heatsink to additional heatsink

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H01L2023/4056

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4056heatsink to additional heatsink

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat transfer for power modules
- Patent number 11,610,832
- Issue date Mar 21, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,502,019
- Issue date Nov 15, 2022
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Card-type connector having heat conductive members extending over t...
- Patent number 11,444,405
- Issue date Sep 13, 2022
- Japan Aviation Electronics Industry, Limited
- Tomohiro Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic load device and heat-dissipating load module
- Patent number 11,324,109
- Issue date May 3, 2022
- CHROMA ATE INC.
- Chien-Hsing Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,043,442
- Issue date Jun 22, 2021
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 11,035,625
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heatsink for information handling system
- Patent number 10,971,427
- Issue date Apr 6, 2021
- Dell Products L.P.
- Qinghong He
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 10,948,247
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling methods for electronic components
- Patent number 10,834,852
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Aaron R. Cox
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fluid routing devices and methods for cooling integrated circuit pa...
- Patent number 10,770,372
- Issue date Sep 8, 2020
- Altera Corporation
- Ravi Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
DMD assembly and DLP projection device
- Patent number 10,718,999
- Issue date Jul 21, 2020
- HISENSE CO., LTD.
- Naiwen Hou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Heat transfer for power modules
- Patent number 10,665,525
- Issue date May 26, 2020
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric heat path devices, and systems and methods using the same
- Patent number 10,615,098
- Issue date Apr 7, 2020
- EATON INTELLIGENT POWER LIMITED
- Tony Ray Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase-change cooler and phase-change cooling method
- Patent number 10,607,918
- Issue date Mar 31, 2020
- NEC Corporation
- Hitoshi Sakamoto
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 10,584,924
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat exchangers for dual-sided cooling
- Patent number 10,475,724
- Issue date Nov 12, 2019
- Dana Canada Corporation
- Meinrad K. A. Machler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling methods for electronic components
- Patent number 10,334,757
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Aaron R. Cox
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus, system, and method for mitigating electromagnetic radiat...
- Patent number 10,304,755
- Issue date May 28, 2019
- Juniper Networks, Inc.
- Alexander I. Yatskov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation component and terminal device including heat dissi...
- Patent number 10,283,435
- Issue date May 7, 2019
- Fujitsu Client Computing Limited
- Kouichi Shinotou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,269,681
- Issue date Apr 23, 2019
- Mitsubishi Electric Corporation
- Satoru Kikugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer cooling module
- Patent number 10,262,918
- Issue date Apr 16, 2019
- Irfan Bhatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating structure and electronic apparatus
- Patent number 10,244,668
- Issue date Mar 26, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihide Nakanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric heat path devices, and systems and methods using the same
- Patent number 10,115,657
- Issue date Oct 30, 2018
- EATON INTELLIGENT POWER LIMITED
- Tony Ray Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 10,088,244
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
DMD assembly, DLP optical engine and DLP projection device
- Patent number 10,082,665
- Issue date Sep 25, 2018
- HISENSE CO., LTD.
- Naiwen Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with integrated threaded lid
- Patent number 10,002,819
- Issue date Jun 19, 2018
- International Business Machines Corporation
- William J. Anderl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink coupling using flexible heat pipes for multi-surface comp...
- Patent number 9,935,033
- Issue date Apr 3, 2018
- Intel Corporation
- Susan F. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 9,921,008
- Issue date Mar 20, 2018
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device and device
- Patent number 9,870,973
- Issue date Jan 16, 2018
- NEC Corporation
- Tomoyuki Mitsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with one or more heat sinks
- Patent number 9,860,987
- Issue date Jan 2, 2018
- Deere & Company
- Brij N. Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20230230895
- Publication date Jul 20, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...
- Publication number 20210343621
- Publication date Nov 4, 2021
- Huawei Technologies Co., Ltd
- Shoubiao XU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20200335414
- Publication date Oct 22, 2020
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR INFORMATION HANDLING SYSTEM
- Publication number 20200251404
- Publication date Aug 6, 2020
- Dell Products L.P.
- Qinghong He
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME
- Publication number 20200194337
- Publication date Jun 18, 2020
- TONY RAY BENSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE HEAT SINK FIN SPACING
- Publication number 20190346214
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ADJUSTABLE HEAT SINK FIN SPACING
- Publication number 20190346215
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20190341327
- Publication date Nov 7, 2019
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING METHODS FOR ELECTRONIC COMPONENTS
- Publication number 20190246520
- Publication date Aug 8, 2019
- International Business Machines Corporation
- Aaron R. Cox
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...
- Publication number 20190206763
- Publication date Jul 4, 2019
- Huawei Technologies Co., Ltd
- Shoubiao XU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DMD Assembly And DLP Projection Device
- Publication number 20180356628
- Publication date Dec 13, 2018
- HISENSE CO., LTD.
- Naiwen Hou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT EXCHANGERS FOR DUAL-SIDED COOLING
- Publication number 20180261526
- Publication date Sep 13, 2018
- DANA CANADA CORPORATION
- MEINRAD K. A. MACHLER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME
- Publication number 20180145008
- Publication date May 24, 2018
- EATON CORPORATION
- TONY RAY BENSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE HEAT SINK FIN SPACING
- Publication number 20180073818
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ADJUSTABLE HEAT SINK FIN SPACING
- Publication number 20180051940
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20180019186
- Publication date Jan 18, 2018
- Mitsubishi Electric Corporation
- Satoru KIKUGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME
- Publication number 20170278772
- Publication date Sep 28, 2017
- EATON CORPORATION
- TONY RAY BENSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE-CHANGE COOLER AND PHASE-CHANGE COOLING METHOD
- Publication number 20170125323
- Publication date May 4, 2017
- NEC Corporation
- Hitoshi SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160190036
- Publication date Jun 30, 2016
- Toyota Jidosha Kabushiki Kaisha
- Rintaro ASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Thermal Management Features for Reduced Thermal Cross...
- Publication number 20160133602
- Publication date May 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kim Hong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE UNIT AND ELECTRONIC DEVICE
- Publication number 20140340847
- Publication date Nov 20, 2014
- Fujitsu Limited
- Yoshihisa IWAKIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH HEAT SINK
- Publication number 20140313674
- Publication date Oct 23, 2014
- ZHI-BIN GUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20140299979
- Publication date Oct 9, 2014
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi DANNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal mgmt. device for high-heat flux electronics
- Publication number 20140293542
- Publication date Oct 2, 2014
- Jan Vetrovec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20140210072
- Publication date Jul 31, 2014
- Toyota Jidosha Kabushiki Kaisha
- Tadashi Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE PACKAGE
- Publication number 20140183717
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE ASSEMBLY WITH HEAT...
- Publication number 20140133102
- Publication date May 15, 2014
- ER-WEI LU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING SYSTEM FOR ELECTRONICS
- Publication number 20140133093
- Publication date May 15, 2014
- International Business Machines Corporation
- Aaron R. Cox
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140110830
- Publication date Apr 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT RETENTION MECHANISM WITH RETRACTABLE COVER
- Publication number 20140071647
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Jeremy S. Bridges
- H01 - BASIC ELECTRIC ELEMENTS

