having an external coating

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H01L2224/82375

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82375having an external coating

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulated electronic part packaging structure
- Patent number 7,414,309
- Issue date Aug 19, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic part packaging structure
- Patent number 7,229,856
- Issue date Jun 12, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20160141265
- Publication date May 19, 2016
- Intel Corporation
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20140177193
- Publication date Jun 26, 2014
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic parts and method of manufacturing electronic parts packa...
- Publication number 20070052086
- Publication date Mar 8, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic parts and method of manufacturing electronic parts packa...
- Publication number 20050258447
- Publication date Nov 24, 2005
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS