having a programmable lay-out

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CPC
H05K1/029

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/029having a programmable lay-out

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board
- Patent number 12,369,247
- Issue date Jul 22, 2025
- Nitto Denko Corporation
- Hideki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,369,248
- Issue date Jul 22, 2025
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for degradation detection
- Patent number 12,369,245
- Issue date Jul 22, 2025
- FANUC CORPORATION
- Takeshi Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly and electronic device
- Patent number 12,369,249
- Issue date Jul 22, 2025
- Huawei Technologies Co., Ltd.
- Hongbin Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly
- Patent number 12,369,260
- Issue date Jul 22, 2025
- Vitesco Technologies GmbH
- Stefan Peck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,363,825
- Issue date Jul 15, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 12,363,824
- Issue date Jul 15, 2025
- Yungu (Gu'an) Technology Co., Ltd.
- Hongrui Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display apparatus
- Patent number 12,356,549
- Issue date Jul 8, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiaqin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including flexible printed circuit board
- Patent number 12,356,548
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Hyunmo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,349,273
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply apparatus, load and electronic device
- Patent number 12,342,450
- Issue date Jun 24, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Wulong Cong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, lens driving device, and camera module including the...
- Patent number 12,336,092
- Issue date Jun 17, 2025
- LG Innotek Co., Ltd
- Na Kyung Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and method of manufacturing the same
- Patent number 12,336,093
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and power conversion apparatus
- Patent number 12,336,094
- Issue date Jun 17, 2025
- Fuji Electric Co., Ltd.
- Ryoga Kiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reconfigurable connector system
- Patent number 12,334,693
- Issue date Jun 17, 2025
- GM Global Technology Operations LLC
- James Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,336,095
- Issue date Jun 17, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,328,813
- Issue date Jun 10, 2025
- Japan Display Inc.
- Masatomo Hishinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module conductive shield including discontinuities to reduce device...
- Patent number 12,324,089
- Issue date Jun 3, 2025
- Qorvo US, Inc.
- Loizos Loizou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single circuit board assembly with logic and power components
- Patent number 12,324,093
- Issue date Jun 3, 2025
- Steering Solutions IP Holding Corporation
- Ryan D. Yaklin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board local electromagnetic shielding
- Patent number 12,317,409
- Issue date May 27, 2025
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a device substrate
- Patent number 12,317,423
- Issue date May 27, 2025
- AUO Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having embedded electronic component and method for m...
- Patent number 12,309,918
- Issue date May 20, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ming-Hsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board with offset connection pads and inclined i...
- Patent number 12,306,210
- Issue date May 20, 2025
- Kyocera Corporation
- Hitoshi Tega
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,309,923
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting device with connection to element electrodes using filler
- Patent number 12,302,494
- Issue date May 13, 2025
- Nichia Corporation
- Eiko Minato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,302,493
- Issue date May 13, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LAYOUT SOLUTION FOR DATA TRANSMISSION TRACE, MAINBOARD, AND ELECTRO...
- Publication number 20250240883
- Publication date Jul 24, 2025
- Huawei Technologies Co., Ltd
- Longxiao XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20250240882
- Publication date Jul 24, 2025
- Nitto Denko Corporation
- Ikuya HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250240881
- Publication date Jul 24, 2025
- Canon Kabushiki Kaisha
- TAKESHI HONDA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC C...
- Publication number 20250234455
- Publication date Jul 17, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- MING-HSUN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHARED FOOTPRINT FOR FRONTSIDE AND THROUGH-BOARD CONNECTOR ON AN LE...
- Publication number 20250234454
- Publication date Jul 17, 2025
- SIGNIFY HOLDING B.V.
- PIETER JOSEPH CLARA VAN DER WEL
- F21 - LIGHTING
Information Patent Application
Wearable Device for Sports Headwear
- Publication number 20250227839
- Publication date Jul 10, 2025
- HEAD IMPACT TRAUMA LIMITED
- David Euan Murray BOWEN
- A42 - HEADWEAR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER
- Publication number 20250227857
- Publication date Jul 10, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF FABRICATING THE...
- Publication number 20250220809
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Vanluan NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
- Publication number 20250214324
- Publication date Jul 3, 2025
- Murata Manufacturing Co., Ltd.
- Atsushi KISHIMOTO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CIRCUIT BOARD
- Publication number 20250220810
- Publication date Jul 3, 2025
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOCLAVABLE ELECTRONICS UNIT FOR AN ENDOSCOPE, METHOD FOR PRODUCIN...
- Publication number 20250212339
- Publication date Jun 26, 2025
- OLYMPUS WINTER & IBE GMBH
- Sven PABST
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20250212337
- Publication date Jun 26, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250212323
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212335
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250203767
- Publication date Jun 19, 2025
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250203766
- Publication date Jun 19, 2025
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250194010
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jun Ki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER
- Publication number 20250194018
- Publication date Jun 12, 2025
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Daniel SCHLICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250185158
- Publication date Jun 5, 2025
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20250185167
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Kyeongho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD INCLUDING A BUFFER LAYER FOR IMPROVING
- Publication number 20250185161
- Publication date Jun 5, 2025
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20250185139
- Publication date Jun 5, 2025
- LIGHTING DEFENSE GROUP, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20250185160
- Publication date Jun 5, 2025
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT PATTERN, AND ETCHIN...
- Publication number 20250185177
- Publication date Jun 5, 2025
- NHK Spring Co., Ltd.
- Shinya YANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY CHARGER
- Publication number 20250175021
- Publication date May 29, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. SILHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...
- Publication number 20250176098
- Publication date May 29, 2025
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunhua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176099
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- Publication number 20250168965
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250159800
- Publication date May 15, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
- Publication number 20250158619
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING

