Imager structures

Industry

CPC
H01L27/146

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/146Imager structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method, apparatus and system providing holographic layer as micro-l...
- Patent number 12,181,837
- Issue date Dec 31, 2024
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of making
- Patent number 12,183,753
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 12,183,756
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating semiconductor substrate
- Patent number 12,183,641
- Issue date Dec 31, 2024
- Shin-Etsu Handotai Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state image sensor and electronic equipment for improving ima...
- Patent number 12,184,999
- Issue date Dec 31, 2024
- Sony Group Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method, device and data structure for digital pixel sensors
- Patent number 12,185,010
- Issue date Dec 31, 2024
- BRILLNICS SINGAPORE PTE. LTD.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device and X-ray imaging device
- Patent number 12,183,749
- Issue date Dec 31, 2024
- SHARP KABUSHIKI KAISHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine passivation in a pixel sensor
- Patent number 12,183,751
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate
- Patent number 12,183,752
- Issue date Dec 31, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 12,183,760
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, back-side illuminated image sensor and met...
- Patent number 12,183,761
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetecting device with enhanced collection efficiency
- Patent number 12,183,765
- Issue date Dec 31, 2024
- Artilux, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal-oxide-semiconductor image sensor and method of...
- Patent number 12,183,767
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical filter and imaging device
- Patent number 12,181,696
- Issue date Dec 31, 2024
- AGC Inc.
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Solid-state imaging device
- Patent number 12,183,757
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus, photoelectric conversion system...
- Patent number 12,183,759
- Issue date Dec 31, 2024
- Canon Kabushiki Kaisha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 12,185,002
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element, stacked-type imaging element, and solid-state imag...
- Patent number 12,185,013
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array and image sensor including the same
- Patent number 12,183,750
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-photon avalanche diodes with deep trench isolation
- Patent number 12,183,754
- Issue date Dec 31, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, semiconductor device, and electronic device
- Patent number 12,183,758
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device
- Patent number 12,183,762
- Issue date Dec 31, 2024
- SK hynix Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and display device having the same
- Patent number 12,183,766
- Issue date Dec 31, 2024
- Samsung Display Co., Ltd.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device including sub-dams and multi-layered bank
- Patent number 12,185,576
- Issue date Dec 31, 2024
- Samsung Display Co., Ltd.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photographing optical lens assembly, image capturing device and ele...
- Patent number 12,181,643
- Issue date Dec 31, 2024
- LARGAN PRECISION CO., LTD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and electronic apparatus
- Patent number 12,183,755
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging apparatus and method
- Patent number 12,183,763
- Issue date Dec 31, 2024
- X-FAB Global Services GmbH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel pattern design to improve carrier transfer efficiency
- Patent number 12,183,764
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device
- Patent number 12,184,994
- Issue date Dec 31, 2024
- Guangzhou Tyrafos Semiconductor Tech. Co., Ltd.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid-state imaging device, pixel driving method, and electronic ap...
- Patent number 12,185,011
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RANGE IMAGING DEVICE AND RANGE IMAGING APPARATUS
- Publication number 20240426982
- Publication date Dec 26, 2024
- TOPPAN Holdings Inc.
- Yu OOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240431169
- Publication date Dec 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- Young Jin CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240429253
- Publication date Dec 26, 2024
- Sony Semiconductor Solutions Corporation
- TASUKU OGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240429254
- Publication date Dec 26, 2024
- Sony Semiconductor Solutions Corporation
- SHINICHIRO NOUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240429255
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...
- Publication number 20240429261
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ChunHao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIBAND FOCAL PLANE ARRAY (FPA) ENABLED BY THE COMBINATION OF MIC...
- Publication number 20240429262
- Publication date Dec 26, 2024
- SWIR Vision Systems Inc.
- Christopher William Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GEIGER-MODE FOCAL PLANE ARRAY HAVING INCREASED TOLERANCE TO OPTICAL...
- Publication number 20240429251
- Publication date Dec 26, 2024
- LG Innotek Co., Ltd.
- Mark Allen ITZLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A BACK SIDE FILM STACK AND PACKAGE STRUCTURES T...
- Publication number 20240429260
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Cheng Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FILTER
- Publication number 20240427068
- Publication date Dec 26, 2024
- AGC Inc.
- Kazuhiko SHIONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240429252
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURE FOR REDUCING CROSSTALK OF OPTICAL SENSOR AND ME...
- Publication number 20240429256
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Gwangho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALENS FOR NEAR INFRARED PHOTODETECTOR
- Publication number 20240429257
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING WITH DEEP TRENCH ISOLATION STRUCTURE
- Publication number 20240429258
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, A...
- Publication number 20240431130
- Publication date Dec 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Naoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240429259
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Junghyung PYO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240421167
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240421170
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- HAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...
- Publication number 20240421176
- Publication date Dec 19, 2024
- Florian Perminjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20240423001
- Publication date Dec 19, 2024
- Sony Semiconductor Solutions Corporation
- TADASHI IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
READOUT ARCHITECTURES FOR ERROR REDUCTION IN INDIRECT TIME-OF-FLIGH...
- Publication number 20240418836
- Publication date Dec 19, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Zheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, FOCUS ADJUSTMENT DEVICE, AND IMAGING DEVICE
- Publication number 20240421168
- Publication date Dec 19, 2024
- Nikon Corporation
- Sota NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD
- Publication number 20240421173
- Publication date Dec 19, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiyue SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240421174
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR ELEMENT
- Publication number 20240421175
- Publication date Dec 19, 2024
- Hamamatsu Photonics K.K.
- Takahide YANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
- Publication number 20240422452
- Publication date Dec 19, 2024
- Sony Semiconductor Solutions Corporation
- YUJI UESUGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240421171
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Taesub JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Imager structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method, apparatus and system providing holographic layer as micro-l...

