High density interconnect [HDI] connectors; Manufacturing methods related thereto

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H01L24/18

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/18High density interconnect [HDI] connectors; Manufacturing methods related thereto

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method of manufacturing the same, an...
- Patent number 12,125,758
- Issue date Oct 22, 2024
- Mitsubishi Electric Corporation
- Nobuhiro Asaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,068,230
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Kohei Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layout for semiconductor device
- Patent number 11,961,878
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,414
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kohei Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,413
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kohei Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,935,907
- Issue date Mar 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative interconnect design for package architecture to improve...
- Patent number 11,929,339
- Issue date Mar 12, 2024
- Intel Corporation
- Md Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a package
- Patent number 11,913,132
- Issue date Feb 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Chun Hsu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,798,898
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,791,313
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging for power semiconductor devices
- Patent number 11,776,883
- Issue date Oct 3, 2023
- GaN Systems Inc.
- Cameron Mcknight-Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 11,732,297
- Issue date Aug 22, 2023
- Life Technologies Corporation
- Jonathan Rothberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,699,643
- Issue date Jul 11, 2023
- Samsung Electronics Co., Ltd.
- Ik Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 11,664,287
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative interconnect design for package architecture to improve...
- Patent number 11,658,144
- Issue date May 23, 2023
- Intel Corporation
- Md Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting display unit and display apparatus
- Patent number 11,652,077
- Issue date May 16, 2023
- PlayNitride Display Co., Ltd.
- Po-Jen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,545,469
- Issue date Jan 3, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Yi-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,456,280
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 11,410,956
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with fan-out structure
- Patent number 11,404,381
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging for power semiconductor devices
- Patent number 11,342,248
- Issue date May 24, 2022
- GaN Systems Inc.
- Cameron Mcknight-Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 11,339,430
- Issue date May 24, 2022
- Life Technologies Corporation
- Jonathan Rothberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB copper layer for signal and power routing
- Patent number 11,322,445
- Issue date May 3, 2022
- Intel Corporation
- Yidnekachew S. Mekonnen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240371735
- Publication date Nov 7, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240266377
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240234265
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Innovative Interconnect Design for Package Architecture to Improve...
- Publication number 20240213201
- Publication date Jun 27, 2024
- Intel Corporation
- MD Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Layout for Semiconductor Device
- Publication number 20240194730
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240186224
- Publication date Jun 6, 2024
- RENESAS ELECTRONICS CORPORATION
- Tomohiro NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240178256
- Publication date May 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Fin Placement Assembly for Forming Temperature Control Element...
- Publication number 20240038620
- Publication date Feb 1, 2024
- Google LLC
- Yingshi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230395475
- Publication date Dec 7, 2023
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230395476
- Publication date Dec 7, 2023
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230369288
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Innovative Interconnect Design for Package Architecture to Improve...
- Publication number 20230352431
- Publication date Nov 2, 2023
- Intel Corporation
- MD Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230245961
- Publication date Aug 3, 2023
- Rohm Co., Ltd.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME
- Publication number 20230245976
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230170283
- Publication date Jun 1, 2023
- STMicroelectronics S.r.l
- Paolo CREMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230110154
- Publication date Apr 13, 2023
- Rohm Co., Ltd.
- Bin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230082976
- Publication date Mar 16, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING ELECTRONIC CHIP
- Publication number 20230068222
- Publication date Mar 2, 2023
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230045523
- Publication date Feb 9, 2023
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method of Manufacturing the Same, an...
- Publication number 20220415738
- Publication date Dec 29, 2022
- MITSUBISHI ELECTRIC CORPORATION
- Nobuhiro ASAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20220392872
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20220359447
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Measuring Analytes Using Large Scale FET...
- Publication number 20220340965
- Publication date Oct 27, 2022
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
PACKAGE STRUCTURE WITH FAN-OUT FEATURE
- Publication number 20220336363
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS

High density interconnect [HDI] connectors; Manufacturing methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure with fan-out feature

Power semiconductor device and method of manufacturing the same, an...

Chip package structure with bump

Formation method of chip package with fan-out structure

Semiconductor module

Semiconductor packages having a die, an encapsulant, and a redistri...

Semiconductor package and manufacturing method thereof

Interconnect layout for semiconductor device

Semiconductor module

Semiconductor module

Image sensor device

Innovative interconnect design for package architecture to improve...

Method for manufacturing a package

Package-on-package assembly with wire bonds to encapsulation surface

Package structure

Semiconductor package and method of forming the same

Embedded die packaging for power semiconductor devices

Methods and apparatus for measuring analytes using large scale FET...

Fan-out semiconductor package

Packaged semiconductor devices and methods of packaging semiconduct...

Innovative interconnect design for package architecture to improve...

Light-emitting display unit and display apparatus

Semiconductor package and manufacturing method thereof

Semiconductor package and method of forming the same

Chip package structure with bump

Chip package with fan-out structure

Semiconductor packages having thermal through vias (TTV)

Embedded die packaging for power semiconductor devices

Methods and apparatus for measuring analytes using large scale FET...

EMIB copper layer for signal and power routing

Patents Applicationslast 30 patents

Chip Package Structure with Bump

SEMICONDUCTOR MODULE

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

IMAGE SENSOR DEVICE

SEMICONDUCTOR MODULE

Innovative Interconnect Design for Package Architecture to Improve...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Interconnect Layout for Semiconductor Device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

IMAGE SENSOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Pin Fin Placement Assembly for Forming Temperature Control Element...

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

Innovative Interconnect Design for Package Architecture to Improve...

SEMICONDUCTOR MODULE

SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING ELECTRONIC CHIP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Power Semiconductor Device and Method of Manufacturing the Same, an...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Chip Package Structure with Bump

Methods and Apparatus for Measuring Analytes Using Large Scale FET...

PACKAGE STRUCTURE WITH FAN-OUT FEATURE

3D Integrated Circuit and Methods of Forming the Same