having interior leads

Industry

CPC
H05K7/1053

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/1053having interior leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,769,718
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector, IC package, and method of mounting contacts to housing o...
- Patent number 11,678,453
- Issue date Jun 13, 2023
- Yamaichi Electronics Co., Ltd.
- Toshiyasu Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,469,166
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical tower power dock
- Patent number 11,437,833
- Issue date Sep 6, 2022
- Yuyi Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device module and method of manufacturing electronic dev...
- Patent number 11,439,011
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sungwon Im
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency BGA connector
- Patent number 11,337,327
- Issue date May 17, 2022
- FCI USA LLC
- Madhumitha Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier
- Patent number 11,064,614
- Issue date Jul 13, 2021
- Tyco Electronics (Shanghai) Co. Ltd.
- Fengchun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for heatsink to rail thermal interface enhancement
- Patent number 10,791,652
- Issue date Sep 29, 2020
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 10,748,841
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with retention structure holding lever
- Patent number 10,581,200
- Issue date Mar 3, 2020
- FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD.
- Wei-Jian Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 10,522,449
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- G01 - MEASURING TESTING
Information Patent Grant
High frequency BGA connector
- Patent number 10,405,448
- Issue date Sep 3, 2019
- FCI USA LLC
- Madhumitha Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device, method of mounting electronic componen...
- Patent number 10,319,682
- Issue date Jun 11, 2019
- Murata Manufacturing Co., Ltd.
- Kazushi Watanabe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heat dissipating structure
- Patent number 10,159,166
- Issue date Dec 18, 2018
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Printed circuit board assembly including conductive heat transfer
- Patent number 9,818,669
- Issue date Nov 14, 2017
- Honeywell International Inc.
- Kirk Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug standards-compliant circuit modules and connectors
- Patent number 9,301,415
- Issue date Mar 29, 2016
- AVANT TECHNOLOGY, INC.
- Paul Goodwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount device
- Patent number 9,241,418
- Issue date Jan 19, 2016
- Nihon Dempa Kogyo Co., Ltd.
- Takayuki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Holding device used for electrical connector
- Patent number 9,214,754
- Issue date Dec 15, 2015
- Hon Hai Precision Industry Co., Ltd.
- Cheng-Chi Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spring loaded lid
- Patent number 9,192,070
- Issue date Nov 17, 2015
- Hewlett-Packard Development Company, L.P.
- Chong S Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retention device and electrical connector assembly used thereof
- Patent number 9,118,141
- Issue date Aug 25, 2015
- Hon Hai Precision Industry Co., Ltd.
- Cheng-Chi Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connector having a reinforcement frame
- Patent number 9,118,128
- Issue date Aug 25, 2015
- Japan Aviation Electronics Industry, Ltd.
- Takeshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electical connector assembly having a block for stoping a chip modu...
- Patent number 9,059,526
- Issue date Jun 16, 2015
- Hon Hai Precision Industry Co., Ltd.
- Chun-Yi Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting adapter, printed board, and manufacturing method thereof
- Patent number 9,049,789
- Issue date Jun 2, 2015
- Fujitsu Limited
- Satoshi Ohsawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with a sleeve assembled thereon
- Patent number 9,022,791
- Issue date May 5, 2015
- Hon Hai Precision Industry Co., Ltd.
- Fang-Jwu Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector assembly and method of assembling the same
- Patent number 8,998,623
- Issue date Apr 7, 2015
- Hon Hai Precision Industry Co., Ltd.
- Shuo-Hsiu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect device employing an array of conductive ela...
- Patent number 8,926,343
- Issue date Jan 6, 2015
- Tyco Electronics Corporation
- Jeffery Walter Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket and device having the socket
- Patent number 8,870,592
- Issue date Oct 28, 2014
- Fujitsu Limited
- Yasushi Masuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with carrier frame loading electronic package
- Patent number 8,834,192
- Issue date Sep 16, 2014
- Hon Hai Precision Industry Co., Ltd.
- Albert Harvey Terhune
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector incorporated with pick-and-place pick-up cap
- Patent number 8,747,120
- Issue date Jun 10, 2014
- Hon Hai Precision Industry Co., Ltd.
- Albert Harvey Terhune
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer chip, multi-chip package including the interposer chip,...
- Patent number 8,729,684
- Issue date May 20, 2014
- Samsung Electronics Co., Ltd.
- Yeong-Lyeol Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20220375839
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TOWER POWER DOCK
- Publication number 20220294241
- Publication date Sep 15, 2022
