Heating or thermal processing not related to soldering, firing, curing or laminating

Industry

CPC
H05K2203/1105

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semi-automatic corrosion box of copper clad laminate
- Patent number 12,101,892
- Issue date Sep 24, 2024
- Dalian University of Technology
- Shengming Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Layered device for pressure treatment and method
- Patent number 12,089,344
- Issue date Sep 10, 2024
- Canatu Oy
- Ilkka Varjos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for printing a conductive pillar with high precision
- Patent number 12,089,343
- Issue date Sep 10, 2024
- Reophotonics, Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmoulded printed electronic parts and methods for the manufactur...
- Patent number 12,017,392
- Issue date Jun 25, 2024
- National Research Council of Canada
- Paul Arthur Trudeau
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pressing method of a flexible printed circuit board and a substrate
- Patent number 11,991,834
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jae Uk Cho
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 11,974,403
- Issue date Apr 30, 2024
- Innolux Corporation
- Yu-Chia Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking arrays and separator bodies during processing of component...
- Patent number 11,943,874
- Issue date Mar 26, 2024
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, apparatus and system for processing a composite waste source
- Patent number 11,884,992
- Issue date Jan 30, 2024
- Newsouth Innovations Pty Limited
- Veena Sahajwalla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printable molecular ink
- Patent number 11,873,409
- Issue date Jan 16, 2024
- Xiangyang Liu
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates comprising a network comprising core shell liquid metal...
- Patent number 11,856,690
- Issue date Dec 26, 2023
- United States of America as represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,784,424
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a pattern to a substrate
- Patent number 11,751,336
- Issue date Sep 5, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible membrane for applying a pattern to a substrate
- Patent number 11,570,902
- Issue date Jan 31, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying of a conductive pattern to a substrate
- Patent number 11,546,999
- Issue date Jan 3, 2023
- Lumet Technologies Ltd.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 11,528,807
- Issue date Dec 13, 2022
- Samsung Display Co., Ltd.
- Jungseon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electromechanical structure and an arra...
- Patent number 11,516,920
- Issue date Nov 29, 2022
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base circuit board and method of manufacturing the metal base...
- Patent number 11,490,513
- Issue date Nov 1, 2022
- NHK Spring Co., Ltd.
- Katsumi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 11,483,923
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method relating to electrochemical migration
- Patent number 11,470,727
- Issue date Oct 11, 2022
- Jaguar Land Rover Limited
- Thomas Liedtke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,456,548
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with single or multiple components partially surr...
- Patent number 11,452,199
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, multilayer printed wiring board and method fo...
- Patent number 11,445,605
- Issue date Sep 13, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wiring substrate
- Patent number 11,425,824
- Issue date Aug 23, 2022
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing method of display panel
- Patent number 11,414,774
- Issue date Aug 16, 2022
- Jinyang Zhao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD TO OPERATE THE SAME
- Publication number 20240306318
- Publication date Sep 12, 2024
- e-con Systems India Private Limited
- SATHIYA NARAYANAN L
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Electrical Devices
- Publication number 20240282517
- Publication date Aug 22, 2024
- Hutchinson Technology Incorporated
- Collin M. Grove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS APPARATUS AND PRESSING METHOD THEREOF
- Publication number 20240268035
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jae Uk CHO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD, APPARATUS AND SYSTEM FOR PROCESSING A COMPOSITE WASTE SOURCE
- Publication number 20240247335
- Publication date Jul 25, 2024
- NewSouth Innovations Pty Limited
- Veena Sahajwalla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20240251509
- Publication date Jul 25, 2024
- InnoLux Corporation
- Yu-Chia HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing multi-layer flexible circuit board and art...
- Publication number 20240244764
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240188226
- Publication date Jun 6, 2024
- Innolux Corporation
- Wei-Lun Shieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240155771
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
- Publication number 20240098902
- Publication date Mar 21, 2024
- ZTE Corporation
- Da CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER FOLDED 3D ELECTRONICS
- Publication number 20240090126
- Publication date Mar 14, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Nathan S. Lazarus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRINTING A CONDUCTIVE PILLAR WITH HIGH PRECISION
- Publication number 20240080992
- Publication date Mar 7, 2024
- Reophotonics, Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCULAR MANUFACTURING OF TEXTILE-BASED SENSORS
- Publication number 20240080975
- Publication date Mar 7, 2024
- Accenture Global Solutions Limited
- Irmandy Wicaksono
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...
- Publication number 20230397337
- Publication date Dec 7, 2023
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct Resin Embedding
- Publication number 20230300992
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Ewald Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230284393
- Publication date Sep 7, 2023
- TOYO KOHAN CO., LTD
- Nobuaki MUKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...
- Publication number 20230269879
- Publication date Aug 24, 2023
- BYD Company Limited
- Wei ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSFERRING VISCOUS MATERIALS
- Publication number 20230240017
- Publication date Jul 27, 2023
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...
- Publication number 20230199964
- Publication date Jun 22, 2023
- Nichia Corporation.
- Yosuke NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CONDUCTIVE PATTERN ON A SUBSTRATE
- Publication number 20230040740
- Publication date Feb 9, 2023
- Digital Tags Finland Oy
- Lauri HUHTASALO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM
- Publication number 20230024937
- Publication date Jan 26, 2023
- Tokyo Electron Limited
- Tsutomu TSUTSUI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS
- Publication number 20230015176
- Publication date Jan 19, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMED FILM AND A MANUFACTURING METHOD THEREOF
- Publication number 20230014968
- Publication date Jan 19, 2023
- Canatu Oy
- Ilkka VARJOS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED DEVICE FOR PRESSURE TREATMENT AND METHOD
- Publication number 20220386474
- Publication date Dec 1, 2022
- Canatu Oy
- Ilkka VARJOS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS A...
- Publication number 20220377907
- Publication date Nov 24, 2022
- MELLANOX TECHNOLOGIES, LTD.
- Elad MENTOVICH
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Method for manufacturing multi-layer flexible circuit board and art...
- Publication number 20220330437
- Publication date Oct 13, 2022
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Heating or thermal processing not related to soldering, firing, curing or laminating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semi-automatic corrosion box of copper clad laminate

