Heat affected zone [HAZ]

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CPC
H01L2224/48511

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48511Heat affected zone [HAZ]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloyed 2N copper wires for bonding in microelectronics devices
- Patent number 9,589,694
- Issue date Mar 7, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali Sarangapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermally improved semiconductor QFN/SON package
- Patent number 8,242,614
- Issue date Aug 14, 2012
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,183,684
- Issue date May 22, 2012
- Semiconductor Components Industries, LLC
- Isao Nakazato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip attach configuration having improved thermal cha...
- Patent number 8,102,038
- Issue date Jan 24, 2012
- Texas Instruments Incorporated
- Kapil Heramb Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire loop and method of forming the wire loop
- Patent number 8,048,720
- Issue date Nov 1, 2011
- Kulicke and Soffa Industries, Inc.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 7,952,028
- Issue date May 31, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally improved semiconductor QFN/SON package
- Patent number 7,863,103
- Issue date Jan 4, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming wire loop of semiconduc...
- Patent number 7,547,626
- Issue date Jun 16, 2009
- Samsung Techwin Co., Ltd.
- Byung-kil Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of molded QFN device suitable for miniaturizat...
- Patent number 7,504,716
- Issue date Mar 17, 2009
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with welded metal pillar of stacked met...
- Patent number 7,446,419
- Issue date Nov 4, 2008
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile, chip-scale package and method of fabrication
- Patent number 7,309,648
- Issue date Dec 18, 2007
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with welded metal pillar that includes...
- Patent number 7,268,421
- Issue date Sep 11, 2007
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for thin semiconductor package
- Patent number 7,192,861
- Issue date Mar 20, 2007
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile, chip-scale package and method of fabrication
- Patent number 7,135,781
- Issue date Nov 14, 2006
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with welded metal pillar
- Patent number 7,071,573
- Issue date Jul 4, 2006
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacked semiconductor package with metal pillar i...
- Patent number 7,067,911
- Issue date Jun 27, 2006
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with an embedded met...
- Patent number 7,015,128
- Issue date Mar 21, 2006
- Bridge Semiconductor Corporation
- Cheng-Lien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with embedded metal particle
- Patent number 7,009,297
- Issue date Mar 7, 2006
- Bridge Semiconductor Corporation
- Cheng-Lien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-low loop wire bonding
- Patent number 6,933,223
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Lim Peng Soon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling wire balls in electronic bonding
- Patent number 6,898,849
- Issue date May 31, 2005
- Texas Instruments Incorporated
- Luis Trejo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding for thin semiconductor package
- Patent number 6,815,836
- Issue date Nov 9, 2004
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 6,564,989
- Issue date May 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hideyuki Arakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined system, method and apparatus for wire bonding and testing
- Patent number 6,564,115
- Issue date May 13, 2003
- Texas Instruments Incorporated
- Clark Kinnaird
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of size and heat affected zone for fine pitch wire bonding
- Patent number 6,267,290
- Issue date Jul 31, 2001
- International Business Machines Corporation
- Nikhil M. Murdeshwar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of a ball bump for wire bonding and the formation thereof
- Patent number 6,244,499
- Issue date Jun 12, 2001
- Advanced Semiconductor Engineering, Inc.
- Yu-Fang Tsai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Systems And Methods For Improved Delamination Characteristics In A...
- Publication number 20180308713
- Publication date Oct 25, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL TH...
- Publication number 20130233594
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...
- Publication number 20130233593
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
- Publication number 20130180757
- Publication date Jul 18, 2013
- Nippon Micrometal Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONIC...
- Publication number 20130142568
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics D...
- Publication number 20130140068
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES
- Publication number 20130142567
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Alloyed 2N Copper Wires for Bonding in Microelectronics Devices
- Publication number 20130140084
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor Chip Attach Configuration Having Improved Thermal Cha...
- Publication number 20120094441
- Publication date Apr 19, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Heramb SAHASRABUDHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Improved Semiconductor QFN/SON Package
- Publication number 20110068443
- Publication date Mar 24, 2011
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Attach Configuration Having Improved Thermal Cha...
- Publication number 20110068446
- Publication date Mar 24, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Heramb SAHASRABUDHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20100282495
- Publication date Nov 11, 2010
- NIPPON STEEL MATERIALS CO., LTD
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP
- Publication number 20100230809
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY IMPROVED SEMICONDUCTOR QFN/SON PACKAGE
- Publication number 20100096734
- Publication date Apr 22, 2010
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100090330
- Publication date Apr 15, 2010
- SANYO ELECTRIC CO., LTD.
- Isao Nakazato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of forming wire loop of semiconduc...
- Publication number 20080099895
- Publication date May 1, 2008
- Samsung Techwin Co., Ltd.
- Byung-kil Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method of molded QFN device suitable for miniaturizat...
- Publication number 20070090524
- Publication date Apr 26, 2007
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile, Chip-Scale Package and Method of Fabrication
- Publication number 20070020808
- Publication date Jan 25, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low profile, chip-scale package and method of fabrication
- Publication number 20060033219
- Publication date Feb 16, 2006
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding for thin semiconductor package
- Publication number 20050042855
- Publication date Feb 24, 2005
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING FOR THIN SEMICONDUCTOR PACKAGE
- Publication number 20040191954
- Publication date Sep 30, 2004
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for controlling wire balls in electronic bonding
- Publication number 20020056706
- Publication date May 16, 2002
- Luis Trejo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and wire bonding apparatus
- Publication number 20020027151
- Publication date Mar 7, 2002
- Hideyuki Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of a ball bump for wire bonding and the formation thereof
- Publication number 20010022315
- Publication date Sep 20, 2001
- Advanced Semiconductor Engineering, Inc.
- Yu-Fang Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Heat affected zone [HAZ]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coated wire

