Heat pipes

Industry

CPC
H05K7/20336

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20336Heat pipes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation structure for optoelectronic module and electronic...
- Patent number 12,242,121
- Issue date Mar 4, 2025
- Ruijie Networks Co., Ltd.
- Xiaolong Lv
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aircraft and method for thermal management
- Patent number 12,245,407
- Issue date Mar 4, 2025
- GE Aviation Systems LLC
- Ronald Jacob Rightnowar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mobile terminal, vapor chamber and preparation method thereof, and...
- Patent number 12,245,402
- Issue date Mar 4, 2025
- HONOR DEVICE CO., LTD.
- Linfang Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat transfer element
- Patent number 12,241,689
- Issue date Mar 4, 2025
- Analog Devices, Inc.
- Marc T. Dunham
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor-air transition detection for two-phase liquid immersion cooling
- Patent number 12,238,896
- Issue date Feb 25, 2025
- Microsoft Technology Licensing, LLC
- Eric Clarence Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fold-out satellite with integrated radiator panel
- Patent number 12,227,313
- Issue date Feb 18, 2025
- Maxar Space LLC
- Michael Freestone
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Heat-transfer member and cooling system
- Patent number 12,222,166
- Issue date Feb 11, 2025
- Kyushu University, National University Corporation
- Yasuyuki Takata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus for transferring heat from a heat source to air
- Patent number 12,222,165
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Fredrik Ohlsson
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat exchange assembly for an electrical device
- Patent number 12,225,692
- Issue date Feb 11, 2025
- TE CONNECTIVITY SOLUTIONS GmbH
- Alex Michael Sharf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a liquid cooling assembly of a family of liqu...
- Patent number 12,219,733
- Issue date Feb 4, 2025
- OVH
- Hadrien Bauduin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Thermal module structure
- Patent number 12,215,934
- Issue date Feb 4, 2025
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Graphics card assembly
- Patent number 12,219,732
- Issue date Feb 4, 2025
- Acer Incorporated
- Yu-Ming Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal transfer system and method
- Patent number 12,217,900
- Issue date Feb 4, 2025
- Medtronic, Inc.
- Robert J. Monson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conduction cooled chassis
- Patent number 12,213,285
- Issue date Jan 28, 2025
- Ametek, Inc.
- Peter Kortekaas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-noise heat exchanger
- Patent number 12,207,443
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for an ion emitter-assisted heatpipe
- Patent number 12,204,385
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vehicle
- Patent number 12,204,104
- Issue date Jan 21, 2025
- MAXELL, LTD.
- Akio Misawa
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with heat-conductive cover
- Patent number 12,200,900
- Issue date Jan 14, 2025
- HTC Corporation
- Li-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loop heat pipe
- Patent number 12,196,498
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Portable electronic device
- Patent number 12,193,189
- Issue date Jan 7, 2025
- Sony Group Corporation
- Kiyohito Masuda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
3-D structured two-phase microfluidic cooling with nano structured...
- Patent number 12,189,441
- Issue date Jan 7, 2025
- Microsoft Technology Licensing, LLC
- Bharath Ramakrishnan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Oscillating heat pipe
- Patent number 12,185,499
- Issue date Dec 31, 2024
- Nokia Technologies Oy
- Ryan Enright
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Airflow in a card-based computing device
- Patent number 12,177,961
- Issue date Dec 24, 2024
- NVIDIA Corporation
- Xiang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,167,571
- Issue date Dec 10, 2024
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heatpipe to help reduce radio frequency interference
- Patent number 12,160,216
- Issue date Dec 3, 2024
- Intel Corporation
- Kae-An Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WATER HEATER APPLIANCE AND HEAT TRANSFER ASSEMBLY
- Publication number 20250075940
- Publication date Mar 6, 2025
- Haier US Appliance Solutions, Inc.
- Spencer Paire
- F24 - HEATING RANGES VENTILATING
Information Patent Application
Integrated Vapor Chamber for Electronic Devices
- Publication number 20250081397
- Publication date Mar 6, 2025
- Google LLC
- Eric Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT DISSIPATION APPARATUS, CONNECTION STRUCTURE, AND ELECTRONIC DE...
- Publication number 20250081400
- Publication date Mar 6, 2025
- HUAWEI TECHNOLOGIES CO., LTD.
- Zhi HE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE ASSEMBLY AND SERVER
- Publication number 20250081391
