Heatsink mounted on the surface of the PCB

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CPC
H05K2201/066

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/066Heatsink mounted on the surface of the PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Airflow in a card-based computing device
- Patent number 12,177,961
- Issue date Dec 24, 2024
- NVIDIA Corporation
- Xiang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 12,160,945
- Issue date Dec 3, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded system module thermal installation verification
- Patent number 12,144,118
- Issue date Nov 12, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Craig K. Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to control system updates and configuration changes via...
- Patent number 12,081,323
- Issue date Sep 3, 2024
- Intel Corporation
- Murugasamy K. Nachimuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal ceramic substrate and method for manufacturing such metal cer...
- Patent number 12,075,557
- Issue date Aug 27, 2024
- Rogers Germany GmbH
- Vitalij Gil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of bimetals in a heat sink to benefit heat transfer from high t...
- Patent number 12,074,081
- Issue date Aug 27, 2024
- Cisco Technology, Inc.
- Madeline Marie Roemer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic control of heat sink pressure
- Patent number 12,069,794
- Issue date Aug 20, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact memory device having a backup power source
- Patent number 12,062,409
- Issue date Aug 13, 2024
- Pliops Ltd
- Naseem Jamal
- G11 - INFORMATION STORAGE
Information Patent Grant
Technologies for switching network traffic in a data center
- Patent number 12,040,889
- Issue date Jul 16, 2024
- Intel Corporation
- Matthew Adiletta
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Ceramic carrier substrate and power module
- Patent number 12,028,974
- Issue date Jul 2, 2024
- Robert Bosch GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board module, printed circuit board element, heatsi...
- Patent number 12,028,963
- Issue date Jul 2, 2024
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking system
- Patent number 12,022,605
- Issue date Jun 25, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic switch module with oppositely-arranged power switches an...
- Patent number 12,010,799
- Issue date Jun 11, 2024
- BLACK & DECKER INC.
- Joshua M. Lewis
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Low inductance power module with vertical power loop structure and...
- Patent number 12,004,331
- Issue date Jun 4, 2024
- OHIO STATE INNOVATION FOUNDATION
- Xintong Lyu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Driver for motors
- Patent number 11,984,773
- Issue date May 14, 2024
- Mitsuba Corporation
- Tomoya Ikariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 11,985,759
- Issue date May 14, 2024
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corrosion preventive heatsink for network device
- Patent number 11,980,005
- Issue date May 7, 2024
- Cisco Technology, Inc.
- Mehmet Onder Cap
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module and heat sink system
- Patent number 11,974,387
- Issue date Apr 30, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Nianbin Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power allocation to heat a processing chip of a network device
- Patent number 11,960,268
- Issue date Apr 16, 2024
- Hewlett Packard Enterprise Development LP
- Khai Chiah Chng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electric component and refrigeration apparatus
- Patent number 11,946,657
- Issue date Apr 2, 2024
- Daikin Industries, Ltd.
- Yuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal architecture of a computing device
- Patent number 11,950,354
- Issue date Apr 2, 2024
- Apple Inc.
- Kristopher P. Laurent
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 11,924,959
- Issue date Mar 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink for liquid cooling
- Patent number 11,917,796
- Issue date Feb 27, 2024
- Iceotope Group Limited
- Nathan Longhurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,910,520
- Issue date Feb 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit / printed circuit board assembly and method of m...
- Patent number 11,910,519
- Issue date Feb 20, 2024
- Eridan Communications, Inc.
- Douglas A. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric machine
- Patent number 11,894,732
- Issue date Feb 6, 2024
- SPAL Automotive S.R.L.
- Pietro De Filippis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240414835
- Publication date Dec 12, 2024
- Omron Corporation
- Junya MISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240414836
- Publication date Dec 12, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Arrangement for a Motor Vehicle Headlight
- Publication number 20240414838
- Publication date Dec 12, 2024
- ZKW GROUP GMBH
- Dietmar KIESLINGER
- F21 - LIGHTING
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373544
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373557
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT ASSEMBLY, UNIT, AND LIGHT MODULE FOR A MOTOR VEHICLE LIGHTI...
- Publication number 20240373542
- Publication date Nov 7, 2024
- HELLA GmbH & Co. KGaA
- Sebastian BARTSCHER
- F21 - LIGHTING
Information Patent Application
TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...
- Publication number 20240372792
- Publication date Nov 7, 2024
- Intel Corporation
- MURUGASAMY K. NACHIMUTHU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COLD PLATE HAVING OPENING AND RELATED SYSTEMS
- Publication number 20240357729
- Publication date Oct 24, 2024
- Tesla, Inc.
- Mohamed Haitham Helmy Nasr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH CAPACITANCE MEMORY DEVICE
- Publication number 20240357745
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...
- Publication number 20240341026
- Publication date Oct 10, 2024
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20240334587
- Publication date Oct 3, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Eisner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DYNAMIC CONTROL OF HEAT SINK PRESSURE
- Publication number 20240334589
- Publication date Oct 3, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20240315435
- Publication date Sep 26, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- YU-WEN CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR DISMANTLING OF DOUBLE-SIDED PCBA
- Publication number 20240314994
- Publication date Sep 19, 2024
- Intelligent Memory Limited
- Ho Wai Phyllis Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EFFICIENT THERMAL MANAGEMENT FOR VERTICAL POWER DELIVERY
- Publication number 20240306287
- Publication date Sep 12, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Tahir Cader
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...
- Publication number 20240306348
- Publication date Sep 12, 2024
- GaN Systems Inc.
- Ruoyu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multicomponent Connector
- Publication number 20240292540
- Publication date Aug 29, 2024
- KYOCERA AVX Components Corporation
- Ronald Demcko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
- Publication number 20240292541
- Publication date Aug 29, 2024
- Black & Decker Inc.
- Joshua M. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240292513
- Publication date Aug 29, 2024
- Sumitomo Wiring Systems, Ltd.
- Hideki Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20240260169
- Publication date Aug 1, 2024
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION DEVICE, ROTATING ELECTRIC MACHINE DEVICE, AND ME...
- Publication number 20240250457
- Publication date Jul 25, 2024
- Mitsubishi Electric Corporation
- Junya SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY PACKAGE FOR POWER APPLICATIONS
- Publication number 20240243043
- Publication date Jul 18, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- David SYCHALEUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Device
- Publication number 20240244754
- Publication date Jul 18, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Yoshimichi SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY WITH MULTIPLE CONDUCTION PATHS
- Publication number 20240244739
- Publication date Jul 18, 2024
- Milwaukee Electric Tool Corporation
- Joshua D. Widder
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240237195
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORROSION PREVENTIVE HEATSINK FOR NETWORK DEVICE
- Publication number 20240215196
- Publication date Jun 27, 2024
- Cisco Technology, Inc.
- Mehmet Onder Cap
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20240206048
- Publication date Jun 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL EQUIPMENT
- Publication number 20240206073
- Publication date Jun 20, 2024
- Valeo eAutomotive France SAS
- Baptiste PARIGOT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Heatsink mounted on the surface of the PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High frequency and high power thin film component

