having an external coating

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H01L2224/80395

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80395having an external coating

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Patents Grantslast 30 patents

Information Patent Grant
Chip bonding region of a carrier of light emitting package and manu...
- Patent number 11,456,405
- Issue date Sep 27, 2022
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum dot LED package and quantum dot LED module including the same
- Patent number 11,011,689
- Issue date May 18, 2021
- LUMENS CO., LTD.
- Sunghwan Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE SURFACE TREATMENT APPARATUS AND DIE BONDING SYSTEM INCLUDING TH...
- Publication number 20230343740
- Publication date Oct 26, 2023
- SEMES CO., LTD.
- Min Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING
- Publication number 20230029338
- Publication date Jan 26, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING PACKAGE, AND MANUFACTURING METHOD THEREOF, AND CARRIER
- Publication number 20210074896
- Publication date Mar 11, 2021
- LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
- CHEN-HSIU LIN
- H01 - BASIC ELECTRIC ELEMENTS