having a programmable lay-out

Industry

CPC
H05K1/029

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/029having a programmable lay-out

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 12,144,114
- Issue date Nov 12, 2024
- Kyocera Corporation
- Kanae Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,144,159
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolator
- Patent number 12,142,411
- Issue date Nov 12, 2024
- Kabushiki Kaisha Toshiba
- Ryohei Nega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Educational electronics systems and methods
- Patent number 12,137,520
- Issue date Nov 5, 2024
- HEATHKIT COMPANY, INC.
- Andrew S. Cromarty
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electromagnetic interference shields having attentuation interfaces
- Patent number 12,133,322
- Issue date Oct 29, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for multiple input power distribution to adjac...
- Patent number 12,126,147
- Issue date Oct 22, 2024
- Legrand DPC, LLC
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer printed circuit board
- Patent number 12,127,341
- Issue date Oct 22, 2024
- Thales
- Geoffroy Aupee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and memory system
- Patent number 12,127,346
- Issue date Oct 22, 2024
- Kioxia Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,127,340
- Issue date Oct 22, 2024
- Kyocera Corporation
- Yoshihiro Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,127,343
- Issue date Oct 22, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joo Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current sensors for power converters
- Patent number 12,126,264
- Issue date Oct 22, 2024
- Apple Inc.
- Brandon Pierquet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,120,815
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit board
- Patent number 12,109,955
- Issue date Oct 8, 2024
- Yazaki Corporation
- Hayato Yamaguchi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layout structure and method for fabricating same
- Patent number 12,113,531
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yingdong Guo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and probe card
- Patent number 12,114,423
- Issue date Oct 8, 2024
- Kyocera Corporation
- Youichiro Honda
- G01 - MEASURING TESTING
Information Patent Grant
Module and manufacturing method of the same
- Patent number 12,108,526
- Issue date Oct 1, 2024
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filter device
- Patent number 12,108,527
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Wataru Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded bridge
- Patent number 12,108,532
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Seok Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and printed circuit board package
- Patent number 12,108,535
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Yun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and substrate
- Patent number 12,101,886
- Issue date Sep 24, 2024
- Sony Group Corporation
- Keiichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and semi-finished product thereof, floodligh...
- Patent number 12,101,877
- Issue date Sep 24, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhen Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Massage roller and conductive structure thereof
- Patent number 12,090,108
- Issue date Sep 17, 2024
- Xiamen High Top Electronic Technology Co., Ltd.
- Liangsan Zhao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Power electronics device assemblies including dual graphite layers...
- Patent number 12,096,596
- Issue date Sep 17, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20240389226
- Publication date Nov 21, 2024
- KYOCERA CORPORATION
- Yuhei MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240381533
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE LAMINATE MATERIAL
- Publication number 20240381528
- Publication date Nov 14, 2024
- THE CHEMOURS COMPANY FC, LLC
- RONG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY CARD MODULE AND ELECTRONIC DEVICE
- Publication number 20240377866
- Publication date Nov 14, 2024
- ASUS GLOBAL PTE. LTD.
- Jingwen Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240381527
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Jae Hwa KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD
- Publication number 20240381526
- Publication date Nov 14, 2024
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...
- Publication number 20240373543
- Publication date Nov 7, 2024
- GUANGZHOU ON-BRIGHT ELECTRONICS CO., LTD.
- XIAOKUI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20240373549
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Tomonori KATSURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR WIRING BOARD
- Publication number 20240365466
- Publication date Oct 31, 2024
- YAZAKI CORPORATION
- Hideaki Kikuchi
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD
- Publication number 20240365477
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240365467
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240365473
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIEN LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LUBRICANT DISPENSER
- Publication number 20240353059
- Publication date Oct 24, 2024
- perma-tec GmbH & Co. KG
- Ralf ENGELHARDT
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
CURRENT SENSOR
- Publication number 20240345139
- Publication date Oct 17, 2024
- YAZAKI CORPORATION
- Yasunori KAWAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240349426
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit layout of printed circuit board
- Publication number 20240349421
- Publication date Oct 17, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- CHIA-LUNG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240339413
- Publication date Oct 10, 2024
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSIT...
- Publication number 20240334597
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240334601
- Publication date Oct 3, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangho Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240334596
- Publication date Oct 3, 2024
- TDK Corporation
- Mikihiro KUMON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD
- Publication number 20240334607
- Publication date Oct 3, 2024
- Panasonic Automotive Systems Co., Ltd.
- Mitsunori HAYASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRON...
- Publication number 20240306302
- Publication date Sep 12, 2024
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS
- Publication number 20240305184
- Publication date Sep 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240304450
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND LAYOUT METHOD THEREOF
- Publication number 20240306291
- Publication date Sep 12, 2024
- HTC CORPORATION
- Che-Jung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having a programmable lay-out

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic element mounting substrate, electronic device, and elect...

Module

Isolator

Educational electronics systems and methods

Bus bar link for battery cell interconnections in a battery module

Electromagnetic interference shields having attentuation interfaces

Patterned article including electrically conductive elements

Method and apparatus for multiple input power distribution to adjac...

Multilayer printed circuit board

Substrate and memory system

Wiring substrate

Printed circuit board

Current sensors for power converters

Multilayer substrate

Electrical circuit board

Manufacturing method for double-sided wiring circuit board and doub...

Layout structure and method for fabricating same

Heat removal from silicon photonics chip using a recessed side-by-s...

Circuit board and probe card

Module and manufacturing method of the same

Filter device

Printed circuit board with embedded bridge

Circuit board structure and manufacturing method thereof

Printed circuit board and printed circuit board package

Circuit board using thermocouple to dissipate generated heat and me...

Electronic apparatus and substrate

Circuit board assembly and semi-finished product thereof, floodligh...

Semiconductor memory system

Massage roller and conductive structure thereof

Power electronics device assemblies including dual graphite layers...

Patents Applicationslast 30 patents

WIRING BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

FLEXIBLE LAMINATE MATERIAL

DISPLAY CARD MODULE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

MULTILAYER SUBSTRATE

VEHICULAR WIRING BOARD

CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

LUBRICANT DISPENSER

CURRENT SENSOR

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

Circuit layout of printed circuit board

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSIT...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD

MOUNTING BOARD

Component Carrier Method of Manufacturing the Component Carrier and...

WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRON...

DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS

ELECTRONIC PACKAGE STRUCTURE

PATTERNED CONDUCTIVE ARTICLE

CIRCUIT BOARD AND LAYOUT METHOD THEREOF