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Heads having an integrated circuit

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BPERFORMING OPERATIONS TRANSPORTING B41Printing, stamps B41JTYPEWRITERS SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS B41J2202/00Embodiments of or processes related to ink-jet or thermal heads

Current Industry

B41J2202/13Heads having an integrated circuit
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Fluid ejection devices including a first memory and a second memory
    • Patent number 11,969,997
    • Issue date Apr 30, 2024
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing Ng
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printing consumable and ink cartridge
    • Patent number 11,926,163
    • Issue date Mar 12, 2024
    • GEEHY MICROELECTRONICS INC.
    • Ming Gong
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Temperature detection and control
    • Patent number 11,912,024
    • Issue date Feb 27, 2024
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Wafer structure
    • Patent number 11,813,863
    • Issue date Nov 14, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Sealed interconnects
    • Patent number 11,787,194
    • Issue date Oct 17, 2023
    • Hewlett-Packard Development Company, L.P.
    • Anthony Donald Studer
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Printhead module for pagewide printhead having narrow print zone
    • Patent number 11,760,094
    • Issue date Sep 19, 2023
    • Memjet Technology Limited
    • Jason Mark Thelander
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Wafer structure
    • Patent number 11,738,556
    • Issue date Aug 29, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Logic circuitry
    • Patent number 11,738,562
    • Issue date Aug 29, 2023
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Wafer structure
    • Patent number 11,731,424
    • Issue date Aug 22, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Wafer structure
    • Patent number 11,731,423
    • Issue date Aug 22, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer structure
    • Patent number 11,724,494
    • Issue date Aug 15, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Wafer structure
    • Patent number 11,718,094
    • Issue date Aug 8, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printhead module having alternate longitudinal ink supply channels...
    • Patent number 11,718,096
    • Issue date Aug 8, 2023
    • Memjet Technology Limited
    • Jason Mark Thelander
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Wafer structure
    • Patent number 11,712,890
    • Issue date Aug 1, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Wafer structure
    • Patent number 11,701,884
    • Issue date Jul 18, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Die for a printhead
    • Patent number 11,642,884
    • Issue date May 9, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Wafer structure
    • Patent number 11,639,054
    • Issue date May 2, 2023
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Element substrate, liquid discharge head, and printing apparatus
    • Patent number 11,618,254
    • Issue date Apr 4, 2023
    • Canon Kabushiki Kaisha
    • Takeru Yasuda
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Liquid ejecting apparatus and circuit substrate
    • Patent number 11,559,986
    • Issue date Jan 24, 2023
    • Seiko Epson Corporation
    • Dai Nozawa
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Disposing memory banks and select register
    • Patent number 11,518,177
    • Issue date Dec 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing Ng
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Printing apparatus
    • Patent number 11,510,310
    • Issue date Nov 22, 2022
    • Seiko Epson Corporation
    • Junichi Goto
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection devices including a memory
    • Patent number 11,485,133
    • Issue date Nov 1, 2022
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing Ng
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Logic circuitry for sensor data communications
    • Patent number 11,479,046
    • Issue date Oct 25, 2022
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Temperature detection and control
    • Patent number 11,479,036
    • Issue date Oct 25, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Liquid discharge head substrate, method of manufacturing the same,...
    • Patent number 11,465,417
    • Issue date Oct 11, 2022
    • Canon Kabushiki Kaisha
    • Toru Eto
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid supply control
    • Patent number 11,446,925
    • Issue date Sep 20, 2022
    • Hewlett-Packard Development Company, L.P.
    • Craig Olbrich
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Redundant full color pagewide printhead having narrow print zone
    • Patent number 11,433,673
    • Issue date Sep 6, 2022
    • Memjet Technology Limited
    • Jason Mark Thelander
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Logic circuitry package accessible for a time period duration while...
    • Patent number 11,429,554
    • Issue date Aug 30, 2022
    • Hewlett-Packard Development Company, L.P.
    • Stephen D. Panshin
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Inkjet chip and thermal bubble inkjet printhead using the same
    • Patent number 11,407,225
    • Issue date Aug 9, 2022
    • International United Technology Co., Ltd.
    • Yuan-Liang Lan
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Temperature detection and control
    • Patent number 11,407,220
    • Issue date Aug 9, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

