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Hardening the adhesive by curing
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H01L2224/83855
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83855
Hardening the adhesive by curing
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last 30 patents
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Patent Grant
Energy augmentation structures, and their use in adhesive bonding
Patent number
11,964,166
Issue date
Apr 23, 2024
Immunolight, LLC
Frederic A Bourke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Energy augmentation structures for use with energy emitters and col...
Patent number
11,964,167
Issue date
Apr 23, 2024
Immunolight, LLC
Frederic A Bourke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive bonding composition and electronic components prepared fro...
Patent number
11,901,331
Issue date
Feb 13, 2024
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack of electrical components and method of producing the same
Patent number
11,855,035
Issue date
Dec 26, 2023
TDK Corporation
Yohei Hirota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress compensating pick-up tool
Patent number
11,846,806
Issue date
Dec 19, 2023
Ciena Corporation
Raphael Beaupré-Laflamme
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
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Patent Grant
Semiconductor bonding structures and methods
Patent number
11,749,535
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tse Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method
Patent number
11,710,731
Issue date
Jul 25, 2023
Daicel Corporation
Naoko Tsuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method
Patent number
11,676,956
Issue date
Jun 13, 2023
Daicel Corporation
Naoko Tsuji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Mounting apparatus
Patent number
11,664,344
Issue date
May 30, 2023
Shinkawa Ltd.
Kohei Seyama
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Memory devices with controllers under memory packages and associate...
Patent number
11,658,154
Issue date
May 23, 2023
Micron Technology, Inc.
Seng Kim Ye
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Adhesive bonding composition and method of use
Patent number
11,648,750
Issue date
May 16, 2023
Immunolight, LLC
Zakaryae Fathi
B32 - LAYERED PRODUCTS
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Patent Grant
Semiconductor device manufacturing method
Patent number
11,646,304
Issue date
May 9, 2023
Daicel Corporation
Naoko Tsuji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Mounting apparatus
Patent number
11,616,041
Issue date
Mar 28, 2023
Shinkawa Ltd.
Kohei Seyama
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices and methods of making the same
Patent number
11,557,530
Issue date
Jan 17, 2023
Semiconductor Components Industries, LLC
Swee Har Khor
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing display device
Patent number
11,552,155
Issue date
Jan 10, 2023
Samsung Display Co., Ltd.
Chan-Jae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
11,508,694
Issue date
Nov 22, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device package and manufacturing method thereof
Patent number
11,424,155
Issue date
Aug 23, 2022
Amkor Technology Singapore Holding Pte Ltd.
Michael G. Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of surface-mounting components
Patent number
11,342,489
Issue date
May 24, 2022
DST Innovations Limited
Anthony Miles
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Mass transfer method for light-emitting unit, array substrate, and...
Patent number
11,322,485
Issue date
May 3, 2022
BOE Technology Group Co., Ltd.
Chengtan Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die bonding material, light-emitting device, and method for produci...
Patent number
11,315,899
Issue date
Apr 26, 2022
Lintec Corporation
Akiko Umeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with conductive underfill ground plane
Patent number
11,270,972
Issue date
Mar 8, 2022
NXP B.V.
Nishant Lakhera
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Adhesive bonding composition and electronic components prepared fro...
Patent number
11,270,973
Issue date
Mar 8, 2022
Immunolight, LLC
Zakaryae Fathi
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Control of under-fill using a film during fabrication for a dual-si...
Patent number
11,244,835
Issue date
Feb 8, 2022
Skyworks Solutions, Inc.
Robert Francis Darveaux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Control of under-fill using a dam on a packaging substrate for a du...
Patent number
11,201,066
Issue date
Dec 14, 2021
Skyworks Solutions, Inc.
Robert Francis Darveaux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for setting conditions for heating semiconductor chip during...
Patent number
11,201,132
Issue date
Dec 14, 2021
Shinkawa Ltd.
Tomonori Nakamura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Enhanced adhesive materials and processes for 3D applications
Patent number
11,168,234
Issue date
Nov 9, 2021
International Business Machines Corporation
James L. Hedrick
B82 - NANO-TECHNOLOGY
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Patent Grant
Controlling of height of high-density interconnection structure on...
Patent number
11,114,308
Issue date
Sep 7, 2021
International Business Machines Corporation
Keishi Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack of electrical components and method of producing the same
Patent number
11,088,106
Issue date
Aug 10, 2021
TDK Corporation
Yohei Hirota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with different types of semiconductor dies attached to a fl...
Patent number
11,004,808
Issue date
May 11, 2021
Cree, Inc.
Xikun Zhang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Liquid sealing material for copper bump, and resin composition for...
Patent number
10,941,280
Issue date
Mar 9, 2021
Namics Corporation
Tomoya Yamazawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...
Publication number
20240115878
Publication date
Apr 11, 2024
Immunolight, LLC
Frederic A. BOURKE
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER
Publication number
20240071977
Publication date
Feb 29, 2024
Micron Technology, Inc.
Chen Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL INTERFACIAL MATERIAL FILM, SEMICONDUCTOR PACKAGE, METHOD OF...
Publication number
20240063085
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Mihyae PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING METHOD
Publication number
20240038705
Publication date
Feb 1, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yunzhi LING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20230369274
Publication date
Nov 16, 2023
Taiwan Semiconduction Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress Compensating Pick-up Tool
Publication number
20230314712
Publication date
Oct 5, 2023
CIENA CORPORATION
Raphael Beaupré-Laflamme
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Enhanced Thermal Control of a Hybrid Chip Assembly
Publication number
20230245993
Publication date
Aug 3, 2023
CIENA CORPORATION
Raphael Beaupré-Laflamme
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
Publication number
20230191747
Publication date
Jun 22, 2023
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURI...
Publication number
20230027838
Publication date
Jan 26, 2023
Doosan Corporation
Taejin CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
Publication number
20220319944
Publication date
Oct 6, 2022
Samsung Electronics Co., Ltd.
Jinwoo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
Publication number
20220181292
Publication date
Jun 9, 2022
Immunolight, LLC
Zakaryae FATHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE
Publication number
20220181208
Publication date
Jun 9, 2022
Western Digital Technologies, Inc.
Xin Tian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENERGY AUGMENTATION STRUCTURES IN ADHESIVE BONDING COMPOSITIONS
Publication number
20220148997
Publication date
May 12, 2022
Immunolight, LLC
Frederic A. BOURKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress Compensating Pick-up Tool
Publication number
20220075117
Publication date
Mar 10, 2022
CIENA CORPORATION
Raphael Beaupré-Laflamme
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20210384183
Publication date
Dec 9, 2021
DAICEL CORPORATION
Naoko TSUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20210358884
Publication date
Nov 18, 2021
DAICEL CORPORATION
Naoko TSUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
Publication number
20210343545
Publication date
Nov 4, 2021
International Business Machines Corporation
Keishi Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
Publication number
20210327846
Publication date
Oct 21, 2021
TDK Corporation
Yohei HIROTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...
Publication number
20210233877
Publication date
Jul 29, 2021
Cree, Inc.
Xikun ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING APPARATUS
Publication number
20210175201
Publication date
Jun 10, 2021
SHINKAWA LTD.
Kohei SEYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE
Publication number
20210151543
Publication date
May 20, 2021
SAMSUNG DISPLAY CO., LTD.
Chan-Jae PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
Publication number
20210035946
Publication date
Feb 4, 2021
Immunolight, LLC
Zakaryae FATHI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20200404794
Publication date
Dec 24, 2020
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Shingo INOUE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE WITH CONDUCTIVE UNDERFILL GROUND PLANE
Publication number
20200395332
Publication date
Dec 17, 2020
NXP USA, Inc.
Nishant Lakhera
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
Publication number
20200365552
Publication date
Nov 19, 2020
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCI...
Publication number
20200335471
Publication date
Oct 22, 2020
LINTEC CORPORATION
Akiko UMEDA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...
Publication number
20200286854
Publication date
Sep 10, 2020
SHINKAWA LTD.
Tomonori NAKAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
Publication number
20200219848
Publication date
Jul 9, 2020
INFINEON TECHNOLOGIES AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...
Publication number
20200152483
Publication date
May 14, 2020
SKYWORKS SOLUTIONS, INC.
Robert Francis DARVEAUX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
Publication number
20200118963
Publication date
Apr 16, 2020
TDK Corporation
Yohei HIROTA
H01 - BASIC ELECTRIC ELEMENTS