Heatsink mounted on the surface of the PCB

Industry

CPC
H05K2201/066

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/066Heatsink mounted on the surface of the PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Driver for motors
- Patent number 11,984,773
- Issue date May 14, 2024
- Mitsuba Corporation
- Tomoya Ikariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 11,985,759
- Issue date May 14, 2024
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corrosion preventive heatsink for network device
- Patent number 11,980,005
- Issue date May 7, 2024
- Cisco Technology, Inc.
- Mehmet Onder Cap
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module and heat sink system
- Patent number 11,974,387
- Issue date Apr 30, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Nianbin Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power allocation to heat a processing chip of a network device
- Patent number 11,960,268
- Issue date Apr 16, 2024
- Hewlett Packard Enterprise Development LP
- Khai Chiah Chng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electric component and refrigeration apparatus
- Patent number 11,946,657
- Issue date Apr 2, 2024
- Daikin Industries, Ltd.
- Yuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal architecture of a computing device
- Patent number 11,950,354
- Issue date Apr 2, 2024
- Apple Inc.
- Kristopher P. Laurent
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 11,924,959
- Issue date Mar 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink for liquid cooling
- Patent number 11,917,796
- Issue date Feb 27, 2024
- Iceotope Group Limited
- Nathan Longhurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,910,520
- Issue date Feb 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit / printed circuit board assembly and method of m...
- Patent number 11,910,519
- Issue date Feb 20, 2024
- Eridan Communications, Inc.
- Douglas A. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric machine
- Patent number 11,894,732
- Issue date Feb 6, 2024
- SPAL Automotive S.R.L.
- Pietro De Filippis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Heat sink with protrusions on multiple sides thereof and apparatus...
- Patent number 11,864,348
- Issue date Jan 2, 2024
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power device, power device assembly, and related apparatus
- Patent number 11,862,531
- Issue date Jan 2, 2024
- Huawei Technologies Co., Ltd.
- Yankun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for dynamically managing resources in disaggregated ac...
- Patent number 11,855,766
- Issue date Dec 26, 2023
- Intel Corporation
- Francesc Guim Bernat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Battery charger including an isolating member
- Patent number 11,855,468
- Issue date Dec 26, 2023
- Milwaukee Electric Tool Corporation
- Wyatt R. Silha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to verify and authenticate resources in a data center co...
- Patent number 11,838,113
- Issue date Dec 5, 2023
- Intel Corporation
- Alberto J. Munoz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through board via heat sink
- Patent number 11,825,593
- Issue date Nov 21, 2023
- Aptiv Technologies Limited
- Navneet Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly
- Patent number RE49723
- Issue date Nov 7, 2023
- Turntide Technologies, Inc.
- Peter Barrass
Information Patent Grant
Cooling device
- Patent number 11,805,593
- Issue date Oct 31, 2023
- Denso Corporation
- Yoshirou Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink fastening structure
- Patent number 11,800,634
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Juhyeok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised pathway heat sink
- Patent number 11,800,685
- Issue date Oct 24, 2023
- ARRIS Enterprises LLC
- Justin Diep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure with stacked thermal interface materials
- Patent number 11,792,912
- Issue date Oct 17, 2023
- Wistron NeWeb Corporation
- Bo-Yen Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Planar converter
- Patent number 11,791,087
- Issue date Oct 17, 2023
- Delta Electronics, Inc.
- Da Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autonomous vehicle computing device with barrier layer
- Patent number 11,778,722
- Issue date Oct 3, 2023
- GM CRUISE HOLDINGS LLC
- Reza Azizian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling device and method of manufacturing the same
- Patent number 11,778,775
- Issue date Oct 3, 2023
- Aptiv Technologies Limited
- Frank H. Adam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric working machine with semiconductor element that completes...
- Patent number 11,777,377
- Issue date Oct 3, 2023
- Makita Corporation
- Akihiro Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brushless motor assembly
- Patent number 11,770,051
- Issue date Sep 26, 2023
- Mobiletron Electronics Co., Ltd.
- Wen-Shing Hon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Thermal Interface for Electronic Control Unit
- Publication number 20240147601
- Publication date May 2, 2024
- Aptiv Technologies AG
- Falk Rademacher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240130033
- Publication date Apr 18, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY CHARGER
- Publication number 20240128773
- Publication date Apr 18, 2024
- Milwaukee Electric Tool Corporation
- Wyatt R. SILHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND...
- Publication number 20240121881
- Publication date Apr 11, 2024
- Huawei Technologies Co., Ltd
- Wei CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD
- Publication number 20240121932
- Publication date Apr 11, 2024
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY SUB-SYSTEM ENCLOSURE
- Publication number 20240107657
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-SIDED EXPANSION CARD WITH OFFSET SLOT ALIGNMENT
- Publication number 20240107671
- Publication date Mar 28, 2024
- Liqid Inc.
- Andrew Rudolph Heyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVE AND CONTROL INTEGRATED BOARD, CONTROL SYSTEM, AND ROBOT
- Publication number 20240098875
- Publication date Mar 21, 2024
- QKM TECHNOLOGY (DONG GUAN) CO., LTD
- Jinbo SHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098872
- Publication date Mar 21, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE
- Publication number 20240090117
- Publication date Mar 14, 2024
- Huawei Technologies Co., Ltd
- Yaofeng PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OUTLET HEAT SINK FOR COOLING SYSTEM OF A SUPERCOMPUTER ELECTRONIC B...
- Publication number 20240074032
- Publication date Feb 29, 2024
- BULL SAS
- Marc RAETH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...
- Publication number 20240074031
- Publication date Feb 29, 2024
- CreeLED, Inc.
- Everett Bradford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUITS
- Publication number 20240038629
- Publication date Feb 1, 2024
- GM Cruise Holdings LLC
- Yafei Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW INDUCTANCE POWER MODULE WITH VERTICAL POWER LOOP STRUCTURE AND...
- Publication number 20240032261
- Publication date Jan 25, 2024
- Ohio State Innovation Foundation
- Xintong Lyu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Sink Component Terminations
- Publication number 20240032185
- Publication date Jan 25, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DYNAMIC CONTROL OF HEAT SINK PRESSURE
- Publication number 20240015880
- Publication date Jan 11, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUSTOMIZED THERMAL PATHWAYS IN A PCB
- Publication number 20240008190
- Publication date Jan 4, 2024
- DSBJ PTE. LTD.
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTONOMOUS VEHICLE COMPUTING DEVICE WITH BARRIER LAYER
- Publication number 20230403783
- Publication date Dec 14, 2023
- GM Cruise Holdings LLC
- Reza Azizian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Arrangement
- Publication number 20230389229
- Publication date Nov 30, 2023
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Backing Plate Assembly with Jack Screw for Bare Die Device Heat Sin...
- Publication number 20230371208
- Publication date Nov 16, 2023
- CIENA CORPORATION
- Maxwell Thomas McKerlie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE OF PRINTED CIRCUIT BOARD, MANUFACTURING...
- Publication number 20230371166
- Publication date Nov 16, 2023
- HL KLEMOVE CORP.
- Jihoon HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20230337351
- Publication date Oct 19, 2023
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND CIRCUIT ARRANGEMENT
- Publication number 20230337352
- Publication date Oct 19, 2023
- SEW-EURODRIVE GMBH & CO. KG
- Jochen MAHLEIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHING POWER SUPPLY INCLUDING HEAT SINK
- Publication number 20230337355
- Publication date Oct 19, 2023
- Canon Kabushiki Kaisha
- Nobuyuki Uchiyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER CONTROLLER
- Publication number 20230300971
- Publication date Sep 21, 2023
- MGM COMPRO S.R.O
- Grigorij DVORSKÝ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIRFLOW IN A CARD-BASED COMPUTING DEVICE
- Publication number 20230284371
- Publication date Sep 7, 2023
- NVIDIA Corporation
- Xiang SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE RELAY
- Publication number 20230283274
- Publication date Sep 7, 2023
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTERNAL ARCHITECTURE OF A COMPUTING DEVICE
- Publication number 20230284372
- Publication date Sep 7, 2023
- Apple Inc.
- Kristopher P. LAURENT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTROL UNIT FOR A VEHICLE WITH AT LEAST ONE ELECTRIC MOTOR AND A T...
- Publication number 20230241970
- Publication date Aug 3, 2023
- Vitesco Technologies Germany GmbH
- Alexander Wenk
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20230239994
- Publication date Jul 27, 2023
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Heatsink mounted on the surface of the PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Driver for motors

Electronic assemblies having embedded passive heat pipes and associ...

Corrosion preventive heatsink for network device

Power module and heat sink system

Power allocation to heat a processing chip of a network device

Electric component and refrigeration apparatus

Internal architecture of a computing device

Solid state relay

Heatsink based power delivery for CPUs

Heat sink for liquid cooling

Thermal management in circuit board assemblies

Integrated circuit / printed circuit board assembly and method of m...

Electric machine

Heat sink with protrusions on multiple sides thereof and apparatus...

Power device, power device assembly, and related apparatus

Technologies for dynamically managing resources in disaggregated ac...

Battery charger including an isolating member

Techniques to verify and authenticate resources in a data center co...

Through board via heat sink

Power electronics assembly

Cooling device

Heat sink fastening structure

Raised pathway heat sink

Heat dissipation structure with stacked thermal interface materials

Planar converter

Semiconductor assemblies including thermal circuits and methods of...

Autonomous vehicle computing device with barrier layer

Cooling device and method of manufacturing the same

Electric working machine with semiconductor element that completes...

Brushless motor assembly

Patents Applicationslast 30 patents

Thermal Interface for Electronic Control Unit

HEATSINK BASED POWER DELIVERY FOR CPUS

BATTERY CHARGER

HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND...

SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD

MEMORY SUB-SYSTEM ENCLOSURE

DUAL-SIDED EXPANSION CARD WITH OFFSET SLOT ALIGNMENT

DRIVE AND CONTROL INTEGRATED BOARD, CONTROL SYSTEM, AND ROBOT

ELECTRONIC DEVICE

HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE

OUTLET HEAT SINK FOR COOLING SYSTEM OF A SUPERCOMPUTER ELECTRONIC B...

TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...

MULTILAYER THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUITS

LOW INDUCTANCE POWER MODULE WITH VERTICAL POWER LOOP STRUCTURE AND...

Heat Sink Component Terminations

DYNAMIC CONTROL OF HEAT SINK PRESSURE

CUSTOMIZED THERMAL PATHWAYS IN A PCB

AUTONOMOUS VEHICLE COMPUTING DEVICE WITH BARRIER LAYER

Circuit Board Arrangement

Backing Plate Assembly with Jack Screw for Bare Die Device Heat Sin...

HEAT DISSIPATION STRUCTURE OF PRINTED CIRCUIT BOARD, MANUFACTURING...

HEATSINK BASED POWER DELIVERY FOR CPUS

PRINTED CIRCUIT BOARD AND CIRCUIT ARRANGEMENT

SWITCHING POWER SUPPLY INCLUDING HEAT SINK

POWER CONTROLLER

AIRFLOW IN A CARD-BASED COMPUTING DEVICE

SOLID STATE RELAY

INTERNAL ARCHITECTURE OF A COMPUTING DEVICE

CONTROL UNIT FOR A VEHICLE WITH AT LEAST ONE ELECTRIC MOTOR AND A T...

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...