heatsink to or through board or cabinet

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H01L2023/4062

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4062heatsink to or through board or cabinet

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for holding a heat generating device
- Patent number 12,080,624
- Issue date Sep 3, 2024
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module with improved heat di...
- Patent number 12,033,916
- Issue date Jul 9, 2024
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink
- Patent number 11,982,500
- Issue date May 14, 2024
- Delta Electronics, Inc.
- Chao-Wen Lu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for providing thermal management to integrated circuits
- Patent number 11,810,836
- Issue date Nov 7, 2023
- Arista Networks, Inc.
- Tiffany Doria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 11,804,468
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for holding a heat generating device
- Patent number 11,776,874
- Issue date Oct 3, 2023
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric working machine with semiconductor element that completes...
- Patent number 11,777,377
- Issue date Oct 3, 2023
- Makita Corporation
- Akihiro Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration module comprising thermal management appa...
- Patent number 11,769,710
- Issue date Sep 26, 2023
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,728,240
- Issue date Aug 15, 2023
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating heat sink and elastic support thereof
- Patent number 11,658,096
- Issue date May 23, 2023
- Huawei Technologies Co., Ltd.
- Jingfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket loading mechanism for passive or active socket and package c...
- Patent number 11,646,244
- Issue date May 9, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting devices for semiconductor packages with a fixation mechanism
- Patent number 11,605,575
- Issue date Mar 14, 2023
- Mahle International GmbH
- Francisco Gonzalez Espin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,502,019
- Issue date Nov 15, 2022
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 11,476,180
- Issue date Oct 18, 2022
- Mitsubishi Electric Corporation
- Hiroshi Nomiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flexure based cooling solutions for package stru...
- Patent number 11,276,625
- Issue date Mar 15, 2022
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Threaded cooling apparatus with integrated cooling channels and hea...
- Patent number 11,231,239
- Issue date Jan 25, 2022
- Raytheon Company
- Christopher R. Koontz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation structure and heat dissipation method
- Patent number 11,229,114
- Issue date Jan 18, 2022
- NEC Platforms, Ltd.
- Jun Eto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing device for double sided heat sink and associated heat dissip...
- Patent number 11,215,409
- Issue date Jan 4, 2022
- EMC IP Holding Company LLC
- Haifang Zhai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Solid-state storage device
- Patent number 11,201,100
- Issue date Dec 14, 2021
- Global Unichip Corporation
- Yu-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for increasing the cooling efficiency...
- Patent number 11,160,192
- Issue date Oct 26, 2021
- Juniper Networks, Inc.
- Alexander I. Yatskov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for dynamic compensation of heatsink-...
- Patent number 11,158,564
- Issue date Oct 26, 2021
- Juniper Networks, Inc.
- Alexander I. Yatskov
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink fastening seat and securing device with gasket for use wi...
- Patent number 11,133,238
- Issue date Sep 28, 2021
- FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
- Heng-Kang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical part for fastening processor, assembly, and computer device
- Patent number 11,133,239
- Issue date Sep 28, 2021
- Huawei Technologies Co., Ltd.
- Yonghai Mao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic control unit and electric power steering device using th...
- Patent number 11,084,521
- Issue date Aug 10, 2021
- Denso Corporation
- Tsuyoshi Tashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting an LED element on a flat carrier
- Patent number 11,056,629
- Issue date Jul 6, 2021
- Lumileds LLC
- Michael Deckers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible base design for chipset heat sink
- Patent number 11,049,793
- Issue date Jun 29, 2021
- Quanta Computer Inc.
- Chao-Jung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,043,442
- Issue date Jun 22, 2021
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 11,035,625
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMAL DISSIPATING PACKAGE
- Publication number 20240153845
- Publication date May 9, 2024
- GUANGZHOU NEOGENE THERMAL MANAGEMENT TECHNOLOGY CO., LTD.
- JEN-SHYAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
- Publication number 20240040689
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Ramdas Rangnath Ugale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
- Publication number 20230369283
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
- Publication number 20230343674
- Publication date Oct 26, 2023
- Vitesco Technologies GMBH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Holding a Heat Generating Device
- Publication number 20230343675
- Publication date Oct 26, 2023
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187311
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230027076
- Publication date Jan 26, 2023
- Intel Corporation
- Andres Ramirez Macias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK
- Publication number 20220214120
- Publication date Jul 7, 2022
- Delta Electronics, Inc.
- CHAO-WEN LU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
- Publication number 20220044984
- Publication date Feb 10, 2022
- Vitesco Technologies GMBH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR PROVIDING THERMAL MANAGEMENT TO INTEGRATED CIRCUITS
- Publication number 20210384104
- Publication date Dec 9, 2021
- Arista Networks, Inc.
- Tiffany Doria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...
- Publication number 20210343621
- Publication date Nov 4, 2021
- Huawei Technologies Co., Ltd
- Shoubiao XU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
APPARATUS AND METHOD FOR HOLDING A HEAT GENERATING DEVICE
- Publication number 20210305125
- Publication date Sep 30, 2021
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING FLEXURE BASED COOLING SOLUTIONS FOR PACKAGE STRU...
- Publication number 20210280495
- Publication date Sep 9, 2021
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20210225731
- Publication date Jul 22, 2021
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20210112689
- Publication date Apr 15, 2021
- Mitsubishi Electric Corporation
- Naoya HASHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE FOR MOTHERBOARD
- Publication number 20210043542
- Publication date Feb 11, 2021
- Raytheon Company
- Michael Benjamin Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200312743
- Publication date Oct 1, 2020
- Mitsubishi Electric Corporation
- Hiroshi NOMIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE BASE DESIGN FOR CHIPSET HEAT SINK
- Publication number 20200303283
- Publication date Sep 24, 2020
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MOUNTING DEVICES FOR SEMICONDUCTOR PACKAGES
- Publication number 20200286810
- Publication date Sep 10, 2020
- MAHLE International GmbH
- Francisco Gonzalez Espin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR INFORMATION HANDLING SYSTEM
- Publication number 20200251404
- Publication date Aug 6, 2020
- Dell Products L.P.
- Qinghong He
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPONENT-MOUNTING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200235646
- Publication date Jul 23, 2020
- KYB Corporation
- Yuu EGUCHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRIC WORKING MACHINE WITH SEMICONDUCTOR ELEMENT THAT COMPLETES...
- Publication number 20200169148
- Publication date May 28, 2020
- MAKITA CORPORATION
- Akihiro NAKAMOTO
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
Floating Heat Sink and Elastic Support Thereof
- Publication number 20200161211
- Publication date May 21, 2020
- Huawei Technologies Co., Ltd
- Jingfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING AN LED ELEMENT ON A FLAT CARRIER
- Publication number 20200161519
- Publication date May 21, 2020
- Lumileds LLC
- Michael DECKERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...
- Publication number 20200152546
- Publication date May 14, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXING DEVICE FOR DOUBLE SIDED HEAT SINK AND ASSOCIATED HEAT DISSIP...
- Publication number 20200141669
- Publication date May 7, 2020
- EMC IP Holding Company LLC
- Haifang Zhai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Mechanical Part for Fastening Processor, Assembly, and Computer Device
- Publication number 20200126889
- Publication date Apr 23, 2020
- Huawei Technologies Co., Ltd
- Yonghai Mao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK HOLD DOWN SYSTEM FOR DIRECT ATTACHMENT TO PRINTED CIRCUIT...
- Publication number 20200111723
- Publication date Apr 9, 2020
- Cisco Technology, Inc.
- Randy J. Bleske
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

heatsink to or through board or cabinet

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and method for holding a heat generating device

Semiconductor device and semiconductor module with improved heat di...

Heat sink

Circuit carrier arrangement and method for producing such a circuit...

Systems for providing thermal management to integrated circuits

Manufacturing method of semiconductor package using jig

Apparatus and method for holding a heat generating device

Electric working machine with semiconductor element that completes...

Heterogeneous integration module comprising thermal management appa...

Circuit carrier arrangement and method for producing such a circuit...

Floating heat sink and elastic support thereof

Socket loading mechanism for passive or active socket and package c...

Mounting devices for semiconductor packages with a fixation mechanism

Heat sink, heat dissipation apparatus, heat dissipation system, and...

Semiconductor device

Server microprocessor carrier with guiding alignment anti-tilt and...

Methods of forming flexure based cooling solutions for package stru...

Threaded cooling apparatus with integrated cooling channels and hea...

Heat dissipation structure and heat dissipation method

Fixing device for double sided heat sink and associated heat dissip...

Solid-state storage device

Apparatus, system, and method for increasing the cooling efficiency...

Apparatus, system, and method for dynamic compensation of heatsink-...

Heat sink fastening seat and securing device with gasket for use wi...

Mechanical part for fastening processor, assembly, and computer device

Electronic control unit and electric power steering device using th...

Mounting an LED element on a flat carrier

Flexible base design for chipset heat sink

Heat sink, heat dissipation apparatus, heat dissipation system, and...

Adjustable heat sink fin spacing

Patents Applicationslast 30 patents

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE WITH THERMAL DISSIPATING PACKAGE

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG

Circuit Carrier Arrangement And Method For Producing Such A Circuit...

Apparatus and Method for Holding a Heat Generating Device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

HEAT SINK

Circuit Carrier Arrangement And Method For Producing Such A Circuit...

SYSTEMS FOR PROVIDING THERMAL MANAGEMENT TO INTEGRATED CIRCUITS

Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...

APPARATUS AND METHOD FOR HOLDING A HEAT GENERATING DEVICE

METHODS OF FORMING FLEXURE BASED COOLING SOLUTIONS FOR PACKAGE STRU...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

POWER CONVERSION DEVICE

ELECTRONIC MODULE FOR MOTHERBOARD

SEMICONDUCTOR DEVICE

FLEXIBLE BASE DESIGN FOR CHIPSET HEAT SINK

MOUNTING DEVICES FOR SEMICONDUCTOR PACKAGES

HEATSINK FOR INFORMATION HANDLING SYSTEM

COMPONENT-MOUNTING DEVICE AND ELECTRONIC APPARATUS

ELECTRIC WORKING MACHINE WITH SEMICONDUCTOR ELEMENT THAT COMPLETES...

Floating Heat Sink and Elastic Support Thereof

MOUNTING AN LED ELEMENT ON A FLAT CARRIER

ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...

FIXING DEVICE FOR DOUBLE SIDED HEAT SINK AND ASSOCIATED HEAT DISSIP...

Mechanical Part for Fastening Processor, Assembly, and Computer Device

HEAT SINK HOLD DOWN SYSTEM FOR DIRECT ATTACHMENT TO PRINTED CIRCUIT...