Heat dissipaters releasing heat from coolant

Industry

CPC
H05K7/20263

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20263Heat dissipaters releasing heat from coolant

Industries

Patents Grantslast 30 patents

Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Mobile high performance computing platform for cryptocurrency mining
- Patent number 12,167,569
- Issue date Dec 10, 2024
- DaVinci 3.0 Incorporated
- Patrick J. Sweeney
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-way flow controller paths for single-phase and two-phase cool...
- Patent number 12,160,981
- Issue date Dec 3, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal inkjet printer with integrated cooling
- Patent number 12,151,488
- Issue date Nov 26, 2024
- CONTROL PRINT LIMITED
- Shiva Basant Kabra
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Computing devices with integrated and isolated liquid cooling
- Patent number 12,153,480
- Issue date Nov 26, 2024
- Hewlett-Packard Development Company, L.P.
- John William Pennington
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Methods and systems for fluid immersion cooling
- Patent number 12,156,371
- Issue date Nov 26, 2024
- CGG SERVICES SAS
- Laurent Clerc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating devices
- Patent number 12,150,272
- Issue date Nov 19, 2024
- Kuan Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling assembly for a data center rack and method for assembling a...
- Patent number 12,150,283
- Issue date Nov 19, 2024
- OVH
- Gregory Francis Louis Bauchart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device heat dissipation system with sugar alcohol phase...
- Patent number 12,137,539
- Issue date Nov 5, 2024
- Beihang University
- Yuming Xing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling mass and spring element for low insertion force hot swappab...
- Patent number 12,133,368
- Issue date Oct 29, 2024
- Intel Corporation
- Hardeep Singh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-device-chassis/device movable coupling liquid cooling system
- Patent number 12,130,677
- Issue date Oct 29, 2024
- Dell Products L.P.
- Colin Montgomery
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat exchanger
- Patent number 12,133,358
- Issue date Oct 29, 2024
- Denso Corporation
- Yuya Saito
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Radiator with adapted fins
- Patent number 12,133,359
- Issue date Oct 29, 2024
- Asetek Danmark A/S
- Martin Rønnov Andersen
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Electronic equipment chassis with hybrid cooling compartments
- Patent number 12,127,370
- Issue date Oct 22, 2024
- Dell Products L.P.
- Maunish A. Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid liquid and air cooling in networking equipment
- Patent number 12,120,854
- Issue date Oct 15, 2024
- Ciena Corporation
- Daniel Rivaud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooling heat dissipation plate with unequal height pin-fins...
- Patent number 12,120,845
- Issue date Oct 15, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Yi-Hsin Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid immersion cooler
- Patent number 12,114,464
- Issue date Oct 8, 2024
- TAIWAN MICROLOOPS CORP.
- Chun-Teng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric cabinet with heat dissipation system
- Patent number 12,114,463
- Issue date Oct 8, 2024
- HANGZHOU FULLSEMI SEMICONDUCTOR CO., LTD.
- Jingyang He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management system
- Patent number 12,108,567
- Issue date Oct 1, 2024
- BAE Systems plc
- Graham Andrew Holland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow path module, coolant distribution device, and server
- Patent number 12,108,564
- Issue date Oct 1, 2024
- Wistron Corporation
- Yu-Tang Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air conditioning apparatus and electric control box
- Patent number 12,101,908
- Issue date Sep 24, 2024
- GD MIDEA HEATING & VENTILATING EQUIPMENT CO., LTD.
- Mingren Wang
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Standalone and scalable cooling infrastructure
- Patent number 12,096,603
- Issue date Sep 17, 2024
- Dell Products L.P.
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid cooling systems for electric machines
- Patent number 12,096,606
- Issue date Sep 17, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method for cooling computing devices using a primary cir...
- Patent number 12,089,368
- Issue date Sep 10, 2024
- GREEN REVOLUTION COOLING, INC.
- John Bean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connectors for a networking device with orthogonal switch bars
- Patent number 12,082,365
- Issue date Sep 3, 2024
- Cisco Technology, Inc.
- Pascal Thubert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation member including fin groups
- Patent number 12,061,057
- Issue date Aug 13, 2024
- Nidec Corporation
- Kazuhiro Nishikawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Energy-generating fluid distribution module for servers
- Patent number 12,048,126
- Issue date Jul 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow-through, hot-spot-targeting immersion cooling assembly
- Patent number 12,048,118
- Issue date Jul 23, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT EXCHANGER FOR COOLING ONE OR MORE ELECTRICAL OR ELECTRONIC DEV...
- Publication number 20240422939
- Publication date Dec 19, 2024
- BorgWarner Emissions Systems Spain, S.L.U.
