Horizontal boat type carrier whereby the substrates are vertically supported

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CPC
H01L21/67313

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67313Horizontal boat type carrier whereby the substrates are vertically supported

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of heat-treating silicon wafer using lateral heat treatment...
- Patent number 12,320,034
- Issue date Jun 3, 2025
- Sumco Corporation
- Yoshihiro Kuwano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 12,116,666
- Issue date Oct 15, 2024
- Kokusai Electric Corporation
- Daigi Kamimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing apparatus, display method, method of manufacturing semic...
- Patent number 12,080,149
- Issue date Sep 3, 2024
- Kokusai Electric Corporation
- Masanori Okuno
- G08 - SIGNALLING
Information Patent Grant
Substrate processing apparatus, substrate processing method and a s...
- Patent number 11,929,250
- Issue date Mar 12, 2024
- Kioxia Corporation
- Katsuhiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Development processing apparatus and development processing method
- Patent number 11,923,218
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Kouichirou Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,915,947
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Takumi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma boat for receiving wafers with regulated plasma deposition
- Patent number 11,873,559
- Issue date Jan 16, 2024
- Nippon Kornmeyer Carbon Group GmbH
- Torsten Kornmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer boat
- Patent number 11,869,786
- Issue date Jan 9, 2024
- ASM IP Holding B.V.
- Theodorus G. M. Oosterlaken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for degumming and inserting silicon wafers and method for pr...
- Patent number 11,749,538
- Issue date Sep 5, 2023
- HANGZHOU ZHONGWEI PHOTOELECTRIC TECHNOLOGY CO., LTD.
- Hong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support assemblies and components
- Patent number 11,699,602
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cassette for substrates of display devices
- Patent number 11,670,530
- Issue date Jun 6, 2023
- Samsung Display Co., Ltd.
- Youngdae Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor wafers longer than industry standard square
- Patent number 11,562,920
- Issue date Jan 24, 2023
- CUBICPV INC.
- Robertus Antonius Steeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal substrate boat
- Patent number 11,521,876
- Issue date Dec 6, 2022
- Tokyo Electron Limited
- Ioan Domsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,404,291
- Issue date Aug 2, 2022
- Kokusai Electric Corporation
- Hiroshi Hirotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-forming device
- Patent number 11,377,731
- Issue date Jul 5, 2022
- Murata Manufacturing Co., Ltd.
- Yasuhiro Chikaishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cassette for substrates of display devices
- Patent number 11,367,639
- Issue date Jun 21, 2022
- Samsung Display Co., Ltd.
- Youngdae Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate liquid treatment apparatus
- Patent number 11,309,194
- Issue date Apr 19, 2022
- Tokyo Electron Limited
- Koji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating element, substrate processing apparatus and method of manuf...
- Patent number 11,309,195
- Issue date Apr 19, 2022
- Kokusai Electric Corporation
- Yoshihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing meihod
- Patent number 11,232,959
- Issue date Jan 25, 2022
- Tokyo Electron Limited
- Takumi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming films on wafers separated by different distances
- Patent number 11,133,207
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Bin Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,104,997
- Issue date Aug 31, 2021
- Kokusai Electric Corporation
- Naoya Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate heating apparatus including heater under substrate suppor...
- Patent number 11,094,566
- Issue date Aug 17, 2021
- Tokyo Electron Limited
- Satoshi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing device
- Patent number 10,978,316
- Issue date Apr 13, 2021
- TOSHIBA MEMORY CORPORATION
- Satoshi Nakaoka
- B08 - CLEANING
Information Patent Grant
Wafer boat and treatment apparatus for wafers
- Patent number 10,867,825
- Issue date Dec 15, 2020
- Michael Klick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer conveying apparatus and wafer conveying method
- Patent number 10,854,488
- Issue date Dec 1, 2020
- TOSHIBA MEMORY CORPORATION
- Fumiki Aiso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stackable substrate carriers
- Patent number 10,770,323
- Issue date Sep 8, 2020
- Brooks Automation GmbH
- Lutz Rebstock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing boat design with pressure sensor
- Patent number 10,734,263
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bowing semiconductor wafers
- Patent number 10,720,351
- Issue date Jul 21, 2020
- SunPower Corporation
- Emmanuel Chua Abas
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Substrate carrier having drip edge configurations
- Patent number 10,665,486
- Issue date May 26, 2020
- BROOKS CCS, GmbH
- Lutz Rebstock
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 10,640,869
- Issue date May 5, 2020
- Kokusai Electric Corporation
- Kazuyuki Okuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WAFER CLEANING APPARATUS AND WAFER CLEANING SYSTEM INCLUDING THE SAME
