Heatsink mounted on the surface of the PCB

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CPC
H05K2201/066

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/066Heatsink mounted on the surface of the PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Gravity independent liquid cooling for electronics
- Patent number 12,324,128
- Issue date Jun 3, 2025
- Worcester Polytechnic Institute
- Jamal S. Yagoobi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device with slim control assembly
- Patent number 12,313,943
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Moonyoung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 12,309,912
- Issue date May 20, 2025
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacitance memory device
- Patent number 12,309,935
- Issue date May 20, 2025
- Innodisk Corporation
- Chih-Chieh Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module with housed power semiconductors for controllable elec...
- Patent number 12,284,749
- Issue date Apr 22, 2025
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly comprising a circuit carrier and a heat sink
- Patent number 12,279,361
- Issue date Apr 15, 2025
- HELLA GMBH & CO. KGAA
- Christopher Peron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support assembly, unit, and light module for a motor vehicle lighti...
- Patent number 12,267,944
- Issue date Apr 1, 2025
- HELLA GMBH & CO. KGAA
- Sebastian Bartscher
- F21 - LIGHTING
Information Patent Grant
Dual-sided expansion card with offset slot alignment
- Patent number 12,262,471
- Issue date Mar 25, 2025
- Liqid Inc.
- Andrew Rudolph Heyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 12,225,659
- Issue date Feb 11, 2025
- Hitachi Astemo, Ltd.
- Miki Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery charger including an isolating member
- Patent number 12,212,169
- Issue date Jan 28, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. Silha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sinks for electronic circuits
- Patent number 12,200,852
- Issue date Jan 14, 2025
- Auradine Inc.
- Glen Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technologies for dynamically managing resources in disaggregated ac...
- Patent number 12,191,987
- Issue date Jan 7, 2025
- Intel Corporation
- Francesc Guim Bernat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Airflow in a card-based computing device
- Patent number 12,177,961
- Issue date Dec 24, 2024
- NVIDIA Corporation
- Xiang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 12,160,945
- Issue date Dec 3, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded system module thermal installation verification
- Patent number 12,144,118
- Issue date Nov 12, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Craig K. Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to control system updates and configuration changes via...
- Patent number 12,081,323
- Issue date Sep 3, 2024
- Intel Corporation
- Murugasamy K. Nachimuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal ceramic substrate and method for manufacturing such metal cer...
- Patent number 12,075,557
- Issue date Aug 27, 2024
- Rogers Germany GmbH
- Vitalij Gil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of bimetals in a heat sink to benefit heat transfer from high t...
- Patent number 12,074,081
- Issue date Aug 27, 2024
- Cisco Technology, Inc.
- Madeline Marie Roemer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic control of heat sink pressure
- Patent number 12,069,794
- Issue date Aug 20, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact memory device having a backup power source
- Patent number 12,062,409
- Issue date Aug 13, 2024
- Pliops Ltd
- Naseem Jamal
- G11 - INFORMATION STORAGE
Information Patent Grant
Technologies for switching network traffic in a data center
- Patent number 12,040,889
- Issue date Jul 16, 2024
- Intel Corporation
- Matthew Adiletta
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Ceramic carrier substrate and power module
- Patent number 12,028,974
- Issue date Jul 2, 2024
- Robert Bosch GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board module, printed circuit board element, heatsi...
- Patent number 12,028,963
- Issue date Jul 2, 2024
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT BOARD, HEAT DI...
- Publication number 20250185151
- Publication date Jun 5, 2025
- NOF Corporation
- Toshinobu FUJIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK STRUCTURE
- Publication number 20250176139
- Publication date May 29, 2025
- KMW Inc.
- Duk Yong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY CHARGER
- Publication number 20250175021
- Publication date May 29, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. SILHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING ASSEMBLY FOR CIRCUIT
- Publication number 20250168964
- Publication date May 22, 2025
- Schneider Electric (China) Co., Ltd.
- Zhibao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heatsink techniques for optical and electrical modules
- Publication number 20250168963
- Publication date May 22, 2025
- CIENA CORPORATION
- Mitchell O'Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250159810
- Publication date May 15, 2025
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATERPROOF AND SHOCKPROOF STRUCTURE OF FAN MODULE
- Publication number 20250159792
- Publication date May 15, 2025
- Delta Electronics, Inc.
- Kuo-Tung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Electronic Switch Components and a...
- Publication number 20250142713
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Gerald WEIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BUSBAR
- Publication number 20250142710
- Publication date May 1, 2025
- Analog Devices, Inc.
- Hien Minh Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PHASE POWER SUPPLY SYSTEM AND CONTROL OF DYNAMIC LOAD
- Publication number 20250119058
- Publication date Apr 10, 2025
- Infineon Technologies Austria AG
- Luca PELUSO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096187
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...
- Publication number 20250089152
- Publication date Mar 13, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Yaniv Kazav
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...
- Publication number 20250089153
- Publication date Mar 13, 2025
- Delta Electronics, Inc.
- Jui-Chien HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250063667
- Publication date Feb 20, 2025
- ASUSTek COMPUTER INC.
- Chih-Kuan Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLED OPTICS ATTACHED TO A PRINTED CIRCUIT BOARD
- Publication number 20250056708
- Publication date Feb 13, 2025
- Nokia Solutions and Networks Oy
- Cristian Bolle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFINEMENT AND PROTECTION OF A THERMAL INTERFACE MATERIAL BETWEEN...
- Publication number 20250048530
- Publication date Feb 6, 2025
- SUPER MICRO COMPUTER, INC.
- Yi-Kuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250048552
- Publication date Feb 6, 2025
- Canon Kabushiki Kaisha
- SHUICHI NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT IRRADIATING APPARATUS
- Publication number 20250026134
- Publication date Jan 23, 2025
- HOYA CORPORATION
- Norio KOBAYASHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION
- Publication number 20250021145
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Joseph L. Turmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS
- Publication number 20240431061
- Publication date Dec 26, 2024
- Intel Corporation
- Alonso Rodriguez Chacon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240414835
- Publication date Dec 12, 2024
- Omron Corporation
- Junya MISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240414836
- Publication date Dec 12, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Arrangement for a Motor Vehicle Headlight
- Publication number 20240414838
- Publication date Dec 12, 2024
- ZKW GROUP GMBH
- Dietmar KIESLINGER
- F21 - LIGHTING
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373544
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373557
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT ASSEMBLY, UNIT, AND LIGHT MODULE FOR A MOTOR VEHICLE LIGHTI...
- Publication number 20240373542
- Publication date Nov 7, 2024
- HELLA GmbH & Co. KGaA
- Sebastian BARTSCHER
- F21 - LIGHTING
Information Patent Application
TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...
- Publication number 20240372792
- Publication date Nov 7, 2024
- Intel Corporation
- MURUGASAMY K. NACHIMUTHU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COLD PLATE HAVING OPENING AND RELATED SYSTEMS
- Publication number 20240357729
- Publication date Oct 24, 2024
- Tesla, Inc.
- Mohamed Haitham Helmy Nasr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Heatsink mounted on the surface of the PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gravity independent liquid cooling for electronics