- Xoán HERMIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR POWER ELECTRONICS
- Publication number 20240414881
- Publication date Dec 12, 2024
- Carrier Corporation
- Arindom Joardar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING FIN OF A COOLER, THROUGH WHICH FLUID CAN FLOW, FOR COOLING...
- Publication number 20240414880
- Publication date Dec 12, 2024
- ROBERT BOSCH GmbH
- Marco Lorenz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MAGNETIC PUMPING IN THERMAL MANAGEMENT DEVICES
- Publication number 20240397663
- Publication date Nov 28, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IGBT TEMPERATURE DAMPENING SYSTEMS AND METHODS
- Publication number 20240397678
- Publication date Nov 28, 2024
- The ESAB Group, Inc.
- Erik Anthony Leger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER COOLING SYSTEM WITH DEFORMABLE DUCTS
- Publication number 20240397607
- Publication date Nov 28, 2024
- International Business Machines Corporation
- DUSTIN DEMETRIOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING LIQUID CIRCULATION UNIT, METHOD FOR CONTROLLING SAME, AND P...
- Publication number 20240389266
- Publication date Nov 21, 2024
- Mitsubishi Heavy Industries, Ltd.
- Minoru Matsuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL LIQUID PUMP LIQUID COOLING RADIATOR AND LIQUID COOLING HEAT DI...
- Publication number 20240389275
- Publication date Nov 21, 2024
- Tsung-Hsien Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING DEVICE WITH A HEAT-RESISTING STRUCTURE
- Publication number 20240381568
- Publication date Nov 14, 2024
- Tsung-Hsien Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLER FOR COOLING POWER ELECTRONICS
- Publication number 20240381569
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Maik Paehrisch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240373588
- Publication date Nov 7, 2024
- ZTE Corporation
- Zhenjie LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER, STRUCTURAL BODY, AND METHOD OF PRODUCING STRUCTURAL...
- Publication number 20240373586
- Publication date Nov 7, 2024
- Seiichi ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FAN WITH SUPPORT FRAME HAVING SLIDING FASTENERS
- Publication number 20240369075
- Publication date Nov 7, 2024
- Guangdong Titanium Tantalum Technology Co., Ltd
- Zhenzhi Liang
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
LEAK-LIQUID GUIDING STRUCTURE AND WATER-COOLING AND HEAT-DISSIPATIO...
- Publication number 20240369315
- Publication date Nov 7, 2024
- Delta Electronics, Inc.
- Ming-Tang Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IMMERSION COOLING USING COOLING CONTAINERS FOR AN ELECTRONIC DEVICE
- Publication number 20240365502
- Publication date Oct 31, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Ching-Chun Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER
- Publication number 20240357776
- Publication date Oct 24, 2024
- Beijing Bytedance Network Technology Co., Ltd.
- Tangbo Jing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MODULE AND COMPUTING DEVICE
- Publication number 20240357773
- Publication date Oct 24, 2024
- Huawei Technologies Co., Ltd
- Zelong JIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING CABINET EQUIPMENT AND CONTROL METHOD THEREOF
- Publication number 20240357767
- Publication date Oct 24, 2024
- Lite-On Technology Corporation
- Kun-Sung CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL SYSTEMS FOR AIR-ASSISTED AND LIQUID-COOLED ENCLOSURES
- Publication number 20240357775
- Publication date Oct 24, 2024
- Microsoft Technology Licensing, LLC
- Mark Edward Shaw
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL USE FOR COOLANTS WITH LOW ELECTRICAL CONDUCTIVITY
- Publication number 20240343962
- Publication date Oct 17, 2024
- BASF SE
- Masayuki Hirosue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTAINERIZED SINGLE-PHASE LIQUID IMMERSION COOLING SYSTEM
- Publication number 20240349449
- Publication date Oct 17, 2024
- Hangzhou Dare Rouhan Technology Co., Ltd.
- Minghui SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM, CABINET, AND DATA CENTER
- Publication number 20240349447
- Publication date Oct 17, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Jinliang Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341027
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
SERIALIZED LIQUID COOLING ARRANGEMENTS FOR DATACENTER SERVER RACKS
- Publication number 20240334648
- Publication date Oct 3, 2024
- OVH
- Hadrien BAUDUIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLER
- Publication number 20240334645
- Publication date Oct 3, 2024
- Tsung-Hsien Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSED COOLING SYSTEM AND IMMERSED COOLING CABINET
- Publication number 20240334646
- Publication date Oct 3, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING RADIATOR FOR LIQUID COOLERS
- Publication number 20240318926
- Publication date Sep 26, 2024
- Tsung-Hsien Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PROJECTION DEVICE
- Publication number 20240319573
- Publication date Sep 26, 2024
- CORETRONIC CORPORATION
- Te-Ying Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID COOLING ARRANGEMENT FOR AUTONOMOUS AND IMMERSION COOLED RACKS
- Publication number 20240314972
- Publication date Sep 19, 2024
- OVH
- Mohamad HNAYNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...
- Publication number 20240314973
- Publication date Sep 19, 2024
- Intel Corporation
- Chen ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Heat dissipaters releasing heat from coolant

