having an external coating

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H01L2224/81375

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81375having an external coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Injection molded solder bumping
- Patent number 10,037,967
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,824,991
- Issue date Nov 21, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow-cavity flip-chip package with reinforced interconnects and p...
- Patent number 9,793,237
- Issue date Oct 17, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,583,390
- Issue date Feb 28, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip package using hydrophobic surface
- Patent number 9,570,415
- Issue date Feb 14, 2017
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hyo Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,257,276
- Issue date Feb 9, 2016
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection and method of manufacturing the same
- Patent number 8,079,141
- Issue date Dec 20, 2011
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20230057113
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED DIE SEMICONDUCTOR DEVICE
- Publication number 20180342483
- Publication date Nov 29, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER BUMPING
- Publication number 20180277509
- Publication date Sep 27, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...
- Publication number 20170110434
- Publication date Apr 20, 2017
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE
- Publication number 20150311177
- Publication date Oct 29, 2015
- Korea Advanced Institute of Science and Technology
- Hyo Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20140138818
- Publication date May 22, 2014
- Alexsandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...
- Publication number 20130285056
- Publication date Oct 31, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130277850
- Publication date Oct 24, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PARTICLE ATTACHMENT MATERIAL
- Publication number 20110278351
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND ME...
- Publication number 20100313416
- Publication date Dec 16, 2010
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

having an external coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Injection molded solder bumping

Organic thin film passivation of metal interconnections

Hollow-cavity flip-chip package with reinforced interconnects and p...

Organic thin film passivation of metal interconnections

Chip packaging method and chip package using hydrophobic surface

Semiconductor structure with low-melting-temperature conductive reg...

Organic thin film passivation of metal interconnections

Electrical connection and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

ANGLED DIE SEMICONDUCTOR DEVICE

INJECTION MOLDED SOLDER BUMPING

HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...

CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

ELECTRONIC DEVICE

MAGNETIC PARTICLE ATTACHMENT MATERIAL

METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND ME...