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Hardening the adhesive by cooling

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Industry

  • CPC
  • H01L2224/8088
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8088Hardening the adhesive by cooling
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic component mounting structure
    • Patent number 8,497,432
    • Issue date Jul 30, 2013
    • Seiko Epson Corporation
    • Nobuaki Hashimoto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents