Hardening the adhesive by cooling

Industry

CPC
H01L2224/8188

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8188Hardening the adhesive by cooling

Industries

Patents Grantslast 30 patents

Information Patent Grant
SSI PoP
- Patent number 10,622,291
- Issue date Apr 14, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding materials comprising ball grid arrays and metal inve...
- Patent number 10,403,594
- Issue date Sep 3, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clips defining electrical pathway on a flexible sheet
- Patent number 10,079,223
- Issue date Sep 18, 2018
- OSRAM SYLVANIA Inc.
- Richard Speer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,865,463
- Issue date Jan 9, 2018
- SII Semiconductor Corporation
- Hitomi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted structure and manufacturing method of mounted structure
- Patent number 9,603,295
- Issue date Mar 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for producing component mounting board
- Patent number 9,237,686
- Issue date Jan 12, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structure using conductive adhesives, and a manufacturing me...
- Patent number 7,157,800
- Issue date Jan 2, 2007
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, PRODUCTION METHOD THEREFOR, AND SEMICON...
- Publication number 20220352116
- Publication date Nov 3, 2022
- Showa Denko Materials Co., Ltd.
- Toshiyasu AKIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD
- Publication number 20140158751
- Publication date Jun 12, 2014
- PANASONIC CORPORATION
- Koji Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE
- Publication number 20140049930
- Publication date Feb 20, 2014
- PANASONIC CORPORATION
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded structure using conductive adhesives, and a manufacturing me...
- Publication number 20050062168
- Publication date Mar 24, 2005
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hardening the adhesive by cooling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SSI PoP

Hybrid bonding materials comprising ball grid arrays and metal inve...

Clips defining electrical pathway on a flexible sheet

Method of manufacturing a semiconductor device

Mounted structure and manufacturing method of mounted structure

Method and system for producing component mounting board

Bonded structure using conductive adhesives, and a manufacturing me...

Patents Applicationslast 30 patents

ADHESIVE FOR SEMICONDUCTOR, PRODUCTION METHOD THEREFOR, AND SEMICON...

METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD

MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE

Bonded structure using conductive adhesives, and a manufacturing me...