Layered device for pressure treatment and method

Methods for printing a conductive pillar with high precision

Laminated component carrier with a thermoplastic structure

Overmoulded printed electronic parts and methods for the manufactur...

Pressing method of a flexible printed circuit board and a substrate

Method for manufacturing an electronic device

Stacking arrays and separator bodies during processing of component...

Method, apparatus and system for processing a composite waste source

Application of electrical conductors of a solar cell

Printable molecular ink

Sn—Bi and copper powder conductive paste in through hole of insulat...

Substrates comprising a network comprising core shell liquid metal...

Application of electrical conductors to an electrically insulating...

Reliability enhancement of press fit connectors

Method for applying a pattern to a substrate

Flexible membrane for applying a pattern to a substrate

Apparatus for applying of a conductive pattern to a substrate

Bonding device

Reel-to-reel lamination methods and devices in FPC fabrication

Method for manufacturing an electromechanical structure and an arra...

Reel-to-reel laser ablation methods and devices in FPC fabrication

Metal base circuit board and method of manufacturing the metal base...

Laminated component carrier with a thermoplastic structure

Apparatus and method relating to electrochemical migration

Reliability enhancement of press fit connectors

Electronic module with single or multiple components partially surr...

Printed wiring board, multilayer printed wiring board and method fo...

Method for producing wiring substrate

Manufacturing method of display panel

Patents Applicationslast 30 patents

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

MODULAR PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD TO OPERATE THE SAME

Method For Manufacturing Electrical Devices

PRESS APPARATUS AND PRESSING METHOD THEREOF

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

METHOD, APPARATUS AND SYSTEM FOR PROCESSING A COMPOSITE WASTE SOURCE

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

Method for manufacturing multi-layer flexible circuit board and art...

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD

LASER FOLDED 3D ELECTRONICS

METHODS FOR PRINTING A CONDUCTIVE PILLAR WITH HIGH PRECISION

CIRCULAR MANUFACTURING OF TEXTILE-BASED SENSORS

METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...

Direct Resin Embedding

COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME

CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...

TRANSFERRING VISCOUS MATERIALS

CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...

Laminated Component Carrier With a Thermoplastic Structure

METHOD FOR PRODUCING A CONDUCTIVE PATTERN ON A SUBSTRATE

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM

RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS

FORMED FILM AND A MANUFACTURING METHOD THEREOF

LAYERED DEVICE FOR PRESSURE TREATMENT AND METHOD

PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS A...

Method for manufacturing multi-layer flexible circuit board and art...