Systems and methods for improved delamination characteristics in a...

Electronic unit

Electronic device and method of fabricating an electronic device

Alloyed 2N copper wires for bonding in microelectronics devices

Bonding structure of bonding wire

Thermally improved semiconductor QFN/SON package

Semiconductor device and method of manufacturing the same

Semiconductor chip attach configuration having improved thermal cha...

Wire loop and method of forming the wire loop

Bonding wire for semiconductor device

Thermally improved semiconductor QFN/SON package

Semiconductor package and method of forming wire loop of semiconduc...

Structure and method of molded QFN device suitable for miniaturizat...

Semiconductor chip assembly with welded metal pillar of stacked met...

Low profile, chip-scale package and method of fabrication

Semiconductor chip assembly with welded metal pillar that includes...

Wire bonding for thin semiconductor package

Low profile, chip-scale package and method of fabrication

Semiconductor chip assembly with welded metal pillar

Three-dimensional stacked semiconductor package with metal pillar i...

Method of making a semiconductor chip assembly with an embedded met...

Semiconductor chip assembly with embedded metal particle

Ultra-low loop wire bonding

Method for controlling wire balls in electronic bonding

Wire bonding for thin semiconductor package

Wire bonding method and wire bonding apparatus

Combined system, method and apparatus for wire bonding and testing

Control of size and heat affected zone for fine pitch wire bonding

Structure of a ball bump for wire bonding and the formation thereof

Patents Applicationslast 30 patents

Systems And Methods For Improved Delamination Characteristics In A...

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL TH...

COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...

BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE

3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONIC...

Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics D...

DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES

Alloyed 2N Copper Wires for Bonding in Microelectronics Devices

Semiconductor Chip Attach Configuration Having Improved Thermal Cha...

BONDING STRUCTURE OF BONDING WIRE

Thermally Improved Semiconductor QFN/SON Package

Semiconductor Chip Attach Configuration Having Improved Thermal Cha...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP

THERMALLY IMPROVED SEMICONDUCTOR QFN/SON PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package and method of forming wire loop of semiconduc...

Structure and method of molded QFN device suitable for miniaturizat...

Low Profile, Chip-Scale Package and Method of Fabrication

Low profile, chip-scale package and method of fabrication

Wire bonding for thin semiconductor package

WIRE BONDING FOR THIN SEMICONDUCTOR PACKAGE

Method for controlling wire balls in electronic bonding

Wire bonding method and wire bonding apparatus

Structure of a ball bump for wire bonding and the formation thereof