- Publication date Mar 6, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jingnan ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Computer Power Supply Unit
- Publication number 20250081417
- Publication date Mar 6, 2025
- I-Chia Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNIFORM TEMPERATURE PLATE AND ELECTRONIC EQUIPMENT EMPLOYING PLATE
- Publication number 20250071944
- Publication date Feb 27, 2025
- CHAMP TECH OPTICAL (FOSHAN) CORPORATION
- MING-YU XIAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER, ELECTRONIC DEVICE, METALLIC SHEET FOR VAPOR CHAMBER...
- Publication number 20250071941
- Publication date Feb 27, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinichiro TAKAHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COOLING DEVICE AND COOLING SYSTEM
- Publication number 20250056765
- Publication date Feb 13, 2025
- Fujitsu Limited
- Hideo Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-CONDUCTING PLATE
- Publication number 20250056764
- Publication date Feb 13, 2025
- 9351-0618 QUEBEC INC.
- Mahmoodreza SALIM SHIRAZY
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
VAPOR CHAMBER HEATSINK ASSEMBLY
- Publication number 20250052511
- Publication date Feb 13, 2025
- COOLER MASTER CO., LTD.
- Chia yu Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HYBRID DEVICE COOLING SYSTEM
- Publication number 20250048592
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Dhinesh Jambai GOPU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...
- Publication number 20250048594
- Publication date Feb 6, 2025
- GENERAL ELECTRIC COMPANY
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING SERVERS WITH HYBRID WATER TO AIR AND HEAT PIPE AUGMENTATION...
- Publication number 20250048601
- Publication date Feb 6, 2025
- Dynamic Data Centers Solutions, Inc.
- Mark David Ortenzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vapor Chamber
- Publication number 20250048593
- Publication date Feb 6, 2025
- Razer (Asia-Pacific) Pte Ltd
- ChengYu CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICLE DISPLAY DEVICE
- Publication number 20250035973
- Publication date Jan 30, 2025
- YAZAKI CORPORATION
- Naohisa Murata
- B60 - VEHICLES IN GENERAL
Information Patent Application
VAPOR COLUMNS WITH REDUCED CROSS-SECTIONAL AREA FOR INCREASED AIRFLOW
- Publication number 20250040094
- Publication date Jan 30, 2025
- NVIDIA Corporation
- Malcolm GUTENBURG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION MODULE
- Publication number 20250040078
- Publication date Jan 30, 2025
- ASUSTek COMPUTER INC.
- Ing-Jer Chiou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
- Publication number 20250040098
- Publication date Jan 30, 2025
- XFUSION DIGITAL TECHNOLOGIES CO., LTD
- Hui Jia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Three-Dimensional Meshes and Casings for Thermal Ground Planes
- Publication number 20250031347
- Publication date Jan 23, 2025
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION
- Publication number 20250021145
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Joseph L. Turmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK WITH HEAT PIPE FOR AN ELECTRONIC COMPONENT AND A CORRESPO...
- Publication number 20250024644
- Publication date Jan 16, 2025
- RITTAL GMBH & CO. KG
- Juan Carlos CACHO ALONSO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK
- Publication number 20250024645
- Publication date Jan 16, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Hirofumi AOKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATPIPE WITH GRADUATED CONDENSER PORTION AND CONSTANT RATIO BETWEE...
- Publication number 20250012514
- Publication date Jan 9, 2025
- Dell Products L.P.
- QINGHONG HE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS
- Publication number 20250008700
- Publication date Jan 2, 2025
- JJ COOLING INNOVATION SÀRL
- John R. Thome
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250003693
- Publication date Jan 2, 2025
- Cooler Master Co., Ltd.
- Chi-Lung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DUAL-PHASE FLUID HEAT-DISSIPATING ELEMENT AND PRODUCT HAVING THE SAME
- Publication number 20250008693
- Publication date Jan 2, 2025
- EVERBRITE TECHNOLOGY CO., LTD.
- Tzu-Chia TAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION
- Publication number 20240422943
- Publication date Dec 19, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Darin J. Sharar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE MOUNT
- Publication number 20240414894
- Publication date Dec 12, 2024
- SIEMENS AKTIENGESELLSCHAFT
- VOLKER MÜLLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240407134
- Publication date Dec 5, 2024
- Beijing Xiaomi Mobile Software Co., Ltd.
- Mingyan LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING METHOD AND APPARATUS, ESPECIALLY FOR APPLICATION IN THE FIE...
- Publication number 20240397666
- Publication date Nov 28, 2024
- FRESHAPE SA
- Mathieu Rubi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat dissipation structure for optoelectronic module and electronic...

