having an external coating

Industry

CPC
H01L2224/81395

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81395having an external coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer
- Patent number 11,728,180
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package carrier board, method for fabricating the sam...
- Patent number 11,404,348
- Issue date Aug 2, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,315,866
- Issue date Apr 26, 2022
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer and method fo...
- Patent number 11,302,537
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 11,094,604
- Issue date Aug 17, 2021
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 10,658,279
- Issue date May 19, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,651,052
- Issue date May 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 10,636,722
- Issue date Apr 28, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 10,373,902
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
High density package interconnects
- Patent number 10,204,851
- Issue date Feb 12, 2019
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with solder ball revealed through layer
- Patent number 10,134,699
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 9,922,916
- Issue date Mar 20, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,917,025
- Issue date Mar 13, 2018
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,820,391
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,793,200
- Issue date Oct 17, 2017
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body
- Patent number 9,673,168
- Issue date Jun 6, 2017
- Dexerials Corporation
- Kenichi Saruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit boards
- Patent number 9,648,720
- Issue date May 9, 2017
- Semblant Global Limited
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip package using hydrophobic surface
- Patent number 9,570,415
- Issue date Feb 14, 2017
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hyo Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact smart card
- Patent number 9,524,459
- Issue date Dec 20, 2016
- Johnson Electric S.A.
- Vincent Daniel Jean Salle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip support substrate, chip support method, three-dimensional inte...
- Patent number 9,449,948
- Issue date Sep 20, 2016
- Tohoku University
- Mitsumasa Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate
- Patent number 9,425,066
- Issue date Aug 23, 2016
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with surface treatment and meth...
- Patent number 9,385,100
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 9,368,437
- Issue date Jun 14, 2016
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a circuit substrate
- Patent number 9,324,580
- Issue date Apr 26, 2016
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly and methods for forming the same
- Patent number 9,287,246
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of semiconductor package without chip carrier
- Patent number 9,190,296
- Issue date Nov 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20240387192
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240234364
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240136322
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...
- Publication number 20230411269
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20230335411
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER
- Publication number 20220238352
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...
- Publication number 20210313195
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES WITH UNIFORM SOLDER JOINTS
- Publication number 20210066239
- Publication date Mar 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE CARRIER BOARD, METHOD FOR FABRICATING THE SAM...
- Publication number 20200388552
- Publication date Dec 10, 2020
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method to Enhance Solder Joint Reliability
- Publication number 20200219787
- Publication date Jul 9, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190326194
- Publication date Oct 24, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20190172778
- Publication date Jun 6, 2019
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190096783
- Publication date Mar 28, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Solder Ball Revealed Through Layer
- Publication number 20170125367
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20160284635
- Publication date Sep 29, 2016
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE
- Publication number 20150311177
- Publication date Oct 29, 2015
- Korea Advanced Institute of Science and Technology
- Hyo Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER
- Publication number 20140315351
- Publication date Oct 23, 2014
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SMART CARD
- Publication number 20140306016
- Publication date Oct 16, 2014
- JOHNSON ELECTRIC S.A.
- Vincent Daniel Jean SALLE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...
- Publication number 20140220737
- Publication date Aug 7, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20140217579
- Publication date Aug 7, 2014
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20140187000
- Publication date Jul 3, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE GRID ARRAY LEAD F...
- Publication number 20140165389
- Publication date Jun 19, 2014
- Byung Tai DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
- Publication number 20140106511
- Publication date Apr 17, 2014
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20140077357
- Publication date Mar 20, 2014
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Assembly and Methods for Forming the Same
- Publication number 20140045379
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards
- Publication number 20130334292
- Publication date Dec 19, 2013
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130277850
- Publication date Oct 24, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS

having an external coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with nickel layer

Chip package structure with conductive adhesive layer

Semiconductor package carrier board, method for fabricating the sam...

Semiconductor device

Chip package structure with conductive adhesive layer and method fo...

System and method to enhance reliability in connection with arrange...

System and method to enhance solder joint reliability

High density package interconnects

Semiconductor package structure and method for manufacturing the same

System and method to enhance solder joint reliability

Fully molded miniaturized semiconductor module

Cu core ball, solder paste, formed solder, Cu core column, and sold...

High density package interconnects

Packages with solder ball revealed through layer

Bonding structure for semiconductor package and method of manufactu...

High density package interconnects

Printed wiring board and method for manufacturing printed wiring board

Wiring board

Printed wiring board

Connection body

Method for manufacturing printed circuit boards

Chip packaging method and chip package using hydrophobic surface

Contact smart card

Chip support substrate, chip support method, three-dimensional inte...

Circuit substrate

Integrated circuit packaging system with surface treatment and meth...

High density package interconnects

Process for fabricating a circuit substrate

Package assembly and methods for forming the same

Fabrication method of semiconductor package without chip carrier

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...

PACKAGED SEMICONDUCTOR DEVICES WITH UNIFORM SOLDER JOINTS

SEMICONDUCTOR PACKAGE CARRIER BOARD, METHOD FOR FABRICATING THE SAM...

System and Method to Enhance Solder Joint Reliability

SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY

HIGH DENSITY PACKAGE INTERCONNECTS

SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

Packages with Solder Ball Revealed Through Layer

HIGH DENSITY PACKAGE INTERCONNECTS

CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER

CONTACT SMART CARD

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...

HIGH DENSITY PACKAGE INTERCONNECTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE GRID ARRAY LEAD F...

FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS

CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME

Package Assembly and Methods for Forming the Same

Printed Circuit Boards

ELECTRONIC DEVICE