Immersion coating

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H01L2224/11424

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11424Immersion coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,545,455
- Issue date Jan 3, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 11,158,605
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level molded PPGA (pad post grid array) for low cost package
- Patent number 11,094,669
- Issue date Aug 17, 2021
- Dialog Semiconductor B.V.
- Shou Cheng Eric Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,081,459
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
- Patent number 10,985,137
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
- Patent number 10,964,667
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,515,915
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,483,226
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,269,739
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable routing for packaging applications
- Patent number 10,262,939
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
- Patent number 10,163,856
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 10,037,973
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 9,935,067
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 9,799,631
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 9,793,187
- Issue date Oct 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive materials on semiconductor devices, a...
- Patent number 9,768,134
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation
- Patent number 9,748,190
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240304582
- Publication date Sep 12, 2024
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20230115986
- Publication date Apr 13, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20220246581
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20210242173
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20210193600
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20200381383
- Publication date Dec 3, 2020
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20200243469
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200035634
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20200035647
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20190326239
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...
- Publication number 20190244918
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20190115320
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20180211928
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20180047708
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20170179083
- Publication date Jun 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF
- Publication number 20140362550
- Publication date Dec 11, 2014
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20140353838
- Publication date Dec 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation
- Publication number 20140264834
- Publication date Sep 18, 2014
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH ELECTRICAL THROUGH-CONTACT AND METHOD FOR P...
- Publication number 20140084428
- Publication date Mar 27, 2014
- SIEMENS AKTIENGESELLSCHAFT
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING...
- Publication number 20140070385
- Publication date Mar 13, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
UBM Etching Methods for Eliminating Undercut
- Publication number 20130012014
- Publication date Jan 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...
- Publication number 20120326308
- Publication date Dec 27, 2012
- Maxim Integrated Products, Inc.
- REY ALVARADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120104602
- Publication date May 3, 2012
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS

Immersion coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Method of forming brass-coated metals in flip-chip redistribution l...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Brass-coated metals in flip-chip redistribution layers

System for processing semiconductor devices

Film scheme for bumping

Film scheme for bumping

Semiconductor packaging structure and method

Wafer level molded PPGA (pad post grid array) for low cost package

Semiconductor device

Stacked integrated circuit structure and method of forming

Stacked integrated circuit structure and method of forming

Methods of forming connector pad structures, interconnect structure...

Semiconductor devices and semiconductor devices including a redistr...

Film scheme for bumping

Methods of forming connector pad structures, interconnect structure...

Semiconductor device and method of forming the same

Semiconductor devices including conductive pillars

Methods of forming connector pad structures, interconnect structure...

Configurable routing for packaging applications

Stacked integrated circuit structure and method of forming

Tools and systems for processing semiconductor devices, and methods...

Method for manufacturing semiconductor package structure

Methods of forming connector pad structures, interconnect structure...

Semiconductor packaging structure and method

3D packages and methods for forming the same

Methods of forming conductive materials on semiconductor devices, a...

Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation

Systems, methods and devices for inter-substrate coupling

Patents Applicationslast 30 patents

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

Tools and Systems for Processing Semiconductor Devices, and Methods...

Stacked Integrated Circuit Structure and Method of Forming

Stacked Integrated Circuit Structure and Method of Forming

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...

FILM SCHEME FOR BUMPING

SEMICONDUCTOR DEVICE

Stacked Integrated Circuit Structure and Method of Forming

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...

Stacked Integrated Circuit Structure and Method of Forming

Tools and Systems for Processing Semiconductor Devices, and Methods...

Methods of Forming Connector Pad Structures, Interconnect Structure...

Semiconductor Packaging Structure and Method

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

Semiconductor Packaging Structure and Method

SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF

3D Packages and Methods for Forming the Same

Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation

INTEGRATED CIRCUIT WITH ELECTRICAL THROUGH-CONTACT AND METHOD FOR P...

FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING...

UBM Etching Methods for Eliminating Undercut

ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...

Doping Minor Elements into Metal Bumps

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...