having an amorphous microstructure

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CPC
H01L2924/05494

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/05494having an amorphous microstructure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with modified pad spacing structure
- Patent number 9,922,948
- Issue date Mar 20, 2018
- United Microelectronics Corp.
- Po-Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with a double metal contact and related...
- Patent number 9,761,550
- Issue date Sep 12, 2017
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a double metal contact
- Patent number 8,791,525
- Issue date Jul 29, 2014
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234340
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240113056
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079364
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MODIFIED PAD SPACING STRUCTURE
- Publication number 20170287858
- Publication date Oct 5, 2017
- United Microelectronics Corp.
- Po-Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with a Double Metal Contact and Related...
- Publication number 20160233185
- Publication date Aug 11, 2016
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with a Double Metal Contact
- Publication number 20140327057
- Publication date Nov 6, 2014
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE INCLUDING A DOUBLE METAL CONTACT
- Publication number 20090212435
- Publication date Aug 27, 2009
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS

having an amorphous microstructure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with modified pad spacing structure

Power semiconductor device with a double metal contact and related...

Power semiconductor device including a double metal contact

Patents Applicationslast 30 patents

DIRECT BONDING METHODS AND STRUCTURES

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

Die Structures and Methods of Forming the Same

SEMICONDUCTOR DEVICE WITH MODIFIED PAD SPACING STRUCTURE

Power Semiconductor Device with a Double Metal Contact and Related...

Power Semiconductor Device with a Double Metal Contact

POWER SEMICONDUCTOR DEVICE INCLUDING A DOUBLE METAL CONTACT