High pressure chamber

Industry

CPC
H01L2224/7511

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7511High pressure chamber

Industries

Patents Grantslast 30 patents

Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing a composite and a power semiconductor module
- Patent number 9,688,060
- Issue date Jun 27, 2017
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a bond and a semiconductor module
- Patent number 9,202,800
- Issue date Dec 1, 2015
- Infineon Technologies AG
- Tao Hong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing electronic device and electronic device
- Patent number 8,389,328
- Issue date Mar 5, 2013
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating apparatus
- Patent number 7,661,573
- Issue date Feb 16, 2010
- Fujitsu Limited
- Osamu Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package with cavities for active devices
- Patent number 7,635,606
- Issue date Dec 22, 2009
- Skyworks Solutions, Inc.
- Robert W. Warren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adhesive-coated electronic parts on a connection sheet
- Patent number 6,841,022
- Issue date Jan 11, 2005
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting a plurality of electronic parts on a circuit board
- Patent number 6,479,757
- Issue date Nov 12, 2002
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting a plurality of electronic parts on a circuit board
- Patent number 6,158,115
- Issue date Dec 12, 2000
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20140312511
- Publication date Oct 23, 2014
- Kensuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
- Publication number 20140013595
- Publication date Jan 16, 2014
- Tao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Composite and a Power Semiconductor Module
- Publication number 20130203218
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND A...
- Publication number 20120199988
- Publication date Aug 9, 2012
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20110221075
- Publication date Sep 15, 2011
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer level package with cavities for active devices
- Publication number 20090075431
- Publication date Mar 19, 2009
- Skyworks Solutions, Inc.
- Robert W. Warren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for bonding electronic components
- Publication number 20080283579
- Publication date Nov 20, 2008
- ABB Research Ltd.
- Satish Gunturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY COMPLIANT PLATE FOR WAFER BONDING
- Publication number 20070284409
- Publication date Dec 13, 2007
- Mauro Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heating apparatus
- Publication number 20060273141
- Publication date Dec 7, 2006
- FUJITSU LIMITED
- Osamu Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Highly compliant plate for wafer bonding
- Publication number 20060003548
- Publication date Jan 5, 2006
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive-coated electronic parts on a connection sheet
- Publication number 20030029556
- Publication date Feb 13, 2003
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS

High pressure chamber

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Method for producing a composite and a power semiconductor module

Method and apparatus for chip-to-wafer integration

Methods for producing a bond and a semiconductor module

Method of manufacturing electronic device and electronic device

Heating apparatus

Wafer level package with cavities for active devices

Adhesive-coated electronic parts on a connection sheet

Method of mounting a plurality of electronic parts on a circuit board

Method of mounting a plurality of electronic parts on a circuit board

Patents Applicationslast 30 patents

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Sintering Utilizing Non-Mechanical Pressure

METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE

Method for Producing a Composite and a Power Semiconductor Module

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND A...

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

Wafer level package with cavities for active devices

Method for bonding electronic components

HIGHLY COMPLIANT PLATE FOR WAFER BONDING

Heating apparatus

Highly compliant plate for wafer bonding

Adhesive-coated electronic parts on a connection sheet