Airflow in a card-based computing device

Heatsink based power delivery for CPUs

Method and procedure for miniaturing a multi-layer PCB

Embedded system module thermal installation verification

Flexible circuit board with thermally conductive connection to a he...

Techniques to control system updates and configuration changes via...

Metal ceramic substrate and method for manufacturing such metal cer...

Use of bimetals in a heat sink to benefit heat transfer from high t...

Dynamic control of heat sink pressure

Compact memory device having a backup power source

Technologies for switching network traffic in a data center

Ceramic carrier substrate and power module

Printed circuit board module, printed circuit board element, heatsi...

Stacking system

Electronic switch module with oppositely-arranged power switches an...

Low inductance power module with vertical power loop structure and...

Driver for motors

Electronic assemblies having embedded passive heat pipes and associ...

Corrosion preventive heatsink for network device

Power module and heat sink system

Power allocation to heat a processing chip of a network device

Electric component and refrigeration apparatus

Internal architecture of a computing device

Solid state relay

Heatsink based power delivery for CPUs

Heat sink for liquid cooling

Thermal management in circuit board assemblies

Integrated circuit / printed circuit board assembly and method of m...

Electric machine

Patents Applicationslast 30 patents

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

HEATSINK BASED POWER DELIVERY FOR CPUS

Printed Circuit Board Arrangement for a Motor Vehicle Headlight

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

SUPPORT ASSEMBLY, UNIT, AND LIGHT MODULE FOR A MOTOR VEHICLE LIGHTI...

TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...

COLD PLATE HAVING OPENING AND RELATED SYSTEMS

HIGH CAPACITANCE MEMORY DEVICE

SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...

ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE

DYNAMIC CONTROL OF HEAT SINK PRESSURE

HANDLE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

SYSTEMS AND METHODS FOR DISMANTLING OF DOUBLE-SIDED PCBA

EFFICIENT THERMAL MANAGEMENT FOR VERTICAL POWER DELIVERY

THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...

Multicomponent Connector

ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...

CIRCUIT STRUCTURE

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...

CIRCUIT CONNECTION DEVICE, ROTATING ELECTRIC MACHINE DEVICE, AND ME...

CIRCUITRY PACKAGE FOR POWER APPLICATIONS

Circuit Device

PRINTED CIRCUIT BOARD ASSEMBLY WITH MULTIPLE CONDUCTION PATHS

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

CORROSION PREVENTIVE HEATSINK FOR NETWORK DEVICE

Thermal Management in Circuit Board Assemblies

ELECTRICAL EQUIPMENT