Hardening the adhesive by curing

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CPC
H01L2224/83855

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83855Hardening the adhesive by curing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures, energy emitters or energy collector...
- Patent number 12,121,746
- Issue date Oct 22, 2024
- Immunolight, LLC
- Frederic A Bourke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applying stress compensation for aligning a companion chip with a h...
- Patent number 12,111,497
- Issue date Oct 8, 2024
- Ciena Corporation
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 12,087,596
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures in adhesive bonding compositions
- Patent number 12,076,579
- Issue date Sep 3, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,082,350
- Issue date Sep 3, 2024
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures and their use in solar cells and oth...
- Patent number 11,998,760
- Issue date Jun 4, 2024
- Immunolight, LLC
- Frederic A. Bourke
- F21 - LIGHTING
Information Patent Grant
Energy augmentation structures, and their use in adhesive bonding
- Patent number 11,964,166
- Issue date Apr 23, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures for use with energy emitters and col...
- Patent number 11,964,167
- Issue date Apr 23, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 11,901,331
- Issue date Feb 13, 2024
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,855,035
- Issue date Dec 26, 2023
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress compensating pick-up tool
- Patent number 11,846,806
- Issue date Dec 19, 2023
- Ciena Corporation
- Raphael Beaupré-Laflamme
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 11,749,535
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,710,731
- Issue date Jul 25, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,676,956
- Issue date Jun 13, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,664,344
- Issue date May 30, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,646,304
- Issue date May 9, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,616,041
- Issue date Mar 28, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device
- Patent number 11,552,155
- Issue date Jan 10, 2023
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of surface-mounting components
- Patent number 11,342,489
- Issue date May 24, 2022
- DST Innovations Limited
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer method for light-emitting unit, array substrate, and...
- Patent number 11,322,485
- Issue date May 3, 2022
- BOE Technology Group Co., Ltd.
- Chengtan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding material, light-emitting device, and method for produci...
- Patent number 11,315,899
- Issue date Apr 26, 2022
- Lintec Corporation
- Akiko Umeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240363576
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...
- Publication number 20240258210
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...
- Publication number 20240216713
- Publication date Jul 4, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...
- Publication number 20240115878
- Publication date Apr 11, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER
- Publication number 20240071977
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACIAL MATERIAL FILM, SEMICONDUCTOR PACKAGE, METHOD OF...
- Publication number 20240063085
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Mihyae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230369274
- Publication date Nov 16, 2023
- Taiwan Semiconduction Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Compensating Pick-up Tool
- Publication number 20230314712
- Publication date Oct 5, 2023
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Thermal Control of a Hybrid Chip Assembly
- Publication number 20230245993
- Publication date Aug 3, 2023
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURI...
- Publication number 20230027838
- Publication date Jan 26, 2023
- Doosan Corporation
- Taejin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20220319944
- Publication date Oct 6, 2022
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20220181292
- Publication date Jun 9, 2022
- Immunolight, LLC
- Zakaryae FATHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE
- Publication number 20220181208
- Publication date Jun 9, 2022
- Western Digital Technologies, Inc.
- Xin Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES IN ADHESIVE BONDING COMPOSITIONS
- Publication number 20220148997
- Publication date May 12, 2022
- Immunolight, LLC
- Frederic A. BOURKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Compensating Pick-up Tool
- Publication number 20220075117
- Publication date Mar 10, 2022
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210384183
- Publication date Dec 9, 2021
- DAICEL CORPORATION
- Naoko TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210358884
- Publication date Nov 18, 2021
- DAICEL CORPORATION
- Naoko TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
- Publication number 20210343545
- Publication date Nov 4, 2021
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20210327846
- Publication date Oct 21, 2021
- TDK Corporation
- Yohei HIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...
- Publication number 20210233877
- Publication date Jul 29, 2021
- Cree, Inc.
- Xikun ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20210175201
- Publication date Jun 10, 2021
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20210151543
- Publication date May 20, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20210035946
- Publication date Feb 4, 2021
- Immunolight, LLC
- Zakaryae FATHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200404794
- Publication date Dec 24, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Shingo INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE WITH CONDUCTIVE UNDERFILL GROUND PLANE
- Publication number 20200395332
- Publication date Dec 17, 2020
- NXP USA, Inc.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCI...
- Publication number 20200335471
- Publication date Oct 22, 2020
- LINTEC CORPORATION
- Akiko UMEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...
- Publication number 20200286854
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS

Hardening the adhesive by curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and manufacturing method thereof

Energy augmentation structures, energy emitters or energy collector...

Semiconductor bonding structures and methods

Applying stress compensation for aligning a companion chip with a h...

Semiconductor package with dual sides of metal routing

Controlling of height of high-density interconnection structure on...

Package with different types of semiconductor dies attached to a fl...

Energy augmentation structures in adhesive bonding compositions

Semiconductor device

Energy augmentation structures and their use in solar cells and oth...

Energy augmentation structures, and their use in adhesive bonding

Energy augmentation structures for use with energy emitters and col...

Adhesive bonding composition and electronic components prepared fro...

Stack of electrical components and method of producing the same

Stress compensating pick-up tool

Semiconductor bonding structures and methods

Semiconductor device manufacturing method

Semiconductor device manufacturing method

Mounting apparatus

Memory devices with controllers under memory packages and associate...

Adhesive bonding composition and method of use

Semiconductor device manufacturing method

Mounting apparatus

Semiconductor devices and methods of making the same

Method for manufacturing display device

Chip assembly

Semiconductor device package and manufacturing method thereof

Method of surface-mounting components

Mass transfer method for light-emitting unit, array substrate, and...

Die bonding material, light-emitting device, and method for produci...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...

ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...

ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...

DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER

THERMAL INTERFACIAL MATERIAL FILM, SEMICONDUCTOR PACKAGE, METHOD OF...

SUBSTRATE BONDING METHOD

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Stress Compensating Pick-up Tool

Enhanced Thermal Control of a Hybrid Chip Assembly

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE

ENERGY AUGMENTATION STRUCTURES IN ADHESIVE BONDING COMPOSITIONS

Stress Compensating Pick-up Tool

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME

PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...

MOUNTING APPARATUS

METHOD FOR MANUFACTURING DISPLAY DEVICE

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

SEMICONDUCTOR DEVICE

PACKAGE WITH CONDUCTIVE UNDERFILL GROUND PLANE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCI...

METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...