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H01L2023/405

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2023/405heatsink to package

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,125,804
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Backing plate assembly with jack screw for bare die device heat sin...
- Patent number 12,096,601
- Issue date Sep 17, 2024
- Ciena Corporation
- Maxwell Thomas McKerlie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing direct silicon footprint microfluid...
- Patent number 12,080,626
- Issue date Sep 3, 2024
- Georgia Tech Research Corporation
- Luis Daniel Lorenzini Gutierrez
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit packages having mechanical brace standoffs
- Patent number 12,080,623
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,074,154
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures, electrical systems with thermal inter...
- Patent number 12,014,971
- Issue date Jun 18, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader with integrated fins
- Patent number 11,877,425
- Issue date Jan 16, 2024
- GM CRUISE HOLDINGS LLC
- Kaida Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resin case having groove at corner t...
- Patent number 11,876,033
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Takuro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device, power device assembly, and related apparatus
- Patent number 11,862,531
- Issue date Jan 2, 2024
- Huawei Technologies Co., Ltd.
- Yankun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,824,017
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket load regulation utilizing CPU carriers with shim components
- Patent number 11,818,832
- Issue date Nov 14, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for providing thermal management to integrated circuits
- Patent number 11,810,836
- Issue date Nov 7, 2023
- Arista Networks, Inc.
- Tiffany Doria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 11,804,468
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,764,126
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,749,582
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,728,240
- Issue date Aug 15, 2023
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer for power modules
- Patent number 11,610,832
- Issue date Mar 21, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated circuit packages with mechanical braces
- Patent number 11,538,735
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,515,268
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding and ignition prevention device for semiconductor element, a...
- Patent number 11,502,018
- Issue date Nov 15, 2022
- Mitsubishi Electric Corporation
- Atsutoshi Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,502,019
- Issue date Nov 15, 2022
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module package casing with protrusion supports
- Patent number 11,482,468
- Issue date Oct 25, 2022
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,476,180
- Issue date Oct 18, 2022
- Mitsubishi Electric Corporation
- Hiroshi Nomiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of vertical heat conduction elements attached to metal film
- Patent number 11,469,162
- Issue date Oct 11, 2022
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card-type connector having heat conductive members extending over t...
- Patent number 11,444,405
- Issue date Sep 13, 2022
- Japan Aviation Electronics Industry, Limited
- Tomohiro Nakamura
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
COOLER AND SEMICONDUCTOR MODULE
- Publication number 20240421028
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240371726
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371795
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS
- Publication number 20240363486
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363611
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240282664
- Publication date Aug 22, 2024
- Mitsubishi Electric Corporation
- Hidetoshi ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240222206
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Takayuki MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
- Publication number 20240105547
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Edward Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
- Publication number 20240040689
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Ramdas Rangnath Ugale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Cover and Packaged Semiconductor Device Including the Same
- Publication number 20230420337
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20230386965
- Publication date Nov 30, 2023
- Yamaichi Electronics Co., Ltd.
- Koichi MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378098
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
- Publication number 20230369283
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCONDUCTIVE MATERIAL AND ELECTRONIC COMPONENT
- Publication number 20230352365
- Publication date Nov 2, 2023
- Youji SHIRATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
- Publication number 20230343674
- Publication date Oct 26, 2023
- Vitesco Technologies GMBH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20230230895
- Publication date Jul 20, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187311
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Blind Hole Attachment to Heat Sink
- Publication number 20230125452
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230066410
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE
- Publication number 20230019930
- Publication date Jan 19, 2023
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURES, ELECTRICAL SYSTEMS WITH THERMAL INTER...
- Publication number 20220384307
- Publication date Dec 1, 2022
- NXP USA, Inc.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220359343
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220359344
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220285289
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE, POWER DEVICE ASSEMBLY, AND RELATED APPARATUS
- Publication number 20220270952
- Publication date Aug 25, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Yankun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS AND METHOD OF FABRICATING...
- Publication number 20220246570
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220149030
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS

heatsink to package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for phase switch timing controller for inverter...

Package structure having hollow cylinders and method of fabricating...

Systems and methods for bidirectional message architecture for inve...

Semiconductor package and manufacturing method thereof

Systems and methods for integrated gate driver for inverter for ele...

Backing plate assembly with jack screw for bare die device heat sin...

System and method for providing direct silicon footprint microfluid...

Integrated circuit packages having mechanical brace standoffs

Package structure

Thermal interface structures, electrical systems with thermal inter...

Circuit carrier arrangement and method for producing such a circuit...

Heat spreader with integrated fins

Semiconductor device including resin case having groove at corner t...

Power device, power device assembly, and related apparatus

Semiconductor package and manufacturing method thereof

Socket load regulation utilizing CPU carriers with shim components

Systems for providing thermal management to integrated circuits

Manufacturing method of semiconductor package using jig

Semiconductor device and method of manufacturing semiconductor device

Package structure

Circuit carrier arrangement and method for producing such a circuit...

Heat transfer for power modules

Method of forming integrated circuit packages with mechanical braces

Semiconductor package and manufacturing method thereof

Holding and ignition prevention device for semiconductor element, a...

Heat sink, heat dissipation apparatus, heat dissipation system, and...

Power module package casing with protrusion supports

Semiconductor device

Plurality of vertical heat conduction elements attached to metal film

Card-type connector having heat conductive members extending over t...

Patents Applicationslast 30 patents

COOLER AND SEMICONDUCTOR MODULE

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE

Cooling Cover and Packaged Semiconductor Device Including the Same

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG

THERMOCONDUCTIVE MATERIAL AND ELECTRONIC COMPONENT

Circuit Carrier Arrangement And Method For Producing Such A Circuit...

HEAT TRANSFER FOR POWER MODULES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Package with Blind Hole Attachment to Heat Sink

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE

THERMAL INTERFACE STRUCTURES, ELECTRICAL SYSTEMS WITH THERMAL INTER...

PACKAGE STRUCTURE

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

POWER DEVICE, POWER DEVICE ASSEMBLY, AND RELATED APPARATUS

PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS AND METHOD OF FABRICATING...

PACKAGE STRUCTURE