  • Information Patent Application

    ACTIVE CIRCUIT ELEMENTS ON A MEMBRANE
    • Publication number 20230382127
    • Publication date Nov 30, 2023
    • Hewlett-Packard Development Company, L.P.
    • Eric T. Martin
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    INTERSPERSED FLUIDIC ELEMENTS AND CIRCUIT ELEMENTS IN A FLUIDIC DIE
    • Publication number 20230382109
    • Publication date Nov 30, 2023
    • Hewlett-Packard Development Company, L.P.
    • Eric T. Martin
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    ARRANGEMENTS OF CIRCUIT ELEMENTS AND FLUIDIC ELEMENTS
    • Publication number 20230382116
    • Publication date Nov 30, 2023
    • Hewlett-Packard Development Company, L.P.
    • Eric T. Martin
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    Liquid Ejecting Head And Liquid Ejecting Apparatus
    • Publication number 20230373210
    • Publication date Nov 23, 2023
    • SEIKO EPSON CORPORATION
    • Yu HASEGAWA
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    PRINTHEAD MODULE HAVING ALTERNATE PCBS AND ROWS OF PRINT CHIPS
    • Publication number 20230330991
    • Publication date Oct 19, 2023
    • MEMJET TECHNOLOGY LIMITED
    • Jason Mark Thelander
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    DROPLET EJECTOR ASSEMBLY STRUCTURE AND METHODS
    • Publication number 20230182470
    • Publication date Jun 15, 2023
    • 3C PROJECT TECHNOLOGIES LIMITED
    • Gregory John MCAVOY
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    PRINTHEAD MODULE FOR PAGEWIDE PRINTHEAD HAVING NARROW PRINT ZONE
    • Publication number 20220339932
    • Publication date Oct 27, 2022
    • MEMJET TECHNOLOGY LIMITED
    • Jason Mark THELANDER
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICES INCLUDING A MEMORY
    • Publication number 20220314608
    • Publication date Oct 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing NG
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICES INCLUDING A FIRST MEMORY AND A SECOND MEMORY
    • Publication number 20220314609
    • Publication date Oct 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing NG
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICES INCLUDING A FIRST MEMORY AND A SECOND MEMORY
    • Publication number 20220314610
    • Publication date Oct 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing NG
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    PRINTHEAD MODULE HAVING ALTERNATE LONGITUDINAL INK SUPPLY CHANNELS...
    • Publication number 20220266594
    • Publication date Aug 25, 2022
    • MEMJET TECHNOLOGY LIMITED
    • Jason Mark THELANDER
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    WAFER STRUCTURE
    • Publication number 20220161556
    • Publication date May 26, 2022
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    WAFER STRUCTURE
    • Publication number 20220134747
    • Publication date May 5, 2022
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    WAFER STRUCTURE
    • Publication number 20220134748
    • Publication date May 5, 2022
    • Microjet Technology Co., Ltd.
    • Hao-Jan Mou
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    ELEMENT SUBSTRATE, LIQUID DISCHARGE HEAD, AND PRINTING APPARATUS
    • Publication number 20210379890
    • Publication date Dec 9, 2021
    • Canon Kabushiki Kaisha
    • TAKERU YASUDA
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    TEMPERATURE DETECTION AND CONTROL
    • Publication number 20210354457
    • Publication date Nov 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • G01 - MEASURING TESTING
  • Information Patent Application

    TEMPERATURE DETECTION AND CONTROL
    • Publication number 20210354458
    • Publication date Nov 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    DIE FOR A PRINTHEAD
    • Publication number 20210354460
    • Publication date Nov 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    DIE FOR A PRINTHEAD
    • Publication number 20210354462
    • Publication date Nov 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    DISPOSING MEMORY BANKS AND SELECT REGISTER
    • Publication number 20210221144
    • Publication date Jul 22, 2021
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing Ng
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    LIQUID EJECTING APPARATUS AND CIRCUIT SUBSTRATE
    • Publication number 20210197551
    • Publication date Jul 1, 2021
    • SEIKO EPSON CORPORATION
    • Dai NOZAWA
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    HEAD MODULE AND HEAD UNIT
    • Publication number 20210178788
    • Publication date Jun 17, 2021
    • BROTHER KOGYO KABUSHIKI KAISHA
    • Keita Sugiura
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICES INCLUDING A MEMORY
    • Publication number 20210162740
    • Publication date Jun 3, 2021
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing NG
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICES INCLUDING A FIRST MEMORY AND A SECOND MEMORY
    • Publication number 20210162739
    • Publication date Jun 3, 2021
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing NG
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    LOGIC CIRCUITRY
    • Publication number 20210078334
    • Publication date Mar 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • James Michael GARDNER
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    INK AND POWER ARRANGEMENT FOR MODULAR INKJET PRINTHEAD
    • Publication number 20210078322
    • Publication date Mar 18, 2021
    • MEMJET TECHNOLOGY LIMITED
    • Jason Mark Thelander
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    LOGIC CIRCUITRY
    • Publication number 20210081350
    • Publication date Mar 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • Stephen D. PANSHIN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    LIQUID DISCHARGE HEAD SUBSTRATE, METHOD OF MANUFACTURING THE SAME,...
    • Publication number 20210070048
    • Publication date Mar 11, 2021
    • Canon Kabushiki Kaisha
    • Toru Eto
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    INKJET HEAD MANUFACTURING METHOD, INKJET RECORDING DEVICE MANUFACTU...
    • Publication number 20210060952
    • Publication date Mar 4, 2021
    • Konica Minolta, Inc.
    • Yohei SATO
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    LIQUID EJECTING APPARATUS, DRIVE CIRCUIT, AND INTEGRATED CIRCUIT
    • Publication number 20200406609
    • Publication date Dec 31, 2020
    • SEIKO EPSON CORPORATION
    • Tomokazu YAMADA
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS