Patent Application
20140133102
1. Technical Field
The present disclosure relates to electronic device assemblies, more particularly to an electronic device assembly with a heat dissipating assembly.
2. Description of Related Art
Heat dissipating devices perform the critical function of removing heat from an electronic device. The electronic device, such as a portable computer, always includes a heat dissipating mechanism. For example, the heat dissipating mechanism is provided with a fan, a fin assembly and a pipe. The pipe conducts heat away from the number of heat generating parts to the fin assembly, and then airflow is directed out of the electronic device by the fan, for dissipating heat generated in the electronic device. However, a heat dissipating efficiency of the heat dissipating mechanism is very low and cannot satisfy high performance and speed of the portable computer.
Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
The electronic device 70 includes a bottom base 71 and an integrally formed keyboard 73, in other embodiments the keyboard 73 may be coupled to the bottom base 71. The bottom base 71 includes a bottom plate 711 and a sidewall 713 connected to the bottom plate 711. The sidewall 713 defines a ventilation area 7131 and a through hole 7133 located on one side of the ventilation area 7131. A latch tab 7135 extends upwards from a bottom edge of the through hole 7133, corresponding to the heat dissipating assembly 80. Two locking holes 7137 are defined in two opposite sides of the through hole 7133. A motherboard (not shown) is installed on the bottom plate 111, and a plurality of heat generating parts 100 are attached to the motherboard.
The heat dissipating assembly 80 includes an internal heat dissipating mechanism 10, an external heat dissipating mechanism 50, and a heat conduction block 30 attached to the internal heat dissipating mechanism 10. The internal heat dissipating mechanism 10 is received in the electronic device 70, to dissipate heat generated by the plurality of heat generating parts 100, and the external heat dissipating mechanism 50 is installed on outside of the electronic device 70, to dissipate heat of the internal heat dissipating mechanism 10.
The internal heat dissipating mechanism 10 includes a first fan 11, a first fin assembly 13, and a first heat pipe 15. The first fin assembly 13 is located on one side of the first fan 11. A first end of the heat first pipe 15 is inserted into the first fin assembly 13, and a second end opposite to the first end of the first heat pipe 15 closely abuts the plurality of heat generating parts 100.
The second fan 53 and the second fin assembly 55 are received in the box body 511. One end of the second heat pipe 57 is inserted into the second fin assembly 55, and another end of the second heat pipe 57 extends through the exit hole 5112 to connect to the heat diffusion block 59. The heat diffusion block 59 is partly engaged in the clipping slot 5131.
The external heat dissipating mechanism 50 is placed on the outside of the electronic device 70. The clipping portion 513 abuts an outer surface of the sidewall 713, and the heat diffusion block 59 closely contacts with the heat conduction block 30. Each of the two securing holes 5133 of the clipping portion 513 is aligned with each of the two locking holes 7137 of the bottom base 71, and two thumb screws 517 are locked into the two securing holes 5133 and the two locking holes 7137. The external heat dissipating mechanism 50 is thereby installed on the electronic device 70.
In use, the first heat pipe 15 directs heat generated by the plurality of heat generating parts 100 along a first direction to the first fin assembly 13, and along a second direction to the second heat pipe 57 via the heat conduction block 30. In one embodiment, the first direction is substantially perpendicular to the second direction. The second heat pipe 57 directs heat to the second fin assembly 55, and the second fan 53 guides airflow around the second fin assembly 55 to dissipate heat. A heat dissipating efficiency of the external heat dissipating mechanism is thereby increased.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012104526750 | Nov 2012 | CN | national |
