Hardening the adhesive by cooling

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CPC
H01L2224/8588

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8588Hardening the adhesive by cooling

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate, method of manufacturing wiring substrate, and ele...
- Patent number 8,127,438
- Issue date Mar 6, 2012
- Seiko Epson Corporation
- Toshiki Hara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNE...
- Publication number 20110217877
- Publication date Sep 8, 2011
- Torsten Linz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND ELE...
- Publication number 20080110017
- Publication date May 15, 2008
- SEIKO EPSON CORPORATION
- Toshiki HARA
- H01 - BASIC ELECTRIC ELEMENTS