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HEAT TRANSFER FOR POWER MODULES
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Publication number 20230230895
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Publication date Jul 20, 2023
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Jerome TEYSSEYRE
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20220359343
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Publication date Nov 10, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Chia Lai
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H01 - BASIC ELECTRIC ELEMENTS
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Integrated Circuit Package and Method
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Publication number 20220359344
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Publication date Nov 10, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Shu-Rong Chun
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20220149030
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Publication date May 12, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Tsung-Shu Lin
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20220037228
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Publication date Feb 3, 2022
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Yu-Chia Lai
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20210366889
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Publication date Nov 25, 2021
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Tsung-Shu Lin
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H01 - BASIC ELECTRIC ELEMENTS
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Integrated Circuit Package and Method
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Publication number 20210272875
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Publication date Sep 2, 2021
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Yuan Sheng Chiu
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H01 - BASIC ELECTRIC ELEMENTS