Image sensor and method of making

Imaging device

Method for evaluating semiconductor substrate

Solid state image sensor and electronic equipment for improving ima...

System, method, device and data structure for digital pixel sensors

Photoelectric conversion device and X-ray imaging device

Fluorine passivation in a pixel sensor

Array substrate

Imaging device

Semiconductor structure, back-side illuminated image sensor and met...

Photodetecting device with enhanced collection efficiency

Complementary metal-oxide-semiconductor image sensor and method of...

Optical filter and imaging device

Solid-state imaging device

Photoelectric conversion apparatus, photoelectric conversion system...

Imaging device

Imaging element, stacked-type imaging element, and solid-state imag...

Pixel array and image sensor including the same

Single-photon avalanche diodes with deep trench isolation

Circuit board, semiconductor device, and electronic device

Image sensing device

Image sensor and display device having the same

Display device including sub-dams and multi-layered bank

Photographing optical lens assembly, image capturing device and ele...

Imaging device and electronic apparatus

Semiconductor imaging apparatus and method

Channel pattern design to improve carrier transfer efficiency

Image sensing device

Solid-state imaging device, pixel driving method, and electronic ap...

Patents Applicationslast 30 patents

RANGE IMAGING DEVICE AND RANGE IMAGING APPARATUS

DISPLAY APPARATUS

SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE

IMAGING DEVICE

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...

MULTIBAND FOCAL PLANE ARRAY (FPA) ENABLED BY THE COMBINATION OF MIC...

GEIGER-MODE FOCAL PLANE ARRAY HAVING INCREASED TOLERANCE TO OPTICAL...

METHODS FOR FORMING A BACK SIDE FILM STACK AND PACKAGE STRUCTURES T...

OPTICAL FILTER

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

SHIELDING STRUCTURE FOR REDUCING CROSSTALK OF OPTICAL SENSOR AND ME...

METALENS FOR NEAR INFRARED PHOTODETECTOR

GUARD RING WITH DEEP TRENCH ISOLATION STRUCTURE

LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, A...

IMAGE SENSOR

IMAGE SENSOR

IMAGE SENSOR

OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...

SOLID-STATE IMAGING DEVICE

READOUT ARCHITECTURES FOR ERROR REDUCTION IN INDIRECT TIME-OF-FLIGH...

IMAGE SENSOR, FOCUS ADJUSTMENT DEVICE, AND IMAGING DEVICE

RELIABLE SEMICONDUCTOR PACKAGES

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

OPTICAL SEMICONDUCTOR ELEMENT

SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS

IMAGE SENSOR

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...