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Rack system for housing at least one immersion case

Mobile high performance computing platform for cryptocurrency mining

Three-way flow controller paths for single-phase and two-phase cool...

Thermal inkjet printer with integrated cooling

Computing devices with integrated and isolated liquid cooling

Rack system for housing an electronic device

Methods and systems for fluid immersion cooling

Heat dissipating devices

Cooling assembly for a data center rack and method for assembling a...

Data center rack system with integrated liquid and dielectric immer...

Electronic device heat dissipation system with sugar alcohol phase...

Cooling mass and spring element for low insertion force hot swappab...

Multi-device-chassis/device movable coupling liquid cooling system

Heat exchanger

Radiator with adapted fins

Electronic equipment chassis with hybrid cooling compartments

Hybrid liquid and air cooling in networking equipment

Liquid-cooling heat dissipation plate with unequal height pin-fins...

Liquid immersion cooler

Electric cabinet with heat dissipation system

Thermal management system

Flow path module, coolant distribution device, and server

Air conditioning apparatus and electric control box

Standalone and scalable cooling infrastructure

Hybrid cooling systems for electric machines

System and method for cooling computing devices using a primary cir...

Connectors for a networking device with orthogonal switch bars

Heat dissipation member including fin groups

Energy-generating fluid distribution module for servers

Flow-through, hot-spot-targeting immersion cooling assembly

Patents Applicationslast 30 patents

HEAT EXCHANGER FOR COOLING ONE OR MORE ELECTRICAL OR ELECTRONIC DEV...

COOLING SYSTEM FOR POWER ELECTRONICS

COOLING FIN OF A COOLER, THROUGH WHICH FLUID CAN FLOW, FOR COOLING...

SYSTEMS AND METHODS FOR MAGNETIC PUMPING IN THERMAL MANAGEMENT DEVICES

IGBT TEMPERATURE DAMPENING SYSTEMS AND METHODS

COMPUTER COOLING SYSTEM WITH DEFORMABLE DUCTS

COOLING LIQUID CIRCULATION UNIT, METHOD FOR CONTROLLING SAME, AND P...

DUAL LIQUID PUMP LIQUID COOLING RADIATOR AND LIQUID COOLING HEAT DI...

LIQUID COOLING DEVICE WITH A HEAT-RESISTING STRUCTURE

COOLER FOR COOLING POWER ELECTRONICS

HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE

HEAT EXCHANGER, STRUCTURAL BODY, AND METHOD OF PRODUCING STRUCTURAL...

FAN WITH SUPPORT FRAME HAVING SLIDING FASTENERS

LEAK-LIQUID GUIDING STRUCTURE AND WATER-COOLING AND HEAT-DISSIPATIO...

IMMERSION COOLING USING COOLING CONTAINERS FOR AN ELECTRONIC DEVICE

DATA CENTER

COOLING MODULE AND COMPUTING DEVICE

LIQUID COOLING CABINET EQUIPMENT AND CONTROL METHOD THEREOF

CONTROL SYSTEMS FOR AIR-ASSISTED AND LIQUID-COOLED ENCLOSURES

NOVEL USE FOR COOLANTS WITH LOW ELECTRICAL CONDUCTIVITY

CONTAINERIZED SINGLE-PHASE LIQUID IMMERSION COOLING SYSTEM

COOLING SYSTEM, CABINET, AND DATA CENTER

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

SERIALIZED LIQUID COOLING ARRANGEMENTS FOR DATACENTER SERVER RACKS

LIQUID COOLER

IMMERSED COOLING SYSTEM AND IMMERSED COOLING CABINET

LIQUID COOLING RADIATOR FOR LIQUID COOLERS

PROJECTION DEVICE

HYBRID COOLING ARRANGEMENT FOR AUTONOMOUS AND IMMERSION COOLED RACKS

IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...