- YUYI LEE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING ELECTRONIC DEV...
- Publication number 20220132665
- Publication date Apr 28, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sungwon IM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR, IC PACKAGE, AND METHOD OF MOUNTING CONTACTS TO HOUSING O...
- Publication number 20210378121
- Publication date Dec 2, 2021
- Yamaichi Electronics Co., Ltd.
- Toshiyasu ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CONNECTION BOX
- Publication number 20210068287
- Publication date Mar 4, 2021
- YAZAKI CORPORATION
- Hideaki Kanemitsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20200381346
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G01 - MEASURING TESTING
Information Patent Application
Packages with Si-Substrate-Free Interposer and Method Forming Same
- Publication number 20200083151
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier
- Publication number 20200015359
- Publication date Jan 9, 2020
- Tyco Electronics (Shanghai) Co. Ltd.
- Fengchun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY BGA CONNECTOR
- Publication number 20190387638
- Publication date Dec 19, 2019
- FCI USA LLC
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR HEATSINK TO RAIL THERMAL INTERFACE ENHANCEMENT
- Publication number 20190380225
- Publication date Dec 12, 2019
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY BGA CONNECTOR
- Publication number 20180317335
- Publication date Nov 1, 2018
- FCI USA LLC
- Madhumitha Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Si-substrate-free Interposer and Method Forming Same
- Publication number 20180294212
- Publication date Oct 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE, METHOD OF MOUNTING ELECTRONIC COMPONEN...
- Publication number 20180005950
- Publication date Jan 4, 2018
- Murata Manufacturing Co., Ltd.
- Kazushi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING STRUCTURE
- Publication number 20170311482
- Publication date Oct 26, 2017
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CLIP AND ELECTRICAL CONNECTOR ASSEMBLY
- Publication number 20170110816
- Publication date Apr 20, 2017
- FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- MIN TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plug Standards-Compliant Circuit Modules and Connectors
- Publication number 20150163944
- Publication date Jun 11, 2015
- Avant Technology, Inc.
- Paul Goodwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CABLE BACKPLANE SYSTEM
- Publication number 20150163952
- Publication date Jun 11, 2015
- Tyco Electronics Corporation
- Jared Evan Rossman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CABLE BACKPLANE SYSTEM
- Publication number 20150163951
- Publication date Jun 11, 2015
- Tyco Electronics Corporation
- Jared Evan Rossman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CABLE CONNECTOR GRID FRAME FOR A CABLE BACKPLANE SYSTEM
- Publication number 20150163950
- Publication date Jun 11, 2015
- Tyco Electronics Corporation
- Joshua Tyler Sechrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING DEVICE USED FOR ELECTRICAL CONNECTOR
- Publication number 20140329404
- Publication date Nov 6, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHENG-CHI YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CHIP, MULTI-CHIP PACKAGE INCLUDING THE INTERPOSER CHIP,...
- Publication number 20140225113
- Publication date Aug 14, 2014
- Samsung Electronics Co., Ltd.
- Yeong-Lyeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR WITH LOW PROFILE
- Publication number 20140220829
- Publication date Aug 7, 2014
- ALBERT HARVEY TERHUNE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL INTERCONNECT DEVICE
- Publication number 20140206234
- Publication date Jul 24, 2014
- Tyco Electronics Corporation
- Jeffery Walter Mason
- G01 - MEASURING TESTING
Information Patent Application
CENTRAL PROCESSING UNIT SOCKET ASSEMBLY
- Publication number 20140199860
- Publication date Jul 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- AN-GANG LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL INTERCONNECT DEVICE
- Publication number 20140141632
- Publication date May 22, 2014
- Tyco Electronics Corporation
- Jeffery Walter Mason
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETENTION DEVICE AND ELECTRICAL CONNECTOR ASSEMBLY USED THEREOF
- Publication number 20140106605
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- Cheng-Chi Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY AND METHOD OF ASSEMBLING THE SAME
- Publication number 20140106593
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- SHUO-HSIU HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR WITH CARRIER FRAME LOADING ELECTRONIC PACKAGE
- Publication number 20140099827
- Publication date Apr 10, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- ALBERT HARVEY TERHUNE IV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR WITH A SLEEVE ASSEMBLED THEREON
- Publication number 20140080328
- Publication date Mar 20, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- FANG-JWU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR WITH CAP FOR COVERING PARTIAL RECEIVING HOLES
- Publication number 20140038440
- Publication date Feb 6, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- SHUO-HSIU HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having interior leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packages with Si-substrate-free interposer and method forming same