heatsink to additional heatsink

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat transfer for power modules

Heat sink, heat dissipation apparatus, heat dissipation system, and...

Card-type connector having heat conductive members extending over t...

Electronic load device and heat-dissipating load module

Heat sink, heat dissipation apparatus, heat dissipation system, and...

Adjustable heat sink fin spacing

Heatsink for information handling system

Adjustable heat sink fin spacing

Cooling methods for electronic components

Fluid routing devices and methods for cooling integrated circuit pa...

DMD assembly and DLP projection device

Heat transfer for power modules

Dielectric heat path devices, and systems and methods using the same

Phase-change cooler and phase-change cooling method

Adjustable heat sink fin spacing

Heat exchangers for dual-sided cooling

Cooling methods for electronic components

Apparatus, system, and method for mitigating electromagnetic radiat...

Heat dissipation component and terminal device including heat dissi...

Semiconductor device and manufacturing method of semiconductor device

Heat transfer cooling module

Heat dissipating structure and electronic apparatus

Dielectric heat path devices, and systems and methods using the same

Adjustable heat sink fin spacing

DMD assembly, DLP optical engine and DLP projection device

Heat sink with integrated threaded lid

Heat sink coupling using flexible heat pipes for multi-surface comp...

Adjustable heat sink fin spacing

Cooling device and device

Electronic assembly with one or more heat sinks

Patents Applicationslast 30 patents

HEAT TRANSFER FOR POWER MODULES

Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...

HEAT TRANSFER FOR POWER MODULES

HEATSINK FOR INFORMATION HANDLING SYSTEM

DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME

ADJUSTABLE HEAT SINK FIN SPACING

ADJUSTABLE HEAT SINK FIN SPACING

HEAT TRANSFER FOR POWER MODULES

COOLING METHODS FOR ELECTRONIC COMPONENTS

Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...

DMD Assembly And DLP Projection Device

HEAT EXCHANGERS FOR DUAL-SIDED COOLING

DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME

ADJUSTABLE HEAT SINK FIN SPACING

ADJUSTABLE HEAT SINK FIN SPACING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME

PHASE-CHANGE COOLER AND PHASE-CHANGE COOLING METHOD

SEMICONDUCTOR DEVICE

Packages with Thermal Management Features for Reduced Thermal Cross...

SUBSTRATE UNIT AND ELECTRONIC DEVICE

ELECTRONIC DEVICE WITH HEAT SINK

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

Thermal mgmt. device for high-heat flux electronics

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE PACKAGE

HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE ASSEMBLY WITH HEAT...

COOLING SYSTEM FOR ELECTRONICS

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT RETENTION MECHANISM WITH RETRACTABLE COVER