Hole or via having special cross-section

Industry

CPC
H05K2201/09854

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09854Hole or via having special cross-section

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 12,160,955
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Dong Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible printed circuit board including terminal, wiring module, a...
- Patent number 12,114,429
- Issue date Oct 8, 2024
- Autonetworks Technologies, Ltd.
- Hideo Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,089,325
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Jae Hwa Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for reducing an eddy current in a ground plane of a core...
- Patent number 12,078,662
- Issue date Sep 3, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Yannick Vuillermet
- G01 - MEASURING TESTING
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device for a vehicle
- Patent number 12,082,383
- Issue date Sep 3, 2024
- Aptiv Technologies AG
- Sebastian Melfried
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board
- Patent number 12,022,613
- Issue date Jun 25, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong Wan Ji
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silica-containing substrates with vias having an axially variable s...
- Patent number 11,972,993
- Issue date Apr 30, 2024
- Corning Incorporated
- Rachel Eileen Dahlberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,903,129
- Issue date Feb 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer copper bus bars with soldered through hole components
- Patent number 11,832,390
- Issue date Nov 28, 2023
- Rolls-Royce Corporation
- Shuai Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency circuit
- Patent number 11,812,546
- Issue date Nov 7, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,696,399
- Issue date Jul 4, 2023
- ZTE Corporation
- Changgang Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded substrate
- Patent number 11,638,351
- Issue date Apr 25, 2023
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,546,983
- Issue date Jan 3, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with electrically reliable bridge with sufficient...
- Patent number 11,483,927
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed traceless interconnect
- Patent number 11,482,802
- Issue date Oct 25, 2022
- Cisco Technology, Inc.
- Jason Visneski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with electrically conductive layer structures hav...
- Patent number 11,452,212
- Issue date Sep 20, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having heat-dissipation block and method of manufactu...
- Patent number 11,445,596
- Issue date Sep 13, 2022
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided and multilayer flexible printed circuit (FPC) substrat...
- Patent number 11,406,018
- Issue date Aug 2, 2022
- APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
- Sui-Ho Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer ceramic electronic component, method of producing a mul...
- Patent number 11,375,620
- Issue date Jun 28, 2022
- Taiyo Yuden Co., Ltd.
- Takashi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240397622
- Publication date Nov 28, 2024
- IBIDEN CO., LTD.
- Yoshiki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240381527
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Jae Hwa KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240373554
- Publication date Nov 7, 2024
- LG Innotek Co., Ltd.
- Jae Man BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Circuit Board, Circuit Board Assembly, and Electronic Device
- Publication number 20240306300
- Publication date Sep 12, 2024
- Honor Device Co., Ltd.
- Jianqiang Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT
- Publication number 20240260167
- Publication date Aug 1, 2024
- Canon Kabushiki Kaisha
- KOJI NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE HAVING THE CIRCUIT BOARD AND METHO...
- Publication number 20240244749
- Publication date Jul 18, 2024
- QUAN MEI TECHNOLOGY CO., LTD.
- Ching-Ming FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098896
- Publication date Mar 21, 2024
- PanelSemi Corporation
- Chin-Tang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
- Publication number 20230397333
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD
- Publication number 20230292437
- Publication date Sep 14, 2023
- JESS-LINK PRODUCTS CO., LTD.
- Yu-Liang LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER COPPER BUS BARS WITH SOLDERED THROUGH HOLE COMPONENTS
- Publication number 20230284387
- Publication date Sep 7, 2023
- Rolls-Royce Corporation
- Shuai Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL STRUCTURE WITH NON-LINEAR ELECTRICAL INTERCONNECT
- Publication number 20230254972
- Publication date Aug 10, 2023
- Georgia Tech Research Corporation
- Michael D. Grady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20230232532
- Publication date Jul 20, 2023
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230217592
- Publication date Jul 6, 2023
- LG Innotek Co., Ltd.
- Dong Sun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199959
- Publication date Jun 22, 2023
- LG Innotek Co., Ltd.
- Won Suk JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230141270
- Publication date May 11, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20230113153
- Publication date Apr 13, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Procedure for Miniaturing a Multi-layer PCB
- Publication number 20230087792
- Publication date Mar 23, 2023
- Veea Inc.
- Robert MIGLIORINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230030484
- Publication date Feb 2, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Yong Wan Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT
- Publication number 20220418094
- Publication date Dec 29, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji NITTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING TERMINAL, WIRING MODULE, A...
- Publication number 20220394856
- Publication date Dec 8, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220377874
- Publication date Nov 24, 2022
- Unimicron Technology Corp.
- Chin-Sheng WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220304147
- Publication date Sep 22, 2022
- LG Innotek Co., Ltd.
- Jae Hwa KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20220304152
- Publication date Sep 22, 2022
- ZTE Corporation
- Changgang YIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double-sided and Multilayer Flexible Printed Circuit (FPC) Substrat...
- Publication number 20220272840
- Publication date Aug 25, 2022
- Aplus Semiconductor Technologies Co., Ltd.
- Sui-Ho Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED TRACELESS INTERCONNECT
- Publication number 20220181807
- Publication date Jun 9, 2022
- Cisco Technology, Inc.
- Jason Visneski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device for a Vehicle
- Publication number 20220142019
- Publication date May 5, 2022
- Aptiv Technologies Limited
- Sebastian Melfried
- B60 - VEHICLES IN GENERAL
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20220087029
- Publication date Mar 17, 2022
- Ethertronics, Inc.
- Seung Hyuk Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MUL...
- Publication number 20210329786
- Publication date Oct 21, 2021
- Taiyo Yuden Co., Ltd.
- Takashi SASAKI
- H01 - BASIC ELECTRIC ELEMENTS

