having an external coating

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H01L2224/83395

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83395having an external coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Graphene-coated heat spreader for integrated circuit device assemblies
- Patent number 12,154,839
- Issue date Nov 26, 2024
- Advanced Micro Devices, Inc.
- Xiaoyang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure production method and bonding structure
- Patent number 12,094,850
- Issue date Sep 17, 2024
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure on gold thin film
- Patent number 10,668,696
- Issue date Jun 2, 2020
- Fujikura Ltd.
- Shohei Kumeta
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method for producing member for semiconductor device and semiconduc...
- Patent number 10,153,246
- Issue date Dec 11, 2018
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding structure and wafer bonding method
- Patent number 10,121,762
- Issue date Nov 6, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit boards
- Patent number 9,648,720
- Issue date May 9, 2017
- Semblant Global Limited
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package without chip carrier
- Patent number 9,190,296
- Issue date Nov 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package without chip carrier and fabrication method t...
- Patent number 8,975,734
- Issue date Mar 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die underfill structure and method
- Patent number 8,823,168
- Issue date Sep 2, 2014
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards
- Patent number 8,492,898
- Issue date Jul 23, 2013
- Semblant Global Limited
- Frank Ferdinandi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20240404978
- Publication date Dec 5, 2024
- Shinko Electric Industries Co., Ltd.
- Masaya Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230282611
- Publication date Sep 7, 2023
- FUJI ELECTRIC CO., LTD.
- Hiroki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
- Publication number 20230197555
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- XIAOYANG JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE PRODUCTION METHOD AND BONDING STRUCTURE
- Publication number 20220230988
- Publication date Jul 21, 2022
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE, OPTICAL COMMUNICATION DEVICE, AND MANUFACTURING MET...
- Publication number 20200144213
- Publication date May 7, 2020
- Fujitsu Limited
- Norio KAINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20190081020
- Publication date Mar 14, 2019
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE AND WAFER BONDING METHOD
- Publication number 20180151535
- Publication date May 31, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER
- Publication number 20140315351
- Publication date Oct 23, 2014
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140147695
- Publication date May 29, 2014
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Die Underfill Structure And Method
- Publication number 20140061896
- Publication date Mar 6, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards
- Publication number 20130334292
- Publication date Dec 19, 2013
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD T...
- Publication number 20120007234
- Publication date Jan 12, 2012
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards
- Publication number 20100025091
- Publication date Feb 4, 2010
- Frank Ferdinandi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having an external coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Graphene-coated heat spreader for integrated circuit device assemblies

Bonding structure production method and bonding structure

Semiconductor element bonding structure, method for producing semic...

Member for semiconductor device

Bonding structure on gold thin film

Method for producing member for semiconductor device and semiconduc...

Wafer bonding structure and wafer bonding method

Method for manufacturing printed circuit boards

Fabrication method of semiconductor package without chip carrier

Semiconductor package without chip carrier and fabrication method t...

Die underfill structure and method

Printed circuit boards

Patents Applicationslast 30 patents

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES

BONDING STRUCTURE PRODUCTION METHOD AND BONDING STRUCTURE

OPTICAL MODULE, OPTICAL COMMUNICATION DEVICE, AND MANUFACTURING MET...

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...

WAFER BONDING STRUCTURE AND WAFER BONDING METHOD

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

Die Underfill Structure And Method

Printed Circuit Boards

SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD T...

Printed Circuit Boards