High density interconnect [HDI] connectors Manufacturing methods related thereto

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H01L2224/18

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/18High density interconnect [HDI] connectors Manufacturing methods related thereto

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,165,985
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standard commodity FPGA IC chips
- Patent number 12,153,865
- Issue date Nov 26, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diode constructions and methods for making the same
- Patent number 12,148,868
- Issue date Nov 19, 2024
- Bridgelux, Inc.
- Vladimir A. Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structure and method of manufacture
- Patent number 12,131,984
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 12,100,674
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable devices formed on gallium and nitrogen material
- Patent number 12,088,065
- Issue date Sep 10, 2024
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 12,080,690
- Issue date Sep 3, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package formation methods including coupling a molded routing layer...
- Patent number 12,057,364
- Issue date Aug 6, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 12,020,953
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of warpage using ABF GC cavity for embedded die package
- Patent number 12,009,318
- Issue date Jun 11, 2024
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,009,575
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nan-Chin Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package structure and methods of forming same
- Patent number 12,009,345
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,935,907
- Issue date Mar 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device reflective bank structure
- Patent number 11,916,048
- Issue date Feb 27, 2024
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,916,028
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC decoupling capacitor structure and method for manufacturing t...
- Patent number 11,908,788
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial dielectric for lithographic via formation to enable via...
- Patent number 11,908,821
- Issue date Feb 20, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including embedded bridge interconnect stru...
- Patent number 11,901,334
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
InFO-POP structures with TIVs having cavities
- Patent number 11,901,302
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,901,303
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iintegrated fan-out packages with embedded heat dissipation structure
- Patent number 11,901,258
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387392
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
- Publication number 20240362386
- Publication date Oct 31, 2024
- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...
- Publication number 20240355697
- Publication date Oct 24, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240266377
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
- Publication number 20240232489
- Publication date Jul 11, 2024
- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
- Publication number 20240234385
- Publication date Jul 11, 2024
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE
- Publication number 20240234299
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240194649
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Geol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNE...
- Publication number 20240178189
- Publication date May 30, 2024
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240178256
- Publication date May 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170419
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
InFO-POP Structures with TIVs Having Cavities
- Publication number 20240136298
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Dp., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
- Publication number 20240135079
- Publication date Apr 25, 2024
- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM
- Publication number 20240079381
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240030125
- Publication date Jan 25, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20240014119
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Sung Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY
- Publication number 20230361099
- Publication date Nov 9, 2023
- Jade Bird Display (Shanghai) Limited
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230343604
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20230343133
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING

High density interconnect [HDI] connectors Manufacturing methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Logic drive based on standard commodity FPGA IC chips

Light emitting diode constructions and methods for making the same

Multi-chip integrated fan-out package

Integrated fan-out package and the methods of manufacturing

Heterogeneous fan-out structure and method of manufacture

Package structure with fan-out feature

Embedded resistor-capacitor film for fan out wafer level packaging

Manufacturable devices formed on gallium and nitrogen material

Formation method of chip package with fan-out structure

Micro assembled LED displays and lighting elements

Package formation methods including coupling a molded routing layer...

Fan-out structure and method of fabricating the same

Semiconductor packages having a die, an encapsulant, and a redistri...

Control of warpage using ABF GC cavity for embedded die package

Package structure

3D package structure and methods of forming same

Stacked via structure

Semiconductor package and manufacturing method thereof

Image sensor device

LTHC as charging barrier in info package formation

Light emitting device reflective bank structure

Package structure and method of forming the same

3D IC decoupling capacitor structure and method for manufacturing t...

Sacrificial dielectric for lithographic via formation to enable via...

Microelectronic devices including embedded bridge interconnect stru...

InFO-POP structures with TIVs having cavities

Integrated fan-out package

Iintegrated fan-out packages with embedded heat dissipation structure

Contact pad for semiconductor device

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Fingerprint Sensor Device and Method

SEMICONDUCTOR DEVICE AND METHOD

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

IMAGE SENSOR DEVICE

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

STACKED VIA STRUCTURE

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNE...

IMAGE SENSOR DEVICE

PACKAGE STRUCTURE

InFO-POP Structures with TIVs Having Cavities

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM

ELECTRONIC DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT SEMICONDUCTOR PACKAGE

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY

Process Including a Re-etching Process for Forming a Semiconductor...

SEMICONDUCTOR DEVICE AND METHOD

Fingerprint Sensor Device and Method