- Publication number 20250226253
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Tae Woong UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
- Publication number 20240404854
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jaeho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS, DISPLAY METHOD, METHOD OF MANUFACTURING SEMIC...
- Publication number 20240378989
- Publication date Nov 14, 2024
- Kokusai Electric Corporation
- Masanori OKUNO
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20240105484
- Publication date Mar 28, 2024
- SCREEN Holdings Co., Ltd.
- Ichiro MITSUYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOAT AND PLATE FOR WAFER BOAT
- Publication number 20240038560
- Publication date Feb 1, 2024
- Hanwha Solutions Corporation
- Kyoungsup SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER FILM FRAME CARRIER
- Publication number 20230360940
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Jason A. Rye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HEAT-TREATING SILICON WAFER USING LATERAL HEAT TREATMENT...
- Publication number 20230212786
- Publication date Jul 6, 2023
- SUMCO CORPORATION
- Yoshihiro KUWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER BOAT FOR DIE PACKAGE FLUX CLEANING
- Publication number 20230101770
- Publication date Mar 30, 2023
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20230100702
- Publication date Mar 30, 2023
- Kokusai Electric Corporation
- Tatsuki JINDEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, INNER TUBE AND METHOD OF MANUFACTUR...
- Publication number 20230005760
- Publication date Jan 5, 2023
- Kokusai Electric Corporation
- Yusaku OKAJIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CASSETTE FOR SUBSTRATES OF DISPLAY DEVICES
- Publication number 20220392794
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Youngdae SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing Apparatus, Display Method, Method of Manufacturing Semic...
- Publication number 20220375331
- Publication date Nov 24, 2022
- Kokusai Electric Corporation
- Masanori OKUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220108898
- Publication date Apr 7, 2022
- TOKYO ELECTRON LIMITED
- Takumi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT ASSEMBLIES AND COMPONENTS
- Publication number 20220013373
- Publication date Jan 13, 2022
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA BOAT FOR RECEIVING WAFERS WITH REGULATED PLASMA DEPOSITION
- Publication number 20210363636
- Publication date Nov 25, 2021
- Nippon Kornmeyer Carbon Group GmbH
- Torsten KORNMEYER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVELOPMENT PROCESSING APPARATUS AND DEVELOPMENT PROCESSING METHOD
- Publication number 20210272826
- Publication date Sep 2, 2021
- TOKYO ELECTRON LIMITED
- Kouichirou TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus and Method of Manufacturing Semicond...
- Publication number 20200411335
- Publication date Dec 31, 2020
- Kokusai Electric Corporation
- Hiroshi HIROTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR WAFERS LONGER THAN INDUSTRY STANDARD SQUARE
- Publication number 20200251355
- Publication date Aug 6, 2020
- 1366 TECHNOLOGIES, INC.
- Robertus Antonius STEEMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER DEVICE
- Publication number 20200219742
- Publication date Jul 9, 2020
- KAWASAKI JUKOGYO KABUSHIKI KAISHA
- Takayuki FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus and Method of Manufacturing Semicond...
- Publication number 20200123659
- Publication date Apr 23, 2020
- Kokusai Electric Corporation
- Naoya MIYASHITA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER BOAT, FURNACE APPARATUS USING THE SAME, AND METHOD FOR FORMIN...
- Publication number 20200075372
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Bin YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR
- Publication number 20200035529
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plasma Spreading Apparatus And System, And Method Of Spreading Plas...
- Publication number 20200013591
- Publication date Jan 9, 2020
- YIELD ENGINEERING SYSTEMS, INC.
- WILLIAM MOFFAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTION DEVICE FOR HORIZONTAL BOAT PRODUCTION METHOD
- Publication number 20200002834
- Publication date Jan 2, 2020
- Hanergy New Material Technology Co., Ltd.
- RENGUI LEI
- C30 - CRYSTAL GROWTH
Information Patent Application
HEATING ELEMENT, SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUF...
- Publication number 20190378731
- Publication date Dec 12, 2019
- Kokusai Electric Corporation
- Yoshihiko YANAGISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, WAFER CONVEYING APPARATUS AN...
- Publication number 20190348314
- Publication date Nov 14, 2019
- Toshiba Memory Corporation
- Fumiki AISO
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS USIN...
- Publication number 20190295867
- Publication date Sep 26, 2019
- TOKYO ELECTRON LIMITED
- Satoshi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20190093222
- Publication date Mar 28, 2019
- Kokusai Electric Corporation
- Kazuyuki OKUDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, WAFER CONVEYING APPARATUS AN...
- Publication number 20190067066
- Publication date Feb 28, 2019
- Toshiba Memory Corporation
- Fumiki AISO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOWING SEMICONDUCTOR WAFERS
- Publication number 20180374730
- Publication date Dec 27, 2018
- SunPower Corporation
- Emmanuel Chua Abas
- H01 - BASIC ELECTRIC ELEMENTS