Connector, IC package, and method of mounting contacts to housing o...

Packages with Si-substrate-free interposer and method forming same

Vertical tower power dock

Electronic device module and method of manufacturing electronic dev...

High frequency BGA connector

Carrier

Systems and methods for heatsink to rail thermal interface enhancement

Packages with Si-substrate-free interposer and method forming same

Electrical connector with retention structure holding lever

Packages with Si-substrate-free interposer and method forming same

High frequency BGA connector

Electronic component device, method of mounting electronic componen...

Heat dissipating structure

Printed circuit board assembly including conductive heat transfer

Plug standards-compliant circuit modules and connectors

Surface mount device

Holding device used for electrical connector

Spring loaded lid

Retention device and electrical connector assembly used thereof

Electric connector having a reinforcement frame

Electical connector assembly having a block for stoping a chip modu...

Mounting adapter, printed board, and manufacturing method thereof

Electrical connector with a sleeve assembled thereon

Electrical connector assembly and method of assembling the same

Electrical interconnect device employing an array of conductive ela...

Socket and device having the socket

Electrical connector with carrier frame loading electronic package

Electrical connector incorporated with pick-and-place pick-up cap

Interposer chip, multi-chip package including the interposer chip,...

Patents Applicationslast 30 patents

Packages with Si-Substrate-Free Interposer and Method Forming Same

VERTICAL TOWER POWER DOCK

ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING ELECTRONIC DEV...

CONNECTOR, IC PACKAGE, AND METHOD OF MOUNTING CONTACTS TO HOUSING O...

ELECTRIC CONNECTION BOX

Packages with Si-Substrate-Free Interposer and Method Forming Same

Packages with Si-Substrate-Free Interposer and Method Forming Same

Carrier

HIGH FREQUENCY BGA CONNECTOR

SYSTEMS AND METHODS FOR HEATSINK TO RAIL THERMAL INTERFACE ENHANCEMENT

HIGH FREQUENCY BGA CONNECTOR

Packages with Si-substrate-free Interposer and Method Forming Same

ELECTRONIC COMPONENT DEVICE, METHOD OF MOUNTING ELECTRONIC COMPONEN...

HEAT DISSIPATING STRUCTURE

CLIP AND ELECTRICAL CONNECTOR ASSEMBLY

Plug Standards-Compliant Circuit Modules and Connectors

CABLE BACKPLANE SYSTEM

CABLE BACKPLANE SYSTEM

CABLE CONNECTOR GRID FRAME FOR A CABLE BACKPLANE SYSTEM

HOLDING DEVICE USED FOR ELECTRICAL CONNECTOR

INTERPOSER CHIP, MULTI-CHIP PACKAGE INCLUDING THE INTERPOSER CHIP,...

ELECTRICAL CONNECTOR WITH LOW PROFILE

ELECTRICAL INTERCONNECT DEVICE

CENTRAL PROCESSING UNIT SOCKET ASSEMBLY

ELECTRICAL INTERCONNECT DEVICE

RETENTION DEVICE AND ELECTRICAL CONNECTOR ASSEMBLY USED THEREOF

ELECTRICAL CONNECTOR ASSEMBLY AND METHOD OF ASSEMBLING THE SAME

ELECTRICAL CONNECTOR WITH CARRIER FRAME LOADING ELECTRONIC PACKAGE

ELECTRICAL CONNECTOR WITH A SLEEVE ASSEMBLED THEREON

ELECTRICAL CONNECTOR WITH CAP FOR COVERING PARTIAL RECEIVING HOLES