having a programmable lay-out

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board

Circuit board

Printed circuit board for degradation detection

Printed circuit board assembly and electronic device

Printed circuit board assembly

Patterned conductive article

Display panel

Display panel and display apparatus

Electronic device including flexible printed circuit board

Electronic component embedded substrate

Printed circuit board

Power supply apparatus, load and electronic device

Circuit board, lens driving device, and camera module including the...

Multilayer board and method of manufacturing the same

Wiring board and power conversion apparatus

Reconfigurable connector system

Wiring substrate and method for manufacturing wiring substrate

Electronic device

Module conductive shield including discontinuities to reduce device...

Single circuit board assembly with logic and power components

Circuit board local electromagnetic shielding

Method for manufacturing printed wiring board and printed wiring board

Method of manufacturing a device substrate

Mating backplane for high speed, high density electrical connector

Circuit board having embedded electronic component and method for m...

Multilayer circuit board with offset connection pads and inclined i...

Printed circuit board and method for manufacturing the same

Circuit carrier and manufacturing method thereof and package structure

Lighting device with connection to element electrodes using filler

Wiring substrate

Patents Applicationslast 30 patents

LAYOUT SOLUTION FOR DATA TRANSMISSION TRACE, MAINBOARD, AND ELECTRO...

WIRING CIRCUIT BOARD

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

METHOD FOR MANUFACTURING CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC C...

SHARED FOOTPRINT FOR FRONTSIDE AND THROUGH-BOARD CONNECTOR ON AN LE...

Wearable Device for Sports Headwear

MANUFACTURING METHOD OF CIRCUIT CARRIER

STACKED STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF FABRICATING THE...

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

CIRCUIT BOARD

AUTOCLAVABLE ELECTRONICS UNIT FOR AN ENDOSCOPE, METHOD FOR PRODUCIN...

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER

COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...

CIRCUIT BOARD INCLUDING A BUFFER LAYER FOR IMPROVING

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT PATTERN, AND ETCHIN...

BATTERY CHARGER

PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM