having an array of bottom contacts

Industry

CPC
H05K3/3436

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3436having an array of bottom contacts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct wire attachment methods and apparatus for a BGA component
- Patent number 12,177,989
- Issue date Dec 24, 2024
- ATL TECHNOLOGY, LLC
- Donovan M. Finnestad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna-in-package devices and methods of making
- Patent number 12,136,759
- Issue date Nov 5, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding methods for fine-pitch components and corresponding compo...
- Patent number 12,136,580
- Issue date Nov 5, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and fabrication method thereof
- Patent number 12,133,337
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and electronic device
- Patent number 12,114,418
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Yongyao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package structure and method for fabricating the same
- Patent number 12,089,346
- Issue date Sep 10, 2024
- Realtek Semiconductor Corp.
- Hai-Tao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder balls metallised on the surface and calibrated for...
- Patent number 12,030,138
- Issue date Jul 9, 2024
- LIPCO INDUSTRIE
- Constantin Iacob
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure electronic circuit and corresponding assembly process
- Patent number 12,028,981
- Issue date Jul 2, 2024
- BANKS AND ACQUIRERS INTERNATIONAL HOLDING
- Michel Rossignol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switched capacitor converter package structure and method
- Patent number 12,028,980
- Issue date Jul 2, 2024
- Halo Microelectronics International
- Rui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array underfilling systems
- Patent number 11,984,390
- Issue date May 14, 2024
- Hamilton Sundstrand Corporation
- Eileen A. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing circuit boards
- Patent number 11,974,404
- Issue date Apr 30, 2024
- TOPPAN INC.
- Yuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crack sensor for sensing cracks in a solder pad, and method for pro...
- Patent number 11,908,809
- Issue date Feb 20, 2024
- STMicroelectronics (Crolles 2) SAS
- Eric Sabouret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring-board islands for connecting chip packages and metho...
- Patent number 11,877,403
- Issue date Jan 16, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for providing a scalable ball grid array (BGA)...
- Patent number 11,817,378
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Nelly Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assemblies
- Patent number 11,805,602
- Issue date Oct 31, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with edge bond dam
- Patent number 11,765,836
- Issue date Sep 19, 2023
- Xilinx, Inc.
- Bhavesh Patel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device
- Patent number 11,765,832
- Issue date Sep 19, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
- Publication number 20250048561
- Publication date Feb 6, 2025
- Tesla, Inc.
- Vijaykumar KRITHIVASAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
- Publication number 20250029785
- Publication date Jan 23, 2025
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20250024608
- Publication date Jan 16, 2025
- Innolux Corporation
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20250023227
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS
- Publication number 20240381534
- Publication date Nov 14, 2024
- Endress+Hauser SE+Co. KG
- Romuald Girardey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assembly
- Publication number 20240347939
- Publication date Oct 17, 2024
- TE Connectivity Solutions GMBH
- Wei (David) Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20240324109
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES
- Publication number 20240284603
- Publication date Aug 22, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Eitan Ariel Caplan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A...
- Publication number 20240244761
- Publication date Jul 18, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Zhiyang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
- Publication number 20240147624
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- NORITAKE TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240098907
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- HyoDong RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240074048
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...
- Publication number 20240057265
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY AND CONFIGURATION METHOD OF THE SAME
- Publication number 20240047325
- Publication date Feb 8, 2024
- Realtek Semiconductor Corp.
- CHIN-YUAN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ARRANGEMENT
- Publication number 20240038651
- Publication date Feb 1, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED COMPONENT ARRAY STRUCTURE
- Publication number 20240015887
- Publication date Jan 11, 2024
- Tesla, Inc.
- Jin Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Identification Data Set for Electronic Modules
- Publication number 20240013511
- Publication date Jan 11, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Peter Frühauf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE...
- Publication number 20230422398
- Publication date Dec 28, 2023
- Global Unichip Corporation
- Chih-Chieh LIAO
- H01 - BASIC ELECTRIC ELEMENTS

having an array of bottom contacts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-on-package assembly with wire bond vias

Fine pitch copper pillar package and method

Direct wire attachment methods and apparatus for a BGA component

Antenna-in-package devices and methods of making

Embedding methods for fine-pitch components and corresponding compo...

Circuit structure and fabrication method thereof

Bridge interconnection with layered interconnect structures

Multilayer capacitor and circuit board containing the same

Electronic module and electronic device

System and method for creating orthogonal solder interconnects

QFN device having a mechanism that enables an inspectable solder jo...

Die package structure and method for fabricating the same

Stackable via package and method

Composite solder balls metallised on the surface and calibrated for...

Semiconductor package with stress reduction design and method for f...

Secure electronic circuit and corresponding assembly process

Switched capacitor converter package structure and method

High density organic bridge device and method

Chiplets with connection posts

Methods and heat distribution devices for thermal management of chi...

Ball grid array underfilling systems

Method of producing circuit boards

Vacuum-assisted BGA joint formation

Low cost panel AESA with thermal management

Crack sensor for sensing cracks in a solder pad, and method for pro...

Printed wiring-board islands for connecting chip packages and metho...

Apparatus and method for providing a scalable ball grid array (BGA)...

Chip assemblies

Integrated circuit device with edge bond dam

Printed circuit board and electronic device

Patents Applicationslast 30 patents

FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...

Multilayer Capacitor and Circuit Board Containing the Same

CIRCUIT STRUCTURE

Antenna-in-Package Devices and Methods of Making

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS

Electronic Assembly

Methods And Heat Distribution Devices For Thermal Management Of Chi...

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT

REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A...

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

CHIPLETS WITH CONNECTION POSTS

ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...

BALL GRID ARRAY AND CONFIGURATION METHOD OF THE SAME

CIRCUIT BOARD ARRANGEMENT

STACKED COMPONENT ARRAY STRUCTURE

Identification Data Set for Electronic Modules

ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE...