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H01L2023/405

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2023/405heatsink to package

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Error-unlocking protection structure for heat dissipation base seat
- Patent number 12,300,572
- Issue date May 13, 2025
- Asia Vital Components (China) Co., Ltd.
- Xue-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,283,539
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Yuki Matsutaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Dual side direct cooling semiconductor package
- Patent number 12,266,590
- Issue date Apr 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Structure for evenly applying forces on a heat dissipation base plate
- Patent number 12,200,911
- Issue date Jan 14, 2025
- Asia Vital Components (China) Co., Ltd.
- Xue-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with blind hole attachment to heat sink
- Patent number 12,191,229
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,125,804
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Backing plate assembly with jack screw for bare die device heat sin...
- Patent number 12,096,601
- Issue date Sep 17, 2024
- Ciena Corporation
- Maxwell Thomas McKerlie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing direct silicon footprint microfluid...
- Patent number 12,080,626
- Issue date Sep 3, 2024
- Georgia Tech Research Corporation
- Luis Daniel Lorenzini Gutierrez
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit packages having mechanical brace standoffs
- Patent number 12,080,623
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE
- Publication number 20250233050
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20250219030
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS
- Publication number 20250210449
- Publication date Jun 26, 2025
- Monolithic Power Systems, Inc.
- Xin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
- Publication number 20250125218
- Publication date Apr 17, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Publication number 20250087615
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC DEVICE AND SERVER
- Publication number 20250014966
- Publication date Jan 9, 2025
- xFusion Digital Technologies Co., Ltd
- Shuimu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER AND SEMICONDUCTOR MODULE
- Publication number 20240421028
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240371726
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371795
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS
- Publication number 20240363486
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363611
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240282664
- Publication date Aug 22, 2024
- Mitsubishi Electric Corporation
- Hidetoshi ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240222206
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Takayuki MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
- Publication number 20240105547
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Edward Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
- Publication number 20240040689
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Ramdas Rangnath Ugale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Cover and Packaged Semiconductor Device Including the Same
- Publication number 20230420337
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20230386965
- Publication date Nov 30, 2023
- Yamaichi Electronics Co., Ltd.
- Koichi MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378098
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
- Publication number 20230369283
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCONDUCTIVE MATERIAL AND ELECTRONIC COMPONENT
- Publication number 20230352365
- Publication date Nov 2, 2023
- Youji SHIRATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
- Publication number 20230343674
- Publication date Oct 26, 2023
- Vitesco Technologies GMBH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS

heatsink to package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for power module for inverter for electric vehicle

Systems and methods for power module for inverter for electric vehicle

Systems and methods for multiple output integrated gate driver for...

Systems and methods for galvanic isolation for inverter for electri...

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Error-unlocking protection structure for heat dissipation base seat

Integrated circuit package and method

Systems and methods for cooling system and power module for inverte...

Semiconductor device

Systems and methods for parameter drift correction for inverter for...

Dual side direct cooling semiconductor package

Systems and methods for cooling system and power module for inverte...

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Electronic module comprising a semiconductor package with integrate...

Systems and methods for integrated gate driver for inverter for ele...

Manufacturing method of semiconductor package using jig

Systems and methods for non-overlap enforcement for inverter for el...

Structure for evenly applying forces on a heat dissipation base plate

Semiconductor package with blind hole attachment to heat sink

Systems and methods for single channel fault encoding for inverter...

Systems and methods for phase switch timing controller for inverter...

Package structure having hollow cylinders and method of fabricating...

Semiconductor package and manufacturing method thereof

Systems and methods for bidirectional message architecture for inve...

Systems and methods for integrated gate driver for inverter for ele...

Backing plate assembly with jack screw for bare die device heat sin...

System and method for providing direct silicon footprint microfluid...

Integrated circuit packages having mechanical brace standoffs

Patents Applicationslast 30 patents

DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

ELECTRONIC DEVICE AND SERVER

COOLER AND SEMICONDUCTOR MODULE

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE

Cooling Cover and Packaged Semiconductor Device Including the Same

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG

THERMOCONDUCTIVE MATERIAL AND ELECTRONIC COMPONENT

Circuit Carrier Arrangement And Method For Producing Such A Circuit...