High density interconnect [HDI] connectors; Manufacturing methods related thereto

Industry

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H01L24/18

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/18High density interconnect [HDI] connectors; Manufacturing methods related thereto

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layout for semiconductor device
- Patent number 11,961,878
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,414
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kohei Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,413
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kohei Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,935,907
- Issue date Mar 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative interconnect design for package architecture to improve...
- Patent number 11,929,339
- Issue date Mar 12, 2024
- Intel Corporation
- Md Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a package
- Patent number 11,913,132
- Issue date Feb 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Chun Hsu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,798,898
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,791,313
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging for power semiconductor devices
- Patent number 11,776,883
- Issue date Oct 3, 2023
- GaN Systems Inc.
- Cameron Mcknight-Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 11,732,297
- Issue date Aug 22, 2023
- Life Technologies Corporation
- Jonathan Rothberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,699,643
- Issue date Jul 11, 2023
- Samsung Electronics Co., Ltd.
- Ik Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 11,664,287
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative interconnect design for package architecture to improve...
- Patent number 11,658,144
- Issue date May 23, 2023
- Intel Corporation
- Md Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting display unit and display apparatus
- Patent number 11,652,077
- Issue date May 16, 2023
- PlayNitride Display Co., Ltd.
- Po-Jen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,545,469
- Issue date Jan 3, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Yi-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,456,280
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 11,410,956
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with fan-out structure
- Patent number 11,404,381
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 11,339,430
- Issue date May 24, 2022
- Life Technologies Corporation
- Jonathan Rothberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging for power semiconductor devices
- Patent number 11,342,248
- Issue date May 24, 2022
- GaN Systems Inc.
- Cameron Mcknight-Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB copper layer for signal and power routing
- Patent number 11,322,445
- Issue date May 3, 2022
- Intel Corporation
- Yidnekachew S. Mekonnen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages having a die with an enca...
- Patent number 11,315,891
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS with over-voltage protection
- Patent number 11,312,622
- Issue date Apr 26, 2022
- SiTime Corporation
- Nicholas Miller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package structure including connecting posts and chip package...
- Patent number 11,257,765
- Issue date Feb 22, 2022
- Shanghai AVIC OPTO Electronics Co., Ltd.
- Kerui Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Throughput-scalable analytical system using transmembrane pore sensors
- Patent number 11,204,313
- Issue date Dec 21, 2021
- GeneSense Technology Inc.
- Mei Yan
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Interconnect layout for semiconductor device
- Patent number 11,201,205
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Fin Placement Assembly for Forming Temperature Control Element...
- Publication number 20240038620
- Publication date Feb 1, 2024
- Google LLC
- Yingshi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230395475
- Publication date Dec 7, 2023
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230395476
- Publication date Dec 7, 2023
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230369288
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Innovative Interconnect Design for Package Architecture to Improve...
- Publication number 20230352431
- Publication date Nov 2, 2023
- Intel Corporation
- MD Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230245961
- Publication date Aug 3, 2023
- Rohm Co., Ltd.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME
- Publication number 20230245976
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230170283
- Publication date Jun 1, 2023
- STMicroelectronics S.r.l
- Paolo CREMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230110154
- Publication date Apr 13, 2023
- Rohm Co., Ltd.
- Bin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230082976
- Publication date Mar 16, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING ELECTRONIC CHIP
- Publication number 20230068222
- Publication date Mar 2, 2023
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230045523
- Publication date Feb 9, 2023
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method of Manufacturing the Same, an...
- Publication number 20220415738
- Publication date Dec 29, 2022
- MITSUBISHI ELECTRIC CORPORATION
- Nobuhiro ASAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20220392872
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20220359447
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Measuring Analytes Using Large Scale FET...
- Publication number 20220340965
- Publication date Oct 27, 2022
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
PACKAGE STRUCTURE WITH FAN-OUT FEATURE
- Publication number 20220336363
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220302082
- Publication date Sep 22, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Yi-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
- Publication number 20220285241
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Packages Having a Die with an Enca...
- Publication number 20220246559
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES
- Publication number 20220246503
- Publication date Aug 4, 2022
- GaN Systems Inc.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220208607
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Layout for Semiconductor Device
- Publication number 20220102482
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Innovative Interconnect Design for Package Architecture to Improve...
- Publication number 20220059491
- Publication date Feb 24, 2022
- Intel Corporation
- MD Altaf Hossain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES
- Publication number 20220020669
- Publication date Jan 20, 2022
- GAN SYSTEMS INC.
- Cameron MCKNIGHT-MACNEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20210366970
- Publication date Nov 25, 2021
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS

High density interconnect [HDI] connectors; Manufacturing methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Interconnect layout for semiconductor device

Semiconductor module

Semiconductor module

Image sensor device

Innovative interconnect design for package architecture to improve...

Method for manufacturing a package

Package-on-package assembly with wire bonds to encapsulation surface

Package structure

Semiconductor package and method of forming the same

Embedded die packaging for power semiconductor devices

Methods and apparatus for measuring analytes using large scale FET...

Fan-out semiconductor package

Packaged semiconductor devices and methods of packaging semiconduct...

Innovative interconnect design for package architecture to improve...

Light-emitting display unit and display apparatus

Semiconductor package and manufacturing method thereof

Semiconductor package and method of forming the same

Chip package structure with bump

Chip package with fan-out structure

Semiconductor packages having thermal through vias (TTV)

Methods and apparatus for measuring analytes using large scale FET...

Embedded die packaging for power semiconductor devices

EMIB copper layer for signal and power routing

Methods of forming semiconductor packages having a die with an enca...

MEMS with over-voltage protection

Chip package structure including connecting posts and chip package...

Packaged microelectronic devices having stacked interconnect elemen...

Throughput-scalable analytical system using transmembrane pore sensors

Interconnect layout for semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Pin Fin Placement Assembly for Forming Temperature Control Element...

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

Innovative Interconnect Design for Package Architecture to Improve...

SEMICONDUCTOR MODULE

SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING ELECTRONIC CHIP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Power Semiconductor Device and Method of Manufacturing the Same, an...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Chip Package Structure with Bump

Methods and Apparatus for Measuring Analytes Using Large Scale FET...

PACKAGE STRUCTURE WITH FAN-OUT FEATURE

3D Integrated Circuit and Methods of Forming the Same

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...

Methods of Forming Semiconductor Packages Having a Die with an Enca...

EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES

3D Integrated Circuit and Methods of Forming the Same

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

Interconnect Layout for Semiconductor Device

Innovative Interconnect Design for Package Architecture to Improve...

EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES

IMAGE SENSOR DEVICE