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HDI interconnects having different materials
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CPC
H01L2224/22505
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/22505
HDI interconnects having different materials
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Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
Publication number
20250112100
Publication date
Apr 3, 2025
Intel Corporation
Robert May
H01 - BASIC ELECTRIC ELEMENTS