Holding means

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H01L2224/78621

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78621Holding means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for bonding wire
- Patent number 12,154,883
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus, method for measuring opening amount of clam...
- Patent number 12,087,725
- Issue date Sep 10, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and alignment method
- Patent number 12,080,679
- Issue date Sep 3, 2024
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,428
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Jongeun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 11,581,285
- Issue date Feb 14, 2023
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 11,521,949
- Issue date Dec 6, 2022
- Samsung Electronics Co., Ltd.
- Jongeun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of bonding wire vertical interconnects
- Patent number 11,145,620
- Issue date Oct 12, 2021
- ASM Technology Singapore Pte. Ltd.
- Mow Huat Goh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for establishing a bonding connection and transducer therefor
- Patent number 11,007,601
- Issue date May 18, 2021
- Hesse GmbH
- Matthias Hunstig
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire clamp apparatus calibration method and wire bonding apparatus
- Patent number 11,004,822
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Clamping system, wire bonding machine, and method for bonding wires
- Patent number 10,770,423
- Issue date Sep 8, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control wire clamp and loop systems and methods
- Patent number 10,622,328
- Issue date Apr 14, 2020
- POLYGROUP MACAU LIMITED (BVI)
- Victor Hugo Ocegueda Gallaga
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Wire transfer apparatus of tabbing apparatus
- Patent number 10,424,688
- Issue date Sep 24, 2019
- ZEUS CO., LTD.
- Young Ik Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire setting apparatus of tabbing apparatus and wire setting method...
- Patent number 10,319,874
- Issue date Jun 11, 2019
- ZEUS CO., LTD.
- Hyung Chul Gong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 10,262,968
- Issue date Apr 16, 2019
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 10,153,247
- Issue date Dec 11, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bonding component
- Patent number 10,147,701
- Issue date Dec 4, 2018
- KYOCERA Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 9,978,713
- Issue date May 22, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,893,033
- Issue date Feb 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 9,865,560
- Issue date Jan 9, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 9,502,371
- Issue date Nov 22, 2016
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic wire tail adjustment system for wire bonders
- Patent number 9,502,374
- Issue date Nov 22, 2016
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond wire feed system and method therefor
- Patent number 9,397,066
- Issue date Jul 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for stud bump formation
- Patent number 9,021,682
- Issue date May 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
3448910
- Patent number 3,448,910
- Issue date Jun 10, 1969
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND ALIGNMENT METHOD
- Publication number 20240105673
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BONDING WIRE
- Publication number 20240038717
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE JIG AND TABBING APPARATUS INCLUDING THE SAME
- Publication number 20230378391
- Publication date Nov 23, 2023
- Hanwha Corporation
- Min Kyo Jung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...
- Publication number 20230170325
- Publication date Jun 1, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...
- Publication number 20220310552
- Publication date Sep 29, 2022
- SHINKAWA LTD.
- Toshihiko TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20220013491
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- JONGEUN LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...
- Publication number 20200388589
- Publication date Dec 10, 2020
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS
- Publication number 20200286855
- Publication date Sep 10, 2020
- ASM Technology Singapore Pte Ltd
- Mow Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20180229329
- Publication date Aug 16, 2018
- Samsung Electronics Co., Ltd.
- MYUNG IL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20180151532
- Publication date May 31, 2018
- KAIJO CORPORATION
- Riki JINDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20180090464
- Publication date Mar 29, 2018
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDING COMPONENT
- Publication number 20180019224
- Publication date Jan 18, 2018
- Kyocera Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL
- Publication number 20180005979
- Publication date Jan 4, 2018
- CIENA CORPORATION
- Simon Savard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL WIRE CLAMP AND LOOP SYSTEMS AND METHODS
- Publication number 20170358550
- Publication date Dec 14, 2017
- POLYGROUP MACAU LIMITED (BVI)
- Victor Hugo OCEGUEDA GALLAGA
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20170345787
- Publication date Nov 30, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES
- Publication number 20170301644
- Publication date Oct 19, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE SETTING APPARATUS OF TABBING APPARATUS AND WIRE SETTING METHOD...
- Publication number 20170229602
- Publication date Aug 10, 2017
- ZEUS CO., LTD.
- Hyung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20160351535
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WINDOW CLAMP
- Publication number 20160276305
- Publication date Sep 22, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20160225739
- Publication date Aug 4, 2016
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20160163673
- Publication date Jun 9, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE FEED SYSTEM AND METHOD THEREFOR
- Publication number 20160155718
- Publication date Jun 2, 2016
- ZHIJIE WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20150132888
- Publication date May 14, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20140138426
- Publication date May 22, 2014
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Stud Bump Formation and Apparatus for Performing the Same
- Publication number 20130167373
- Publication date Jul 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS
- Publication number 20130098877
- Publication date Apr 25, 2013
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE FEEDING APPARATUS FOR WIRE BONDERS
- Publication number 20120132695
- Publication date May 31, 2012
- Yue ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Holding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for bonding wire

Wire bonding apparatus, method for measuring opening amount of clam...

Bonding apparatus and alignment method

Wire bonding apparatus

Methods of detecting bonding between a bonding wire and a bonding l...

Wire bonding apparatus

Wire bonding apparatus and manufacturing method for semiconductor a...

Method of vertically vibrating a bonding arm

Method for calibrating wire clamp device

Formation of bonding wire vertical interconnects

Device for establishing a bonding connection and transducer therefor

Wire clamp apparatus calibration method and wire bonding apparatus

Electrically conductive pattern printer for downhole tools

Clamping system, wire bonding machine, and method for bonding wires

Bonding wire having a silver alloy core, wire bonding method using...

Control wire clamp and loop systems and methods

Wire transfer apparatus of tabbing apparatus

Wire setting apparatus of tabbing apparatus and wire setting method...

Wire bonding apparatus and wire bonding method

Methods of forming wire interconnect structures

Wedge bonding component

Method of manufacturing semiconductor device and wire bonding appar...

Off substrate kinking of bond wire

Methods of forming wire interconnect structures

Methods of forming wire interconnect structures

Automatic wire tail adjustment system for wire bonders

Bond wire feed system and method therefor

Apparatus for stud bump formation

3448910

Patents Applicationslast 30 patents

BONDING APPARATUS AND ALIGNMENT METHOD

APPARATUS FOR BONDING WIRE

WIRE JIG AND TABBING APPARATUS INCLUDING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...

WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...

WIRE BONDING APPARATUS

METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...

FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS

BONDING APPARATUS

WIRE BONDING APPARATUS

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

WEDGE BONDING COMPONENT

SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL

CONTROL WIRE CLAMP AND LOOP SYSTEMS AND METHODS

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES

WIRE SETTING APPARATUS OF TABBING APPARATUS AND WIRE SETTING METHOD...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

WINDOW CLAMP

OFF SUBSTRATE KINKING OF BOND WIRE

WIRE BONDING APPARATUS AND BONDING METHOD

BOND WIRE FEED SYSTEM AND METHOD THEREFOR

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

WIRE BONDING APPARATUS AND BONDING METHOD

Methods for Stud Bump Formation and Apparatus for Performing the Same

AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS

WIRE FEEDING APPARATUS FOR WIRE BONDERS