Halogenated polymer

Industry

CPC
H01L2924/062

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/062Halogenated polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module, method for manufacturing the same, and electronic device
- Patent number 10,115,691
- Issue date Oct 30, 2018
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible microelectronic systems and methods of fabricating the same
- Patent number 10,103,037
- Issue date Oct 16, 2018
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESTER COMPOUND AND RESIN COMPOSITION
- Publication number 20230242705
- Publication date Aug 3, 2023
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND AS...
- Publication number 20230064032
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MODULE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
- Publication number 20170330852
- Publication date Nov 16, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE MICROELECTRONIC SYSTEMS AND METHODS OF FABRICATING THE SAME
- Publication number 20150325491
- Publication date Nov 12, 2015
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Halogenated polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond materials with enhanced plasma resistant characteristics and a...

Module, method for manufacturing the same, and electronic device

Flexible microelectronic systems and methods of fabricating the same

Patents Applicationslast 30 patents

Grain Structure Engineering for Metal Gapfill Materials

ESTER COMPOUND AND RESIN COMPOSITION

EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND AS...

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

MODULE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

FLEXIBLE MICROELECTRONIC SYSTEMS AND METHODS OF FABRICATING THE SAME