Hole or via having special cross-section

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Method and procedure for miniaturing a multi-layer PCB

Hermetic metallized via with improved reliability

Flexible printed circuit board including terminal, wiring module, a...

Printed circuit board

Techniques for reducing an eddy current in a ground plane of a core...

Through-hole electrode substrate

Electronic device for a vehicle

Printed circuit board

Component-embedded substrate

Silica-containing substrates with vias having an axially variable s...

Mating backplane for high speed, high density electrical connector

Printed circuit board

Sn—Bi and copper powder conductive paste in through hole of insulat...

Multilayer copper bus bars with soldered through hole components

High-frequency circuit

Method for manufacturing a circuit having a lamination layer using...

Circuit board

Method of fabricating a glass substrate with a plurality of vias

Component-embedded substrate

Mating backplane for high speed, high density electrical connector

Component carrier with electrically reliable bridge with sufficient...

High speed traceless interconnect

Component carrier with electrically conductive layer structures hav...

Circuit board having heat-dissipation block and method of manufactu...

Double-sided and multilayer flexible printed circuit (FPC) substrat...

Multi-layer ceramic electronic component, method of producing a mul...

Through-hole electrode substrate

Filling materials and methods of filling through holes of a substrate

Hermetic metallized via with improved reliability

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Flexible Circuit Board, Circuit Board Assembly, and Electronic Device

ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT

CIRCUIT BOARD, ELECTRONIC DEVICE HAVING THE CIRCUIT BOARD AND METHO...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

ELECTRONIC DEVICE

ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT

MULTI-LAYER PRINTED CIRCUIT BOARD

MULTILAYER COPPER BUS BARS WITH SOLDERED THROUGH HOLE COMPONENTS

ELECTRICAL STRUCTURE WITH NON-LINEAR ELECTRICAL INTERCONNECT

COMPONENT-EMBEDDED SUBSTRATE

CIRCUIT BOARD

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

Method and Procedure for Miniaturing a Multi-layer PCB

PRINTED CIRCUIT BOARD

HIGH-FREQUENCY CIRCUIT

FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING TERMINAL, WIRING MODULE, A...

METHOD OF MANUFACTURING CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

Double-sided and Multilayer Flexible Printed Circuit (FPC) Substrat...

HIGH SPEED TRACELESS INTERCONNECT

Electronic Device for a Vehicle

Method for Manufacturing a Circuit Having a Lamination Layer Using...

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MUL...