Hafnium [Hf]

Industry

CPC
H01L2924/01072

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01072Hafnium [Hf]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,694,960
- Issue date Jul 4, 2023
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flip chip
- Patent number RE49286
- Issue date Nov 8, 2022
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,133,257
- Issue date Sep 28, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip and method of making flip chip
- Patent number RE48421
- Issue date Feb 2, 2021
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Method of making flip chip
- Patent number RE48422
- Issue date Feb 2, 2021
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 10,811,388
- Issue date Oct 20, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar module with wafer level package and underfill
- Patent number 10,692,824
- Issue date Jun 23, 2020
- Infineon Technologies AG
- Rudolf Lachner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,600,760
- Issue date Mar 24, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching solution for copper or copper alloy
- Patent number 10,570,522
- Issue date Feb 25, 2020
- Entegris, Inc.
- Yutaka Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor chip and power module, and manufacturing method of th...
- Patent number 10,522,638
- Issue date Dec 31, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Masakazu Sagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,475,745
- Issue date Nov 12, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 10,475,779
- Issue date Nov 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,461,053
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 10,434,749
- Issue date Oct 8, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 10,269,743
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second chips and connections th...
- Patent number 10,204,899
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Masaki Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,204,878
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,163,774
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated antennas in wafer level package
- Patent number 10,121,751
- Issue date Nov 6, 2018
- Infineon Technologies AG
- Rudolf Lachner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,056,336
- Issue date Aug 21, 2018
- Renesas Electronics Corporation
- Masami Koketsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 10,037,956
- Issue date Jul 31, 2018
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AI WIRING MATERIAL
- Publication number 20240105668
- Publication date Mar 28, 2024
- NIPPON MICROMETAL CORPORATION
- Yuto KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING A SEMICONDUCTOR TRANSISTOR AND METHODS FOR FO...
- Publication number 20240014289
- Publication date Jan 11, 2024
- Micron Technology, Inc.
- Yoshikazu Moriwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20220384371
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l
- Samuele SCIARRILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20210035954
- Publication date Feb 4, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20200013720
- Publication date Jan 9, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344534
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344533
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190244919
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20190122976
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20190115323
- Publication date Apr 18, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADAR MODULE WITH WAFER LEVEL PACKAGE AND UNDERFILL
- Publication number 20190067223
- Publication date Feb 28, 2019
- INFINEON TECHNOLOGIES AG
- Rudolf Lachner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrathin Layer for Forming a Capacitive Interface Between Joined I...
- Publication number 20180366446
- Publication date Dec 20, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180025991
- Publication date Jan 25, 2018
- Renesas Electronics Corporation
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20180026023
- Publication date Jan 25, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20170373055
- Publication date Dec 28, 2017
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20170221843
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Coupling of Integrated Circuit Die Components
- Publication number 20170092620
- Publication date Mar 30, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT
- Publication number 20170025381
- Publication date Jan 26, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20160284661
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20160155697
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES
- Publication number 20150262976
- Publication date Sep 17, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE FLIP CHIP PACKAGE
- Publication number 20150243639
- Publication date Aug 27, 2015
- TEXAS INSTRUMENTS INCORPORATED
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20150228607
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...
- Publication number 20150084187
- Publication date Mar 26, 2015
- Micron Technology, Inc.
- Ian C. Laboriante
- H01 - BASIC ELECTRIC ELEMENTS

Hafnium [Hf]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bridge interconnection with layered interconnect structures

Method of room temperature covalent bonding

Bridge interconnection with layered interconnect structures

Method of making flip chip

Capacitive coupling in a direct-bonded interface for microelectroni...

Stretchable form of single crystal silicon for high performance ele...

Semiconductor device and a method of manufacturing the same

Bridge interconnection with layered interconnect structures

Flip chip and method of making flip chip

Method of making flip chip

Capacitive coupling in a direct-bonded interface for microelectroni...

Protrusion bump pads for bond-on-trace processing

Semiconductor device and a method of manufacturing the same

Radar module with wafer level package and underfill

Ultrathin layer for forming a capacitive interface between joined i...

Etching solution for copper or copper alloy

Semiconductor chip and power module, and manufacturing method of th...

Bridge interconnection with layered interconnect structures

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device

Method of room temperature covalent bonding

Method for low temperature bonding and bonded structure

Semiconductor devices and methods of manufacture thereof

Semiconductor device with first and second chips and connections th...

Semiconductor device and a method of manufacturing the same

Protrusion bump pads for bond-on-trace processing

Room temperature metal direct bonding

Integrated antennas in wafer level package

Semiconductor device and a method of manufacturing the same

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Patents Applicationslast 30 patents

AI WIRING MATERIAL

APPARATUSES INCLUDING A SEMICONDUCTOR TRANSISTOR AND METHODS FOR FO...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

Stretchable Form of Single Crystal Silicon for High Performance Ele...

METHOD OF ROOM TEMPERATURE COVALENT BONDING

METHOD OF ROOM TEMPERATURE COVALENT BONDING

Semiconductor Devices and Methods of Manufacture Thereof

Protrusion Bump Pads for Bond-on-Trace Processing

ROOM TEMPERATURE METAL DIRECT BONDING

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

RADAR MODULE WITH WAFER LEVEL PACKAGE AND UNDERFILL

SEMICONDUCTOR DEVICE

WIRE BONDING SYSTEMS AND RELATED METHODS

Ultrathin Layer for Forming a Capacitive Interface Between Joined I...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming a Vertical Interconnect...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor Devices and Methods of Manufacture Thereof

Capacitive Coupling of Integrated Circuit Die Components

HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

Protrusion Bump Pads for Bond-on-Trace Processing

SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES

INTEGRATED PASSIVE FLIP CHIP PACKAGE

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...