High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]

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CPC
H01L2924/13064

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/13064High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor device having a barrier layer wit...
- Patent number 12,100,756
- Issue date Sep 24, 2024
- United Microelectronics Corp.
- Hao-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages with uniform components and methods of forming the...
- Patent number 12,074,149
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,651
- Issue date Aug 13, 2024
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package having a lateral power transistor with segmented chi...
- Patent number 12,040,302
- Issue date Jul 16, 2024
- Infineon Technologies Austria AG
- Hyeongnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-N transistor arrangements for reducing nonlinearity of off-stat...
- Patent number 12,027,613
- Issue date Jul 2, 2024
- Intel Corporation
- Nidhi Nidhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,996,354
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of stacked transistors attached by solder balls
- Patent number 11,984,387
- Issue date May 14, 2024
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,978,700
- Issue date May 7, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatuses and methods involving diamond and GaN-bas...
- Patent number 11,961,837
- Issue date Apr 16, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Srabanti Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable thin film gallium and nitrogen containing devices
- Patent number 11,955,521
- Issue date Apr 9, 2024
- KYOCERA SLD Laser, Inc.
- James W. Raring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,411
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 11,881,437
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for RF transistor amplifiers
- Patent number 11,837,457
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based radio frequency amplifiers having back side...
- Patent number 11,837,559
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor having die attach materials with channels and p...
- Patent number 11,830,810
- Issue date Nov 28, 2023
- Wolfspeed, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 11,817,494
- Issue date Nov 14, 2023
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 11,784,237
- Issue date Oct 10, 2023
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Kingyuen Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and semiconductor device
- Patent number 11,749,622
- Issue date Sep 5, 2023
- SUMITOMO DEVICE INNOVATIONS, INC.
- Chihoko Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,742,418
- Issue date Aug 29, 2023
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat conduction pattern for cooling a power module
- Patent number 11,710,683
- Issue date Jul 25, 2023
- Mitsubishi Electric Corporation
- Seiya Sugimachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,931
- Issue date Jun 13, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUIT...
- Publication number 20240421092
- Publication date Dec 19, 2024
- Qorvo US, Inc.
- Tobias Mangold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR MODULE
- Publication number 20240413235
- Publication date Dec 12, 2024
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES
- Publication number 20240404903
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Anita Herzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379579
- Publication date Nov 14, 2024
- Dynax Semiconductor, Inc.
- Yi PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240379835
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLI...
- Publication number 20240274688
- Publication date Aug 15, 2024
- Huawei Technologies Co., Ltd
- Zhili ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240274513
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES
- Publication number 20240213110
- Publication date Jun 27, 2024
- GaN Systems Inc.
- An-Sheng CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...
- Publication number 20240213184
- Publication date Jun 27, 2024
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED...
- Publication number 20240213127
- Publication date Jun 27, 2024
- GAN SYSTEMS INC.
- Abhinandan DIXIT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE FOR SEMICONDUCTOR ELEMENT
- Publication number 20240170353
- Publication date May 23, 2024
- ROHM CO., LTD.
- Tsuyoshi TACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGE...
- Publication number 20240162129
- Publication date May 16, 2024
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- B82 - NANO-TECHNOLOGY
Information Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
- Publication number 20240145414
- Publication date May 2, 2024
- Wolfspeed, Inc.
- Gerard Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
- Publication number 20240120248
- Publication date Apr 11, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20240112990
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED FLIP CHIP RADIO FREQUENCY TRANSISTOR AMPLIFIER CIRCUITS
- Publication number 20240105692
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Woo Eng Wah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS...
- Publication number 20240079320
- Publication date Mar 7, 2024
- Wolfspeed, Inc.
- Mitch FLOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240063097
- Publication date Feb 22, 2024
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...
- Publication number 20240047295
- Publication date Feb 8, 2024
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030338
- Publication date Jan 25, 2024
- Ancora Semiconductors Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230386981
- Publication date Nov 30, 2023
- ROHM CO., LTD.
- Kengo OHMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378013
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Kengo OHMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369319
- Publication date Nov 16, 2023
- WAVEPIA CO., LTD.
- Sang Hun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230361006
- Publication date Nov 9, 2023
- Rohm Co., Ltd.
- Ryuta YAGINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-on-wafer Cascode HEMT Device
- Publication number 20230343693
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Haw-Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC COMPRISING SEMICONDUCTOR SUBSTRATES WITH DIFFERENT BANDGAPS
- Publication number 20230326890
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS

High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

RF amplifier devices including top side contacts and methods of man...

Gallium nitride (GAN) three-dimensional integrated circuit technology

High electron mobility transistor device having a barrier layer wit...

Device packages with uniform components and methods of forming the...

Semiconductor device

Semiconductor device including source pad region and drain pad regi...

Contact and die attach metallization for silicon carbide based devi...

Device package having a lateral power transistor with segmented chi...

III-N transistor arrangements for reducing nonlinearity of off-stat...

Semiconductor device

Semiconductor device

Plurality of stacked transistors attached by solder balls

Semiconductor package having a chip carrier with a pad offset feature

Power semiconductor module arrangement

Semiconductor apparatuses and methods involving diamond and GaN-bas...

Manufacturable thin film gallium and nitrogen containing devices

Semiconductor device

Package for a semiconductor device

Integrated passive device (IPD) components and a package and proces...

Embedded package with electrically isolating dielectric liner

Packaging for RF transistor amplifiers

Group III nitride-based radio frequency amplifiers having back side...

Packaged transistor having die attach materials with channels and p...

Semiconductor device having reduced capacitance between source and...

Semiconductor devices and methods of manufacturing the same

Field effect transistor and semiconductor device

Semiconductor device

Heat conduction pattern for cooling a power module

Semiconductor package having a chip carrier and a metal plate sized...

Semiconductor package

Patents Applicationslast 30 patents

INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUIT...

NITRIDE SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

Power Semiconductor Devices Including Beryllium Metallization

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLI...

SEMICONDUCTOR DEVICE

EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES

INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...

EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED...

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE FOR SEMICONDUCTOR ELEMENT

SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGE...

RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT

SEMICONDUCTOR DEVICE

Embedded Package with Electrically Isolating Dielectric Liner

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

PACKAGED FLIP CHIP RADIO FREQUENCY TRANSISTOR AMPLIFIER CIRCUITS

PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS...

SEMICONDUCTOR DEVICE

3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Wafer-on-wafer Cascode HEMT Device

3D IC COMPRISING SEMICONDUCTOR SUBSTRATES WITH DIFFERENT BANDGAPS