Aircraft and method for thermal management

Mobile terminal, vapor chamber and preparation method thereof, and...

Heat transfer element

Vapor-air transition detection for two-phase liquid immersion cooling

Fold-out satellite with integrated radiator panel

Heat-transfer member and cooling system

Apparatus for transferring heat from a heat source to air

Heat exchange assembly for an electrical device

Method for assembling a liquid cooling assembly of a family of liqu...

Thermal module structure

Graphics card assembly

Thermal transfer system and method

Conduction cooled chassis

Low-noise heat exchanger

Method and apparatus for an ion emitter-assisted heatpipe

Vehicle

Housing comprising a composite wall integrating at least one coolin...

Electronic device with heat-conductive cover

Loop heat pipe

Method and extraction system for extracting an electronic device fr...

Portable electronic device

3-D structured two-phase microfluidic cooling with nano structured...

Oscillating heat pipe

Vapor chamber and manufacturing method of the same

Airflow in a card-based computing device

Thermal management device for circuit breakers

Rack system for housing at least one immersion case

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Heatpipe to help reduce radio frequency interference

Patents Applicationslast 30 patents

WATER HEATER APPLIANCE AND HEAT TRANSFER ASSEMBLY

Integrated Vapor Chamber for Electronic Devices

HEAT DISSIPATION APPARATUS, CONNECTION STRUCTURE, AND ELECTRONIC DE...

LIQUID COOLING PLATE ASSEMBLY AND SERVER

Computer Power Supply Unit

UNIFORM TEMPERATURE PLATE AND ELECTRONIC EQUIPMENT EMPLOYING PLATE

VAPOR CHAMBER, ELECTRONIC DEVICE, METALLIC SHEET FOR VAPOR CHAMBER...

COOLING DEVICE AND COOLING SYSTEM

HEAT-CONDUCTING PLATE

VAPOR CHAMBER HEATSINK ASSEMBLY

HYBRID DEVICE COOLING SYSTEM

SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...

COOLING SERVERS WITH HYBRID WATER TO AIR AND HEAT PIPE AUGMENTATION...

Vapor Chamber

VEHICLE DISPLAY DEVICE

VAPOR COLUMNS WITH REDUCED CROSS-SECTIONAL AREA FOR INCREASED AIRFLOW

HEAT DISSIPATION MODULE

HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE

Three-Dimensional Meshes and Casings for Thermal Ground Planes

MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION

HEAT SINK WITH HEAT PIPE FOR AN ELECTRONIC COMPONENT AND A CORRESPO...

HEAT SINK

HEATPIPE WITH GRADUATED CONDENSER PORTION AND CONSTANT RATIO BETWEE...

COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS

VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME

DUAL-PHASE FLUID HEAT-DISSIPATING ELEMENT AND PRODUCT HAVING THE SAME

SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION

THERMALLY CONDUCTIVE MOUNT

LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE

COOLING METHOD AND APPARATUS, ESPECIALLY FOR APPLICATION IN THE FIE...