Display device with slim control assembly

Electronic assemblies having embedded passive heat pipes and associ...

High capacitance memory device

Power module with housed power semiconductors for controllable elec...

Assembly comprising a circuit carrier and a heat sink

Support assembly, unit, and light module for a motor vehicle lighti...

Dual-sided expansion card with offset slot alignment

Heat sinks with beyond-board fins

Heatsink techniques for optical and electrical modules

Motor controller heat dissipating systems and methods

Power semiconductor device and method for manufacturing power semic...

Electronic control device

Battery charger including an isolating member

Heat sinks for electronic circuits

Technologies for dynamically managing resources in disaggregated ac...

High frequency and high power thin film component

Airflow in a card-based computing device

Heatsink based power delivery for CPUs

Method and procedure for miniaturing a multi-layer PCB

Embedded system module thermal installation verification

Flexible circuit board with thermally conductive connection to a he...

Techniques to control system updates and configuration changes via...

Metal ceramic substrate and method for manufacturing such metal cer...

Use of bimetals in a heat sink to benefit heat transfer from high t...

Dynamic control of heat sink pressure

Compact memory device having a backup power source

Technologies for switching network traffic in a data center

Ceramic carrier substrate and power module

Printed circuit board module, printed circuit board element, heatsi...

Patents Applicationslast 30 patents

HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT BOARD, HEAT DI...

HEAT SINK STRUCTURE

BATTERY CHARGER

HEAT DISSIPATING ASSEMBLY FOR CIRCUIT

Heatsink techniques for optical and electrical modules

PRINTED CIRCUIT BOARD ASSEMBLY

WATERPROOF AND SHOCKPROOF STRUCTURE OF FAN MODULE

Component Carrier With Embedded Electronic Switch Components and a...

HEATSINK BUSBAR

MULTI-PHASE POWER SUPPLY SYSTEM AND CONTROL OF DYNAMIC LOAD

SEMICONDUCTOR MODULE

DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...

SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...

ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF

COOLED OPTICS ATTACHED TO A PRINTED CIRCUIT BOARD

CONFINEMENT AND PROTECTION OF A THERMAL INTERFACE MATERIAL BETWEEN...

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

LIGHT IRRADIATING APPARATUS

MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION

STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

HEATSINK BASED POWER DELIVERY FOR CPUS

Printed Circuit Board Arrangement for a Motor Vehicle Headlight

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

SUPPORT ASSEMBLY, UNIT, AND LIGHT MODULE FOR A MOTOR VEHICLE LIGHTI...

TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...

COLD PLATE HAVING OPENING AND RELATED SYSTEMS