Hardening the adhesive by curing

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H01L2224/80855

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80855Hardening the adhesive by curing

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Patents Grantslast 30 patents

Information Patent Grant
Low cost three-dimensional stacking semiconductor assemblies
- Patent number 12,062,607
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost three-dimensional stacking semiconductor assemblies
- Patent number 11,462,472
- Issue date Oct 4, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming hybrid bonding with through substrate via (TSV)
- Patent number 10,340,247
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 9,768,143
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically clear adhesive for dicing die bonding film
- Patent number 9,133,367
- Issue date Sep 15, 2015
- Cheil Industries, Inc.
- Kyoung Jin Ha
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device including double-sided multi-electrode chip em...
- Patent number 8,446,003
- Issue date May 21, 2013
- Denso Corporation
- Atsushi Komura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20240371755
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...
- Publication number 20230317653
- Publication date Oct 5, 2023
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20230025886
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
- Publication number 20200027868
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
- Publication number 20180005977
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM
- Publication number 20120171481
- Publication date Jul 5, 2012
- Kyoung Jin Ha
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100295170
- Publication date Nov 25, 2010
- DENSO CORPORATION
- Atsushi KOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hardening the adhesive by curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low cost three-dimensional stacking semiconductor assemblies

Hybrid bonding with through substrate via (TSV)

Low cost three-dimensional stacking semiconductor assemblies

Method for forming hybrid bonding with through substrate via (TSV)

Hybrid bonding with through substrate via (TSV)

Optically clear adhesive for dicing die bonding film

Semiconductor device including double-sided multi-electrode chip em...

Patents Applicationslast 30 patents

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)

METHOD FOR FORMING HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)

OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM

SEMICONDUCTOR DEVICE