Heat curing

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CPC
H01L2224/85862

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85862Heat curing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for assembling a microelectronic chip element on a wire elem...
- Patent number 9,953,953
- Issue date Apr 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNE...
- Publication number 20110217877
- Publication date Sep 8, 2011
- Torsten Linz
- H01 - BASIC ELECTRIC ELEMENTS