug 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,615,977
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a 3D semiconductor device and structure with s...
- Patent number 11,610,802
- Issue date Mar 21, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,569,117
- Issue date Jan 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with high-k metal gate transi...
- Patent number 11,521,888
- Issue date Dec 6, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,508,605
- Issue date Nov 22, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with at least two single-cr...
- Patent number 11,495,484
- Issue date Nov 8, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor memory device comprising c...
- Patent number 11,482,439
- Issue date Oct 25, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 11,482,438
- Issue date Oct 25, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with a built-in test circuit...
- Patent number 11,482,440
- Issue date Oct 25, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,443,971
- Issue date Sep 13, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing 3D semiconductor memory device and structure...
- Patent number 11,355,380
- Issue date Jun 7, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,355,381
- Issue date Jun 7, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 11,342,214
- Issue date May 24, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
- Publication number 20240213073
- Publication date Jun 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240178040
- Publication date May 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240170319
- Publication date May 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20210343570
- Publication date Nov 4, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20190006222
- Publication date Jan 3, 2019
- MonolithIC 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL
- Publication number 20140374925
- Publication date Dec 25, 2014
- Elizabeth A. LOGAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENVIRONMENTALLY-ASSISTED TECHNIQUE FOR TRANSFERRING DEVICES ONTO NO...
- Publication number 20140335678
- Publication date Nov 13, 2014
- Chi-Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR, AND POWER SUP...
- Publication number 20140209861
- Publication date Jul 31, 2014
- Fujitsu Limited
- NAOYA OKAMOTO
- B82 - NANO-TECHNOLOGY
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...
- Publication number 20140002188
- Publication date Jan 2, 2014
- SKYWORKS SOLUTIONS, INC.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTALLY-ASSISTED TECHNIQUE FOR TRANSFERRING DEVICES ONTO NO...
- Publication number 20130344679
- Publication date Dec 26, 2013
- Chi-Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process For Fabricating Multi-Die Semiconductor Package With One Or...
- Publication number 20130252377
- Publication date Sep 26, 2013
- Advanced Analogic Technologies (Hong Kong) Limited
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20130083587
- Publication date Apr 4, 2013
- Deepak C. Sekar
- G11 - INFORMATION STORAGE
Information Patent Application
NOVEL SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20130083589
- Publication date Apr 4, 2013
- MonolithIC 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL
- Publication number 20130049232
- Publication date Feb 28, 2013
- GENERAL ELECTRIC COMPANY
- Elizabeth Anne Logan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multi-Die Semiconductor Package With One Or More Embedded Die Pads
- Publication number 20130043574
- Publication date Feb 21, 2013
- Advanced Analogic Technologies (Hong Kong) Limited
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20120248595
- Publication date Oct 4, 2012
- MonolithlC 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20120129301
- Publication date May 24, 2012
- MonolithIC 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND COMPRESSION...
- Publication number 20120093954
- Publication date Apr 19, 2012
- Tetsuya YAMADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDE...
- Publication number 20110051384
- Publication date Mar 3, 2011
- Arno Kriechbaum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...
- Publication number 20100317132
- Publication date Dec 16, 2010
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particale-filled through-silicon...
- Publication number 20100193952
- Publication date Aug 5, 2010
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Frequency Circuit Board, High-Frequency Circuit Module, and Ra...
- Publication number 20100141350
- Publication date Jun 10, 2010
- KYOCERA CORPORATION
- Hajime Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL NANOSCALE CIRCUIT INTERCONNECT AND METHOD OF ASSE...
- Publication number 20100038794
- Publication date Feb 18, 2010
- Northeastern University
- Ahmed Busnaina
- B82 - NANO-TECHNOLOGY
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME
- Publication number 20090294939
- Publication date Dec 3, 2009
- NEC ELECTRONICS CORPORATION
- Kazuhiko Okishima
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for producing a 3D semiconductor memory device and structure

Power amplifier modules including semiconductor resistor and tantal...

3D semiconductor device and structure with single-crystal layers

3D semiconductor device and structure with metal layers and memory...

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor device and structure with bonding and DRAM memory...

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor device and structure with bonding

3D semiconductor device and structure with memory

3D semiconductor device and structure with single-crystal layers

Method for producing a 3D semiconductor device and structure with m...

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor device and structure with bonding

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor device and structure with bonding

3D semiconductor device and structure with single-crystal layers

3D semiconductor memory device and structure

Method for producing a 3D semiconductor device and structure with s...

3D semiconductor device and structure with single-crystal layers

3D semiconductor device and structure with high-k metal gate transi...

3D semiconductor memory device and structure

3D semiconductor devices and structures with at least two single-cr...

Methods for producing a 3D semiconductor memory device comprising c...

Methods for producing a 3D semiconductor memory device and structure

3D semiconductor device and structure with a built-in test circuit...

Power amplifier systems with control interface and bias circuit

3D semiconductor device and structure with memory

Methods for producing 3D semiconductor memory device and structure...

3D semiconductor memory device and structure

Methods for producing a 3D semiconductor memory device and structure

Patents Applicationslast 30 patents

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

METHOD FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL

ENVIRONMENTALLY-ASSISTED TECHNIQUE FOR TRANSFERRING DEVICES ONTO NO...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR, AND POWER SUP...

POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...

ENVIRONMENTALLY-ASSISTED TECHNIQUE FOR TRANSFERRING DEVICES ONTO NO...

Process For Fabricating Multi-Die Semiconductor Package With One Or...

SEMICONDUCTOR DEVICE AND STRUCTURE

NOVEL SEMICONDUCTOR DEVICE AND STRUCTURE

COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL

Multi-Die Semiconductor Package With One Or More Embedded Die Pads

SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE

SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE

COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND COMPRESSION...

PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDE...

Printed Assemblies of Ultrathin, Microscale Inorganic Light Emittin...

Integrated circuit die containing particale-filled through-silicon...

High-Frequency Circuit Board, High-Frequency Circuit Module, and Ra...

THREE DIMENSIONAL NANOSCALE CIRCUIT INTERCONNECT AND METHOD OF ASSE...

LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME