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H01L2224/48092

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48092Helix

Industries

Patents Grantslast 30 patents

Information Patent Grant
Curved pillar interconnects
- Patent number 11,239,400
- Issue date Feb 1, 2022
- Facebook Technologies, LLC
- Zheng Sung Chio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED light bulb
- Patent number 11,035,525
- Issue date Jun 15, 2021
- ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD.
- Tao Jiang
- F21 - LIGHTING
Information Patent Grant
LED filament and led light bulb
- Patent number 10,976,010
- Issue date Apr 13, 2021
- ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LT
- Tao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED light bulb with two sets of filaments
- Patent number 10,690,293
- Issue date Jun 23, 2020
- Tao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and semiconductor packages including the same
- Patent number 10,622,312
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Myoung-soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED filament and LED light bulb
- Patent number 10,359,152
- Issue date Jul 23, 2019
- ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO, LTD
- Tao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 10,262,924
- Issue date Apr 16, 2019
- ABLIC INC.
- Kiyoaki Kadoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for interconnecting electronic systems having dif...
- Patent number 9,887,487
- Issue date Feb 6, 2018
- Nanotec Solution
- Christophe Blondin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with inductive bond wires
- Patent number 9,646,947
- Issue date May 9, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Justin P. Bandholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including interconnection members
- Patent number 9,478,515
- Issue date Oct 25, 2016
- SK hynix Inc.
- Jung Tae Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter package with an integrated output inductor
- Patent number 9,437,570
- Issue date Sep 6, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flexible stack packages having wing portions
- Patent number 9,425,169
- Issue date Aug 23, 2016
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical accelerometer with wireless transmission cap...
- Patent number 9,075,078
- Issue date Jul 7, 2015
- Infineon Technologies AG
- Horst Theuss
- G01 - MEASURING TESTING
Information Patent Grant
Flexible semiconductor package apparatus having a responsive bendab...
- Patent number 8,618,656
- Issue date Dec 31, 2013
- Hynix Semiconductor Inc.
- Tac Keun Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode
- Patent number 8,247,825
- Issue date Aug 21, 2012
- Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
- Chin-Long Ku
- F21 - LIGHTING
Information Patent Grant
Illumination system
- Patent number 8,143,789
- Issue date Mar 27, 2012
- Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
- Chin-Long Ku
- F21 - LIGHTING
Information Patent Grant
Flexible semiconductor package apparatus having a responsive bendab...
- Patent number 8,049,332
- Issue date Nov 1, 2011
- Hynix Semiconductor Inc.
- Tac Keun Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode lamp
- Patent number 8,025,421
- Issue date Sep 27, 2011
- Foxconn Technology Co., Ltd.
- Chin-Long Ku
- F21 - LIGHTING
Information Patent Grant
Light emitting device
- Patent number 8,022,429
- Issue date Sep 20, 2011
- NEC Lighting, Ltd.
- Yoshinori Ueji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices having integrated inductor
- Patent number 8,017,410
- Issue date Sep 13, 2011
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method for manufacturing the same
- Patent number 7,989,838
- Issue date Aug 2, 2011
- Foxconn Technology Co., Ltd.
- Chin-Long Ku
- F21 - LIGHTING
Information Patent Grant
Light emitting device
- Patent number 7,977,697
- Issue date Jul 12, 2011
- NEC Lighting, Ltd.
- Yoshinori Ueji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential signaling system and method of controlling skew betwee...
- Patent number 7,786,751
- Issue date Aug 31, 2010
- Hitachi Cable, Ltd.
- Norio Chujo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electrostatic discharge protection circuit
- Patent number 7,751,164
- Issue date Jul 6, 2010
- Marvell International Ltd.
- Xiaodong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices having integrated inductor
- Patent number 7,723,129
- Issue date May 25, 2010
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies with bond pads of two or more semiconductor devices elec...
- Patent number 7,557,454
- Issue date Jul 7, 2009
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices having integrated inductor
- Patent number 7,531,893
- Issue date May 12, 2009
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection circuit
- Patent number 7,002,220
- Issue date Feb 21, 2006
- Marvell International Ltd.
- Xiaodong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for packaging semiconductor devices
- Patent number 6,955,941
- Issue date Oct 18, 2005
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LED LIGHT BULB
- Publication number 20190162370
- Publication date May 30, 2019
- ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD.
- TAO JIANG
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING INTERCONNECTION MEMBERS
- Publication number 20160307867
- Publication date Oct 20, 2016
- SK HYNIX INC.
- Jung Tae JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT...
- Publication number 20160086909
- Publication date Mar 24, 2016
- MC10, Inc.
- David G. Garlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR INTERCONNECTING ELECTRONIC SYSTEMS HAVING DIF...
- Publication number 20130323942
- Publication date Dec 5, 2013
- Nanotec Solution
- Christophe Blondin
- G01 - MEASURING TESTING
Information Patent Application
ELECTROCHEMICAL METHODS FOR WIRE BONDING
- Publication number 20130142566
- Publication date Jun 6, 2013
- Min-Feng Yu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED PASSIVE COMPONENT
- Publication number 20120256283
- Publication date Oct 11, 2012
- Joerg Franke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SENSOR
- Publication number 20120073371
- Publication date Mar 29, 2012
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...
- Publication number 20120013016
- Publication date Jan 19, 2012
- Tac Keun OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20110205739
- Publication date Aug 25, 2011
- NEC LIGHTING, LTD.
- Yoshinori UEJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit With Inductive Bond Wires
- Publication number 20110148543
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Justin P. Bandholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Having Integrated Inductor
- Publication number 20100197045
- Publication date Aug 5, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATION SYSTEM
- Publication number 20100164384
- Publication date Jul 1, 2010
- FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
- Chin-Long Ku
- F21 - LIGHTING
Information Patent Application
LIGHT EMITTING DIODE
- Publication number 20100163891
- Publication date Jul 1, 2010
- FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
- CHIN-LONG KU
- F21 - LIGHTING
Information Patent Application
LIGHT EMITTING DIODE LAMP
- Publication number 20100165600
- Publication date Jul 1, 2010
- FOXCONN TECHNOLOGY CO., LTD.
- CHIN-LONG KU
- F21 - LIGHTING
Information Patent Application
LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100155766
- Publication date Jun 24, 2010
- FOXCONN TECHNOLOGY CO., LTD.
- CHIN-LONG KU
- F21 - LIGHTING
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...
- Publication number 20100109140
- Publication date May 6, 2010
- Tac Keun OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20090302340
- Publication date Dec 10, 2009
- NEC LIGHTING, LTD.
- Yoshinori UEJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Having Integrated Inductor
- Publication number 20090186453
- Publication date Jul 23, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL SIGNALING SYSTEM AND METHOD OF CONTROLLING SKEW BETWEE...
- Publication number 20080030242
- Publication date Feb 7, 2008
- Norio Chujo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Power Semiconductor Devices Having Integrated Inductor
- Publication number 20080029907
- Publication date Feb 7, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits Having Controlled Inductances
- Publication number 20070296056
- Publication date Dec 27, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Anthony L. Coyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transponder device with mega pads
- Publication number 20070132595
- Publication date Jun 14, 2007
- ATMEL GERMANY GMBH
- Roland Schropp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Assemblies with bond pads of two or more semiconductor devices elec...
- Publication number 20050248013
- Publication date Nov 10, 2005
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for packaging semiconductor devices
- Publication number 20030170932
- Publication date Sep 11, 2003
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical element module
- Publication number 20030098507
- Publication date May 29, 2003
- Shinichi Takagi
- G02 - OPTICS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Curved pillar interconnects

