Holding devices

Industry

CPC
G01R31/2865

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/2865Holding devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for testing a semiconductor package
- Patent number 12,169,219
- Issue date Dec 17, 2024
- TSE CO., LTD.
- Min Cheol Kim
- G01 - MEASURING TESTING
Information Patent Grant
Semi-automatic prober
- Patent number 12,135,335
- Issue date Nov 5, 2024
- QualiTau, Inc.
- Edward McCloud
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for RF built-in test system for a beamforming...
- Patent number 12,111,350
- Issue date Oct 8, 2024
- Andrew John Bonthron
- G01 - MEASURING TESTING
Information Patent Grant
Test device, change kit, and method of exchanging change kit
- Patent number 12,106,997
- Issue date Oct 1, 2024
- Tokyo Electron Limited
- Hiroki Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Burn-in board seating
- Patent number 12,007,434
- Issue date Jun 11, 2024
- Micro Control Company
- Aidan Michael Fawcett
- G01 - MEASURING TESTING
Information Patent Grant
Inspection jig and board inspection apparatus including the same
- Patent number 11,988,687
- Issue date May 21, 2024
- NIDEC READ CORPORATION
- Kohei Tsumura
- G01 - MEASURING TESTING
Information Patent Grant
Probe station capable of maintaining stable and accurate contact to...
- Patent number 11,940,486
- Issue date Mar 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Kai Chao
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test device including temperature control module and...
- Patent number 11,927,623
- Issue date Mar 12, 2024
- SK Hynix Inc.
- Nack Hyun Kim
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit device die with wafer/package detection circuit
- Patent number 11,842,934
- Issue date Dec 12, 2023
- NXP B.V.
- Jan-Peter Schat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Test apparatus for semiconductor chips with fine-pitch bumps
- Patent number 11,828,792
- Issue date Nov 28, 2023
- AMT CO., LTD.
- Du Chul Kim
- G01 - MEASURING TESTING
Information Patent Grant
Method for open-loop or closed-loop control of the temperature of a...
- Patent number 11,821,941
- Issue date Nov 21, 2023
- ATT ADVANCED TEMPERATURE TEST SYSTEM GMBH
- Markus Eibl
- G01 - MEASURING TESTING
Information Patent Grant
Substrate processing carrier
- Patent number 11,823,965
- Issue date Nov 21, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for inspection of display panel
- Patent number 11,815,544
- Issue date Nov 14, 2023
- Samsung Display Co., Ltd.
- Hansu Cho
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
System and method for testing a semiconductor chip
- Patent number 11,774,491
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Yi-Kai Chao
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer testing system and related method for improving...
- Patent number 11,719,742
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor wafer and method of probe testing
- Patent number 11,694,937
- Issue date Jul 4, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-prober chuck assembly and channel
- Patent number 11,686,762
- Issue date Jun 27, 2023
- Korea Institute of Industrial Technology
- Kyung Tae Nam
- G01 - MEASURING TESTING
Information Patent Grant
Housing with anti-dislodge capability
- Patent number 11,674,998
- Issue date Jun 13, 2023
- Johnstech International Corporation
- Bob Chartrand
- G01 - MEASURING TESTING
Information Patent Grant
Contact and socket device for burning-in and testing semiconductor IC
- Patent number 11,668,744
- Issue date Jun 6, 2023
- Dong Weon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection system
- Patent number 11,656,271
- Issue date May 23, 2023
- MPI Corporation
- Yi-Hsuan Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and methods for testing semiconductor devices
- Patent number 11,594,435
- Issue date Feb 28, 2023
- Testmetrix, Inc.
- Christian O. Cojocneanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package test system and semiconductor package fabrica...
- Patent number 11,592,478
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Jaehong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card having power converter and test system including the same
- Patent number 11,585,833
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Sehoon Park
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer testing system and related method for improving...
- Patent number 11,506,706
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- G11 - INFORMATION STORAGE
Information Patent Grant
Over-the-air measurement system and over-the-air measurement method
- Patent number 11,486,922
- Issue date Nov 1, 2022
- Rohde & Schwarz GmbH & Co. KG
- Benoit Derat
- G01 - MEASURING TESTING
Information Patent Grant
Integrated-circuit-level test system and method
- Patent number 11,408,931
- Issue date Aug 9, 2022
- NANYA TECHNOLOGY CORPORATION
- Cheng-Sung Lai
- G01 - MEASURING TESTING
Information Patent Grant
Inductive testing probe apparatus for testing semiconductor die and...
- Patent number 11,402,426
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Tony M. Lindenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical test equipment with heating function
- Patent number 11,293,973
- Issue date Apr 5, 2022
- MPI Corporation
- Wen Pin Chuang
- G01 - MEASURING TESTING
Information Patent Grant
Shielding for probing system
- Patent number 11,262,400
- Issue date Mar 1, 2022
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Choon Leong Lou
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer and method of probe testing
- Patent number 11,257,724
- Issue date Feb 22, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PROBE STATION CAPABLE OF MAINTAINING STABLE AND ACCURATE CONTACT TO...
