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H01L2224/85097
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/85097
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last 30 patents
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Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
Publication number
20240194634
Publication date
Jun 13, 2024
ASMPT SINGAPORE PTE. LTD
Keng Yew SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-BONDING FILM AND USE THEREOF
Publication number
20120231583
Publication date
Sep 13, 2012
Kenji ONISHI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...
Publication number
20120126379
Publication date
May 24, 2012
Daisuke UENDA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Patent Application
THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND ME...
Publication number
20110120614
Publication date
May 26, 2011
Yuki Sugo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...