LED light bulb

LED filament and led light bulb

LED light bulb with two sets of filaments

Semiconductor chips and semiconductor packages including the same

LED filament and LED light bulb

Semiconductor device and electronic apparatus

Device and method for interconnecting electronic systems having dif...

Electronic device and method of fabricating an electronic device

Integrated circuit with inductive bond wires

Semiconductor packages including interconnection members

Power converter package with an integrated output inductor

Flexible stack packages having wing portions

Microelectromechanical accelerometer with wireless transmission cap...

Flexible semiconductor package apparatus having a responsive bendab...

Light emitting diode

Illumination system

Flexible semiconductor package apparatus having a responsive bendab...

Light emitting diode lamp

Light emitting device

Power semiconductor devices having integrated inductor

Light emitting diode and method for manufacturing the same

Light emitting device

Differential signaling system and method of controlling skew betwee...

Electrostatic discharge protection circuit

Power semiconductor devices having integrated inductor

Assemblies with bond pads of two or more semiconductor devices elec...

Power semiconductor devices having integrated inductor

ESD protection circuit

Methods and apparatus for packaging semiconductor devices

Patents Applicationslast 30 patents

LED LIGHT BULB

SEMICONDUCTOR PACKAGES INCLUDING INTERCONNECTION MEMBERS

METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT...

DEVICE AND METHOD FOR INTERCONNECTING ELECTRONIC SYSTEMS HAVING DIF...

ELECTROCHEMICAL METHODS FOR WIRE BONDING

INTEGRATED PASSIVE COMPONENT

MICROELECTROMECHANICAL SENSOR

FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...

LIGHT EMITTING DEVICE

Integrated Circuit With Inductive Bond Wires

Power Semiconductor Devices Having Integrated Inductor

ILLUMINATION SYSTEM

LIGHT EMITTING DIODE

LIGHT EMITTING DIODE LAMP

LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...

LIGHT EMITTING DEVICE

Power Semiconductor Devices Having Integrated Inductor

DIFFERENTIAL SIGNALING SYSTEM AND METHOD OF CONTROLLING SKEW BETWEE...

Power Semiconductor Devices Having Integrated Inductor

Integrated Circuits Having Controlled Inductances

Transponder device with mega pads

Assemblies with bond pads of two or more semiconductor devices elec...

Methods and apparatus for packaging semiconductor devices

Optical element module