Horizontal boat type carrier whereby the substrates are vertically supported

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of heat-treating silicon wafer using lateral heat treatment...

Substrate processing apparatus and method of manufacturing semicond...

Processing apparatus, display method, method of manufacturing semic...

Substrate processing apparatus, substrate processing method and a s...

Development processing apparatus and development processing method

Substrate processing apparatus and substrate processing method

Plasma boat for receiving wafers with regulated plasma deposition

Wafer boat

Device for degumming and inserting silicon wafers and method for pr...

Substrate support assemblies and components

Cassette for substrates of display devices

Semi-conductor wafers longer than industry standard square

Horizontal substrate boat

Substrate processing apparatus and method of manufacturing semicond...

Film-forming device

Cassette for substrates of display devices

Substrate liquid treatment apparatus

Heating element, substrate processing apparatus and method of manuf...

Substrate processing apparatus and substrate processing meihod

Method for forming films on wafers separated by different distances

Substrate processing apparatus and method of manufacturing semicond...

Substrate heating apparatus including heater under substrate suppor...

Semiconductor processing device

Wafer boat and treatment apparatus for wafers

Wafer conveying apparatus and wafer conveying method

Stackable substrate carriers

Semiconductor processing boat design with pressure sensor

Bowing semiconductor wafers

Substrate carrier having drip edge configurations

Method of manufacturing semiconductor device, substrate processing...

Patents Applicationslast 30 patents

WAFER CLEANING APPARATUS AND WAFER CLEANING SYSTEM INCLUDING THE SAME

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...

PROCESSING APPARATUS, DISPLAY METHOD, METHOD OF MANUFACTURING SEMIC...

SUBSTRATE TREATING APPARATUS

WAFER BOAT AND PLATE FOR WAFER BOAT

WAFER FILM FRAME CARRIER

METHOD OF HEAT-TREATING SILICON WAFER USING LATERAL HEAT TREATMENT...

CARRIER BOAT FOR DIE PACKAGE FLUX CLEANING

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING APPARATUS, INNER TUBE AND METHOD OF MANUFACTUR...

CASSETTE FOR SUBSTRATES OF DISPLAY DEVICES

Processing Apparatus, Display Method, Method of Manufacturing Semic...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE SUPPORT ASSEMBLIES AND COMPONENTS

PLASMA BOAT FOR RECEIVING WAFERS WITH REGULATED PLASMA DEPOSITION

DEVELOPMENT PROCESSING APPARATUS AND DEVELOPMENT PROCESSING METHOD

Substrate Processing Apparatus and Method of Manufacturing Semicond...

SEMI-CONDUCTOR WAFERS LONGER THAN INDUSTRY STANDARD SQUARE

SUBSTRATE TRANSFER DEVICE

Substrate Processing Apparatus and Method of Manufacturing Semicond...

WAFER BOAT, FURNACE APPARATUS USING THE SAME, AND METHOD FOR FORMIN...

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR

Plasma Spreading Apparatus And System, And Method Of Spreading Plas...

REACTION DEVICE FOR HORIZONTAL BOAT PRODUCTION METHOD

HEATING ELEMENT, SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUF...

SEMICONDUCTOR MANUFACTURING APPARATUS, WAFER CONVEYING APPARATUS AN...

SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS USIN...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SEMICONDUCTOR MANUFACTURING APPARATUS, WAFER CONVEYING APPARATUS AN...

BOWING SEMICONDUCTOR WAFERS