Hardening the adhesive by curing

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H01L2224/82855

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82855Hardening the adhesive by curing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package including wire bond and electrically con...
- Patent number 8,907,482
- Issue date Dec 9, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making electronic storage system having code circuit
- Patent number 8,739,399
- Issue date Jun 3, 2014
- Eastman Kodak Company
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING ELECTRONIC STORAGE SYSTEM HAVING CODE CIRCUIT
- Publication number 20130283599
- Publication date Oct 31, 2013
- Ronald Steven Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130111744
- Publication date May 9, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130112989
- Publication date May 9, 2013
- COOLEDGE LIGHTING, INC.
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130056749
- Publication date Mar 7, 2013
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS