having an external coating

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H01L2224/85375

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85375having an external coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having controller with graphite sheet
- Patent number 11,791,234
- Issue date Oct 17, 2023
- Kioxia Corporation
- Ryo Kamoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,978,414
- Issue date Apr 13, 2021
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,607,954
- Issue date Mar 31, 2020
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,586,776
- Issue date Mar 10, 2020
- ABLIC INC.
- Yoichi Mimuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,297,562
- Issue date May 21, 2019
- ABLIC INC.
- Kaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for assembling a microelectronic chip element on a wire elem...
- Patent number 9,953,953
- Issue date Apr 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for production
- Patent number 9,754,912
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,685,347
- Issue date Jun 20, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,595,469
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing semiconductor device
- Patent number 9,508,803
- Issue date Nov 29, 2016
- Rohm Co., Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for production
- Patent number 9,368,447
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
OLED device in contact with a conductor
- Patent number 9,362,525
- Issue date Jun 7, 2016
- Koninklijke Philips Electronics N.V.
- Jeroen Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device and method of formation thereof
- Patent number 9,034,677
- Issue date May 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of light-emitting device
- Patent number 8,987,021
- Issue date Mar 24, 2015
- Toyoda Gosei Co., Ltd.
- Mineo Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a bond
- Patent number 8,955,219
- Issue date Feb 17, 2015
- Infineon Technologies AG
- Roman Roth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor structure having metal oxide or nirtride passivation...
- Patent number 8,872,341
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Gerald Dallmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of reactive metal surfaces of semiconductor devices duri...
- Patent number 8,828,888
- Issue date Sep 9, 2014
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interconnects and method o...
- Patent number 8,802,555
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming
- Patent number 8,786,084
- Issue date Jul 22, 2014
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having copper interconnect for bonding
- Patent number 8,759,970
- Issue date Jun 24, 2014
- Round Rock Research, LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting a device with a conductor
- Patent number 8,679,867
- Issue date Mar 25, 2014
- Koninklijke Philips N.V.
- Jeroen Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of forming same
- Patent number 8,642,393
- Issue date Feb 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20220102239
- Publication date Mar 31, 2022
- KIOXIA Corporation
- Ryo KAMODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20200185343
- Publication date Jun 11, 2020
- ABLIC Inc.
- Shinjiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING A MICROELECTRONIC CHIP ELEMENT ON A WIRE ELEM...
- Publication number 20150024589
- Publication date Jan 22, 2015
- COMMISSARIAT A L'ENERGIE ATOMIQUE AUX ENERGIES ALTERNATIVES
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Device and Method of Formation Thereof
- Publication number 20140248730
- Publication date Sep 4, 2014
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OLED DEVICE IN CONTACT WITH A CONDUCTOR
- Publication number 20140167023
- Publication date Jun 19, 2014
- Koninklijke Philips N.V.
- JEROEN HENRI ANTOINE MARIA VAN BUUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20140110838
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS
- Publication number 20140061910
- Publication date Mar 6, 2014
- CHU-CHUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Forming Same
- Publication number 20140042621
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20130328197
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE
- Publication number 20130330852
- Publication date Dec 12, 2013
- Mineo OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...
- Publication number 20130285056
- Publication date Oct 31, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A CONTACT PAD
- Publication number 20130180945
- Publication date Jul 18, 2013
- INFINEON TECHNOLOGIES AG
- Marco Koitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130106388
- Publication date May 2, 2013
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MEMS DEVICE AND METHOD OF FORMATION THEREOF
- Publication number 20130037891
- Publication date Feb 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120267682
- Publication date Oct 25, 2012
- Renesas Electronics Corporation
- TAKAMITSU KANAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
- Publication number 20120241931
- Publication date Sep 27, 2012
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION OF REACTIVE METAL SURFACES OF SEMICONDUCTOR DEVICES DURI...
- Publication number 20120235285
- Publication date Sep 20, 2012
- GLOBALFOUNDRIES INC.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHO...
- Publication number 20120228768
- Publication date Sep 13, 2012
- Reza Argenty Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR WET PASSIVATION OF BOND PADS FOR PROTECTION AGAINST SUB...
- Publication number 20120225567
- Publication date Sep 6, 2012
- Mattia Cichocki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20120208321
- Publication date Aug 16, 2012
- Nordson Corporation
- David Keating Foote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120074573
- Publication date Mar 29, 2012
- Gerald DALLMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120049290
- Publication date Mar 1, 2012
- Masaki Shiraishi
- G05 - CONTROLLING REGULATING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20120025384
- Publication date Feb 2, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...
- Publication number 20120009780
- Publication date Jan 12, 2012
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120001324
- Publication date Jan 5, 2012
- Kabushiki Kaisha Toshiba
- Hideo AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110163431
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTING A DEVICE WITH A CONDUCTOR
- Publication number 20110156091
- Publication date Jun 30, 2011
- Koninklijke Philips Electronics N.V.
- Jeroem Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110037450
- Publication date Feb 17, 2011
- Masaki Shiraishi
- G05 - CONTROLLING REGULATING

having an external coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Semiconductor device having controller with graphite sheet

Power semiconductor chip, method for producing a power semiconducto...

Method of forming an aluminum oxide layer, metal surface with alumi...

Semiconductor device, electronic component and method

Semiconductor device and method of manufacturing a semiconductor de...

Method of forming an electrical contact and method of forming a chi...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and method of manufacturing the same

Chip package and method of forming a chip package with a metal cont...

Semiconductor device and method of manufacturing a semiconductor de...

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Method for assembling a microelectronic chip element on a wire elem...

Electronic device and method for production

Semiconductor device and method for producing the same

Semiconductor device and method for producing the same

Semiconductor device and method for producing semiconductor device

Electronic device and method for production

OLED device in contact with a conductor

Semiconductor structure with low-melting-temperature conductive reg...

MEMS device and method of formation thereof

Manufacturing method of light-emitting device

Method for fabricating a bond

Semiconductor structure having metal oxide or nirtride passivation...

Protection of reactive metal surfaces of semiconductor devices duri...

Integrated circuit packaging system with interconnects and method o...

Semiconductor package and method of forming

Semiconductor device having copper interconnect for bonding

Contacting a device with a conductor

Package on package devices and methods of forming same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

METHOD FOR ASSEMBLING A MICROELECTRONIC CHIP ELEMENT ON A WIRE ELEM...

MEMS Device and Method of Formation Thereof

OLED DEVICE IN CONTACT WITH A CONDUCTOR

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS

Package on Package Devices and Methods of Forming Same

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

METHOD OF PROCESSING A CONTACT PAD

SEMICONDUCTOR DEVICE

MEMS DEVICE AND METHOD OF FORMATION THEREOF

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...

PROTECTION OF REACTIVE METAL SURFACES OF SEMICONDUCTOR DEVICES DURI...

INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHO...

PROCESS FOR WET PASSIVATION OF BOND PADS FOR PROTECTION AGAINST SUB...

PASSIVATION LAYER FOR SEMICONDUCTOR DEVICE PACKAGING

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CONTACTING A DEVICE WITH A CONDUCTOR

SEMICONDUCTOR DEVICE