having a programmable lay-out

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CPC
H05K1/029

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/029having a programmable lay-out

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,328,813
- Issue date Jun 10, 2025
- Japan Display Inc.
- Masatomo Hishinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module conductive shield including discontinuities to reduce device...
- Patent number 12,324,089
- Issue date Jun 3, 2025
- Qorvo US, Inc.
- Loizos Loizou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single circuit board assembly with logic and power components
- Patent number 12,324,093
- Issue date Jun 3, 2025
- Steering Solutions IP Holding Corporation
- Ryan D. Yaklin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board local electromagnetic shielding
- Patent number 12,317,409
- Issue date May 27, 2025
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a device substrate
- Patent number 12,317,423
- Issue date May 27, 2025
- AUO Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having embedded electronic component and method for m...
- Patent number 12,309,918
- Issue date May 20, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ming-Hsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board with offset connection pads and inclined i...
- Patent number 12,306,210
- Issue date May 20, 2025
- Kyocera Corporation
- Hitoshi Tega
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,309,923
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting device with connection to element electrodes using filler
- Patent number 12,302,494
- Issue date May 13, 2025
- Nichia Corporation
- Eiko Minato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,302,493
- Issue date May 13, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having sealing structure
- Patent number 12,298,628
- Issue date May 13, 2025
- Innolux Corporation
- Fiona Jhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method for multilayer wiring board
- Patent number 12,302,504
- Issue date May 13, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and image forming apparatus
- Patent number 12,295,096
- Issue date May 6, 2025
- Canon Kabushiki Kaisha
- Takeshi Honda
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board and storage device including the same
- Patent number 12,295,095
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Sunhong Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including bonding layer, having conductive pa...
- Patent number 12,295,100
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Yoon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,295,099
- Issue date May 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yuta Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,289,828
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate and electronic component
- Patent number 12,289,826
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and electronic device
- Patent number 12,289,827
- Issue date Apr 29, 2025
- Kioxia Corporation
- Yuta Tsubouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,289,829
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Jun Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device comprising stacked circuit members
- Patent number 12,289,825
- Issue date Apr 29, 2025
- Japan Aviation Electronics Industry, Limited
- Shinji Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,289,838
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Yasuki Kimishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for localized repair of graphene-coated lamination stacks a...
- Patent number 12,289,839
- Issue date Apr 29, 2025
- Mellanox Technologies, Ltd.
- Elad Mentovich
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Hybrid circuit board
- Patent number 12,282,053
- Issue date Apr 22, 2025
- COBHAM ADVANCED ELECTRONIC SOLUTIONS INC.
- Mark Bates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,284,757
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate
- Patent number 12,284,754
- Issue date Apr 22, 2025
- Japan Display Inc.
- Yasushi Kawata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substrate and carrier plate wiring structure with filter...
- Patent number 12,279,377
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250194010
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jun Ki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER
- Publication number 20250194018
- Publication date Jun 12, 2025
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Daniel SCHLICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250185158
- Publication date Jun 5, 2025
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20250185167
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Kyeongho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD INCLUDING A BUFFER LAYER FOR IMPROVING
- Publication number 20250185161
- Publication date Jun 5, 2025
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20250185139
- Publication date Jun 5, 2025
- LIGHTING DEFENSE GROUP, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20250185160
- Publication date Jun 5, 2025
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT PATTERN, AND ETCHIN...
- Publication number 20250185177
- Publication date Jun 5, 2025
- NHK Spring Co., Ltd.
- Shinya YANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY CHARGER
- Publication number 20250175021
- Publication date May 29, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. SILHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...
- Publication number 20250176098
- Publication date May 29, 2025
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunhua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176099
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- Publication number 20250168965
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250159800
- Publication date May 15, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250159797
- Publication date May 15, 2025
- CHICONY ELECTRONICS CO., LTD.
- CHIH-HUNG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250159799
- Publication date May 15, 2025
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
- Publication number 20250158619
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250159798
- Publication date May 15, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi KIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250159815
- Publication date May 15, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE
- Publication number 20250151192
- Publication date May 8, 2025
- Japan Display Inc.
- Takumi SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYER...
- Publication number 20250151208
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...
- Publication number 20250151193
- Publication date May 8, 2025
- SANDISK TECHNOLOGIES, INC.
- Vigneshwarram Kumaresan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED PRINTED CIRCUIT BOARD EXPANSION IN INTEGRATED SENSOR-LENS A...
- Publication number 20250142191
- Publication date May 1, 2025
- GoPro, Inc.
- Ian Copeland Griggs
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC CONTROL UNIT INTERFACES WITH FLEXIBLE INPUT SIGNAL CONDI...
- Publication number 20250142721
- Publication date May 1, 2025
- Cummins Inc.
- Sheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND...
- Publication number 20250142731
- Publication date May 1, 2025
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE ELECTRONIC DEVICE
- Publication number 20250130533
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansol KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20250133655
- Publication date Apr 24, 2025
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- CHI SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126707
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Won Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CIRCUIT BOARD
- Publication number 20250126723
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126711
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having a programmable lay-out

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Module conductive shield including discontinuities to reduce device...

Single circuit board assembly with logic and power components

Circuit board local electromagnetic shielding

Method for manufacturing printed wiring board and printed wiring board

Method of manufacturing a device substrate

Mating backplane for high speed, high density electrical connector

Circuit board having embedded electronic component and method for m...

Multilayer circuit board with offset connection pads and inclined i...

Printed circuit board and method for manufacturing the same

Circuit carrier and manufacturing method thereof and package structure

Lighting device with connection to element electrodes using filler

Wiring substrate

Electronic device having sealing structure

Production method for multilayer wiring board

Circuit board and image forming apparatus

Printed circuit board and storage device including the same

Printed circuit board including bonding layer, having conductive pa...

Wiring board

Circuit board

Multilayer resin substrate and electronic component

Printed board and electronic device

Printed wiring board

Device comprising stacked circuit members

Wiring substrate and method for manufacturing wiring substrate

Process for localized repair of graphene-coated lamination stacks a...

Hybrid circuit board

Wiring circuit board

Flexible substrate

Conductive substrate and carrier plate wiring structure with filter...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER

COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...

CIRCUIT BOARD INCLUDING A BUFFER LAYER FOR IMPROVING

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT PATTERN, AND ETCHIN...

BATTERY CHARGER

PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

MEMBRANE CIRCUIT BOARD

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

PRINTED WIRING BOARD

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

FLEXIBLE SUBSTRATE

SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYER...

ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...

REDUCED PRINTED CIRCUIT BOARD EXPANSION IN INTEGRATED SENSOR-LENS A...

ELECTRONIC CONTROL UNIT INTERFACES WITH FLEXIBLE INPUT SIGNAL CONDI...

WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND...

WEARABLE ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE

PRINTED CIRCUIT BOARD

METHOD FOR FORMING CIRCUIT BOARD

PRINTED CIRCUIT BOARD