- Publication number 20240230754
- Publication date Jul 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Kai CHAO
- G01 - MEASURING TESTING
Information Patent Application
PROBE STATION
- Publication number 20230393191
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Yi-Kai CHAO
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TESTING A SEMICONDUCTOR PACKAGE
- Publication number 20230384364
- Publication date Nov 30, 2023
- TSE CO., LTD.
- Min Cheol Kim
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING...
- Publication number 20230333157
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- G01 - MEASURING TESTING
Information Patent Application
TEST SYSTEM SUPPORT COMPONENT EXCHANGE SYSTEM AND METHOD
- Publication number 20230314499
- Publication date Oct 5, 2023
- ADVANTEST TEST SOLUTIONS, INC.
- Paul Ferrari
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE CONTROL DEVICE, ELECTRONIC COMPONENT HANDLING APPARATUS...
- Publication number 20230314500
- Publication date Oct 5, 2023
- Advantest Corporation
- Aritomo Kikuchi
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING CARRIER
- Publication number 20230307301
- Publication date Sep 28, 2023
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Calibration Arrangement and Corresponding Calibration Method, and C...
- Publication number 20230280396
- Publication date Sep 7, 2023
- ERS electronic GmbH
- Klemens Reitinger
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT HANDLING APPARATUS AND ELECTRONIC COMPONENT TE...
- Publication number 20230251304
- Publication date Aug 10, 2023
- Advantest Corporation
- Yuya Yamada
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TEST DEVICE AND METHOD OF DRIVING THE SAME
- Publication number 20230133368
- Publication date May 4, 2023
- SK HYNIX INC.
- Nack Hyun KIM
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION JIG AND BOARD INSPECTION APPARATUS INCLUDING THE SAME
- Publication number 20230117705
- Publication date Apr 20, 2023
- NIDEC-READ CORPORATION
- Kohei TSUMURA
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS FOR DEVICE HAVING FINE PITCH
- Publication number 20230030072
- Publication date Feb 2, 2023
- AMT CO., LTD.
- Du Chul KIM
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR RF BUILT-IN TEST SYSTEM
- Publication number 20220365133
- Publication date Nov 17, 2022
- Metawave Corporation
- Andrew John BONTHRON
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD HAVING POWER CONVERTER AND TEST SYSTEM INCLUDING THE SAME
- Publication number 20220341967
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- SEHOON PARK
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION SYSTEM
- Publication number 20220299564
- Publication date Sep 22, 2022
- MPI Corporation
- YI-HSUAN CHENG
- G01 - MEASURING TESTING
Information Patent Application
MICRO-CHANNEL HEATSINK WITH EMBEDDED HEATER AND DIAMOND HEAT SPREADER
- Publication number 20220196728
- Publication date Jun 23, 2022
- Intel Corporation
- Alexander I. Mamchik
- G01 - MEASURING TESTING
Information Patent Application
CONTACT AND SOCKET DEVICE FOR BURNING-IN AND TESTING SEMICONDUCTOR IC
- Publication number 20220196727
- Publication date Jun 23, 2022
- HICON CO., LTD.
- Dong Weon HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURN-IN BOARD SEATING
- Publication number 20220120808
- Publication date Apr 21, 2022
- Micro Control Company
- Aidan Michael Fawcett
- G05 - CONTROLLING REGULATING
Information Patent Application
HOUSING WITH ANTI-DISLODGE CAPABILITY
- Publication number 20220107357
- Publication date Apr 7, 2022
- Johnstech International Corporation
- Bob Chartrand
- G01 - MEASURING TESTING
Information Patent Application
MULTI-PROBER CHUCK ASSEMBLY AND CHANNEL
- Publication number 20220034960
- Publication date Feb 3, 2022
- KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Kyung Tae NAM
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE TEST SYSTEM AND SEMICONDUCTOR PACKAGE FABRICA...
- Publication number 20220026488
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- Jaehong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-AUTOMATIC PROBER
- Publication number 20210396785
- Publication date Dec 23, 2021
- QualiTau, Inc.
- Edward MCCLOUD
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING CARRIER
- Publication number 20210343608
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROBER TO FACILITATE TESTING OF A WAFER USING NANOSECOND PULSES
- Publication number 20210325451
- Publication date Oct 21, 2021
- Lumentum Operations LLC
- Yuanzhen ZHUANG
- G01 - MEASURING TESTING
Information Patent Application
SHIELDING FOR PROBING SYSTEM
- Publication number 20210311111
- Publication date Oct 7, 2021
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL TEST EQUIPMENT WITH HEATING FUNCTION
- Publication number 20210156907
- Publication date May 27, 2021
- MPI Corporation
- WEN PIN CHUANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING...
- Publication number 20210109152
- Publication date Apr 15, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Harry-Hak-Lay Chuang
- G11 - INFORMATION STORAGE
Information Patent Application
PROBER AND PROBE CARD PRECOOLING METHOD
- Publication number 20210048475
- Publication date Feb 18, 2021
- TOKYO ELECTRON LIMITED
- Jun Fujihara
- G01 - MEASURING TESTING
Information Patent Application
INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...
- Publication number 20210041495
- Publication date Feb 11, 2021
- Micron Technology, Inc.
- Tony M. Lindenberg
- G01 - MEASURING TESTING
Information Patent Application
Preventing and Detecting Integrated Circuit Theft and Counterfeiting
- Publication number 20210035923
- Publication date Feb 4, 2021
- NXP B.V.
- Jan-Peter Schat
- G06 - COMPUTING CALCULATING COUNTING

