Impedance adaptations of transmission lines by special lay-out of power planes

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CPC
H05K1/0253

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0253Impedance adaptations of transmission lines by special lay-out of power planes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reference metal layer for setting the impedance of metal contacts o...
- Patent number 11,800,637
- Issue date Oct 24, 2023
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,737,227
- Issue date Aug 22, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Setting the impedance of signal traces of a circuit board using a r...
- Patent number 11,632,857
- Issue date Apr 18, 2023
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and optical module
- Patent number 11,589,458
- Issue date Feb 21, 2023
- Hisense Broadband Multimedia Technologies Co., Ltd
- Xinnan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,546,983
- Issue date Jan 3, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing radio frequency interconnections
- Patent number 11,375,609
- Issue date Jun 28, 2022
- Raytheon Company
- Thomas V. Sikina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency filter and radio frequency module
- Patent number 11,342,643
- Issue date May 24, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Joong Jin Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reference metal layer for setting the impedance of metal contacts o...
- Patent number 11,297,713
- Issue date Apr 5, 2022
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,291,133
- Issue date Mar 29, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line and mounting structure thereof
- Patent number 11,291,109
- Issue date Mar 29, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Setting the impedance of signal traces of a circuit board using a r...
- Patent number 11,166,367
- Issue date Nov 2, 2021
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, system and method to promote the integrity of signal commun...
- Patent number 11,153,968
- Issue date Oct 19, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal device
- Patent number 11,083,079
- Issue date Aug 3, 2021
- Mitsubishi Electric Corporation
- Hidenori Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication module packaging
- Patent number 10,952,312
- Issue date Mar 16, 2021
- II-VI DELAWARE, INC.
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed board
- Patent number 10,912,187
- Issue date Feb 2, 2021
- Mitsubishi Electric Corporation
- Norihiko Akashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication apparatus
- Patent number 10,854,981
- Issue date Dec 1, 2020
- Sony Interactive Entertainment Inc.
- Masayuki Pak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 10,849,218
- Issue date Nov 24, 2020
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Setting the impedance of signal traces of a circuit board using a r...
- Patent number 10,849,220
- Issue date Nov 24, 2020
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SNAP-RF interconnections
- Patent number 10,849,219
- Issue date Nov 24, 2020
- Raytheon Company
- Thomas V. Sikina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication channel with tuning structure
- Patent number 10,771,291
- Issue date Sep 8, 2020
- Hewlett Packard Enterprise Development LP
- Melvin Benedict
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency filter and radio frequency module
- Patent number 10,763,563
- Issue date Sep 1, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Joong Jin Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential transmission line formed on a wiring substrate and hav...
- Patent number 10,757,802
- Issue date Aug 25, 2020
- Wistron Corporation
- Po-Lung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resource allocation for traffic-profile-dependent scheduling request
- Patent number 10,708,807
- Issue date Jul 7, 2020
- QUALCOMM Incorporated
- Chong Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board and conductive pattern structure
- Patent number 10,667,386
- Issue date May 26, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutual inductance suppressor for crosstalk immunity enhancement
- Patent number 10,652,999
- Issue date May 12, 2020
- Intel Corporation
- Khang Choong Yong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and optical transmission equipment
- Patent number 10,624,204
- Issue date Apr 14, 2020
- Lumentum Japan, Inc.
- Daisuke Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Skew-resistant multi-wire channel
- Patent number 10,573,998
- Issue date Feb 25, 2020
- KANDOU LABS, S.A.
- Amin Shokrollahi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board, memory module and memory system including th...
- Patent number 10,485,104
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Jong-Min Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,470,297
- Issue date Nov 5, 2019
- Sumitomo Electric Printed Circuits, Inc.
- Aya Takasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240073307
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Bumhee BAE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD, ANTENNA PACKAGE AND DISPLAY DEVICE
- Publication number 20230217584
- Publication date Jul 6, 2023
- DONGWOO FINE-CHEM CO., LTD.
- Byung Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SETTING THE IMPEDANCE OF SIGNAL TRACES OF A CIRCUIT BOARD USING A R...
- Publication number 20230217583
- Publication date Jul 6, 2023
- SUPER MICRO COMPUTER, INC.
- Manhtien V. PHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20230113153
- Publication date Apr 13, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CONNECTING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20230040596
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Sungwon PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REFERENCE METAL LAYER FOR SETTING THE IMPEDANCE OF METAL CONTACTS O...
- Publication number 20220183144
- Publication date Jun 9, 2022
- SUPER MICRO COMPUTER, INC.
- Manhtien V. PHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20220183177
- Publication date Jun 9, 2022
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SETTING THE IMPEDANCE OF SIGNAL TRACES OF A CIRCUIT BOARD USING A R...
- Publication number 20220007501
- Publication date Jan 6, 2022
- SUPER MICRO COMPUTER, INC.
- Manhtien V. PHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED MICROSTRIP WITH OPEN SLOT FOR HIGH SPEED SIGNAL TRACES
- Publication number 20210392742
- Publication date Dec 16, 2021
- INNOGRIT TECHNOLOGIES CO., LTD
- Shiann-Ming LIOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFERENCE METAL LAYER FOR SETTING THE IMPEDANCE OF METAL CONTACTS O...
- Publication number 20210235577
- Publication date Jul 29, 2021
- SUPER MICRO COMPUTER, INC.
- Manhtien V. PHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SETTING THE IMPEDANCE OF SIGNAL TRACES OF A CIRCUIT BOARD USING A R...
- Publication number 20210235578
- Publication date Jul 29, 2021
- SUPER MICRO COMPUTER, INC.
- Manhtien V. PHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20210076486
- Publication date Mar 11, 2021
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP-RF INTERCONNECTIONS
- Publication number 20210059043
- Publication date Feb 25, 2021
- Raytheon Company
- Thomas V. Sikina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE AND MOUNTING STRUCTURE THEREOF
- Publication number 20210029822
- Publication date Jan 28, 2021
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY FILTER AND RADIO FREQUENCY MODULE
- Publication number 20200358158
- Publication date Nov 12, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Joong Jin NAM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PRINTED BOARD
- Publication number 20200163201
- Publication date May 21, 2020
- Mitsubishi Electric Corporation
- Norihiko AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20200022252
- Publication date Jan 16, 2020
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIFFERENTIAL TRANSMISSION LINE AND WIRING SUBSTRATE
- Publication number 20190341664
- Publication date Nov 7, 2019
- Wistron Corporation
- Po-Lung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL DEVICE
- Publication number 20190306969
- Publication date Oct 3, 2019
- Mitsubishi Electric Corporation
- Hidenori ISHIBASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20190307009
- Publication date Oct 3, 2019
- Zhichao ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, MEMORY MODULE AND MEMORY SYSTEM INCLUDING TH...
- Publication number 20190191563
- Publication date Jun 20, 2019
- Samsung Electronics Co., Ltd.
- Jong-Min KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CONDUCTIVE PATTERN STRUCTURE
- Publication number 20190182950
- Publication date Jun 13, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Han KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20190082530
- Publication date Mar 14, 2019
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Aya TAKASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE AND OPTICAL TRANSMISSION EQUIPMENT
- Publication number 20190069395
- Publication date Feb 28, 2019
- OCLARO JAPAN, INC.
- Daisuke NOGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20180324941
- Publication date Nov 8, 2018
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE
- Publication number 20180316080
- Publication date Nov 1, 2018
- Murata Manufacturing Co., Ltd.
- Takahiro BABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE
- Publication number 20180123206
- Publication date May 3, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMITTING APPARATUS AND IMAGE FORMING APPARATUS
- Publication number 20180067438
- Publication date Mar 8, 2018
- FUJI XEROX CO., LTD
- Hirokazu TSUBOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY SIGNAL LINE, METHOD FOR PRODUCING SAME, AND ELECTRON...
- Publication number 20170273178
- Publication date Sep 21, 2017
- Murata Manufacturing Co., Ltd.
- Noboru KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD
- Publication number 20170257942
- Publication date Sep 7, 2017
- Mitsubishi Electric Corporation
- Shoji KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS

Impedance adaptations of transmission lines by special lay-out of power planes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mating backplane for high speed, high density electrical connector

Reference metal layer for setting the impedance of metal contacts o...

Selective ground flood around reduced land pad on package base laye...

Setting the impedance of signal traces of a circuit board using a r...

Circuit board and optical module

Mating backplane for high speed, high density electrical connector

Method of manufacturing radio frequency interconnections

Radio frequency filter and radio frequency module

Reference metal layer for setting the impedance of metal contacts o...

Selective ground flood around reduced land pad on package base laye...

Transmission line and mounting structure thereof

Setting the impedance of signal traces of a circuit board using a r...

Device, system and method to promote the integrity of signal commun...

Terminal device

Communication module packaging

Printed board

Communication apparatus

Mating backplane for high speed, high density electrical connector

Setting the impedance of signal traces of a circuit board using a r...

SNAP-RF interconnections

Communication channel with tuning structure

Radio frequency filter and radio frequency module

Differential transmission line formed on a wiring substrate and hav...

Resource allocation for traffic-profile-dependent scheduling request

Circuit board and conductive pattern structure

Mutual inductance suppressor for crosstalk immunity enhancement

Optical module and optical transmission equipment

Skew-resistant multi-wire channel

Printed circuit board, memory module and memory system including th...

Printed circuit board and electronic component

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME

CIRCUIT BOARD, ANTENNA PACKAGE AND DISPLAY DEVICE

SETTING THE IMPEDANCE OF SIGNAL TRACES OF A CIRCUIT BOARD USING A R...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

FLEXIBLE CONNECTING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME

REFERENCE METAL LAYER FOR SETTING THE IMPEDANCE OF METAL CONTACTS O...

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

SETTING THE IMPEDANCE OF SIGNAL TRACES OF A CIRCUIT BOARD USING A R...

EMBEDDED MICROSTRIP WITH OPEN SLOT FOR HIGH SPEED SIGNAL TRACES

REFERENCE METAL LAYER FOR SETTING THE IMPEDANCE OF METAL CONTACTS O...

SETTING THE IMPEDANCE OF SIGNAL TRACES OF A CIRCUIT BOARD USING A R...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

SNAP-RF INTERCONNECTIONS

TRANSMISSION LINE AND MOUNTING STRUCTURE THEREOF

RADIO FREQUENCY FILTER AND RADIO FREQUENCY MODULE

PRINTED BOARD

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

DIFFERENTIAL TRANSMISSION LINE AND WIRING SUBSTRATE

TERMINAL DEVICE

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

PRINTED CIRCUIT BOARD, MEMORY MODULE AND MEMORY SYSTEM INCLUDING TH...

CIRCUIT BOARD AND CONDUCTIVE PATTERN STRUCTURE

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

OPTICAL MODULE AND OPTICAL TRANSMISSION EQUIPMENT

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE

SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE

SIGNAL TRANSMITTING APPARATUS AND IMAGE FORMING APPARATUS

HIGH-FREQUENCY SIGNAL LINE, METHOD FOR PRODUCING SAME, AND ELECTRON...

MULTILAYER CIRCUIT BOARD