Holding devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for testing a semiconductor package

Semi-automatic prober

Method and apparatus for RF built-in test system for a beamforming...

Test device, change kit, and method of exchanging change kit

Burn-in board seating

Inspection jig and board inspection apparatus including the same

Probe station capable of maintaining stable and accurate contact to...

Semiconductor test device including temperature control module and...

Integrated circuit device die with wafer/package detection circuit

Test apparatus for semiconductor chips with fine-pitch bumps

Method for open-loop or closed-loop control of the temperature of a...

Substrate processing carrier

Jig for inspection of display panel

System and method for testing a semiconductor chip

Semiconductor wafer testing system and related method for improving...

Semiconductor wafer and method of probe testing

Multi-prober chuck assembly and channel

Housing with anti-dislodge capability

Contact and socket device for burning-in and testing semiconductor IC

Wafer inspection system

Apparatus and methods for testing semiconductor devices

Semiconductor package test system and semiconductor package fabrica...

Probe card having power converter and test system including the same

Semiconductor wafer testing system and related method for improving...

Over-the-air measurement system and over-the-air measurement method

Integrated-circuit-level test system and method

Inductive testing probe apparatus for testing semiconductor die and...

Optical test equipment with heating function

Shielding for probing system

Semiconductor wafer and method of probe testing

Patents Applicationslast 30 patents

PROBE STATION CAPABLE OF MAINTAINING STABLE AND ACCURATE CONTACT TO...

PROBE STATION

APPARATUS FOR TESTING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING...

TEST SYSTEM SUPPORT COMPONENT EXCHANGE SYSTEM AND METHOD

TEMPERATURE CONTROL DEVICE, ELECTRONIC COMPONENT HANDLING APPARATUS...

SUBSTRATE PROCESSING CARRIER

Calibration Arrangement and Corresponding Calibration Method, and C...

ELECTRONIC COMPONENT HANDLING APPARATUS AND ELECTRONIC COMPONENT TE...

SEMICONDUCTOR TEST DEVICE AND METHOD OF DRIVING THE SAME

INSPECTION JIG AND BOARD INSPECTION APPARATUS INCLUDING THE SAME

TEST APPARATUS FOR DEVICE HAVING FINE PITCH

METHOD AND APPARATUS FOR RF BUILT-IN TEST SYSTEM

PROBE CARD HAVING POWER CONVERTER AND TEST SYSTEM INCLUDING THE SAME

WAFER INSPECTION SYSTEM

MICRO-CHANNEL HEATSINK WITH EMBEDDED HEATER AND DIAMOND HEAT SPREADER

CONTACT AND SOCKET DEVICE FOR BURNING-IN AND TESTING SEMICONDUCTOR IC

BURN-IN BOARD SEATING

HOUSING WITH ANTI-DISLODGE CAPABILITY

MULTI-PROBER CHUCK ASSEMBLY AND CHANNEL

SEMICONDUCTOR PACKAGE TEST SYSTEM AND SEMICONDUCTOR PACKAGE FABRICA...

SEMI-AUTOMATIC PROBER

SUBSTRATE PROCESSING CARRIER

WAFER PROBER TO FACILITATE TESTING OF A WAFER USING NANOSECOND PULSES

SHIELDING FOR PROBING SYSTEM

OPTICAL TEST EQUIPMENT WITH HEATING FUNCTION

SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING...

PROBER AND PROBE CARD PRECOOLING METHOD

INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...

Preventing and Detecting Integrated Circuit Theft and Counterfeiting